• Performs design-generation and reviews for new packages or platforms which includes component , sub-assembly and Package Outline for new platforms and new devices
• Ensures that the appropriate documents are in place for all new & existing design  changes in PDM
• Participate in Assembly & Test Design Rules, Design of Manufacturing (DFM) and Feasibility studies which includes mechanical stack-up tolerancing to ensure an design is optimised for cost and manufacturability
• Maintenance & revision of Design rules to ensure they are up to date taking into account Suppliers, equipment & Customer capabilities and requirements respectively.
• Knowledge of semiconductor Assembly/Test manufacturing and FEA simulation is an advantage
• Performs other functions as may be assigned from time to time by superior.

Job Specification

• Education/Knowledge: University graduate, preferably of an Engineering course with knowledge in mechanical design(2D &3D) Software
• Skills: Excellent Computer skills
• Work Experience: At least 5 to 8 years in same/related field, with AutoCAD experience especially in Semiconductor Packaging & Lead frame design