As a Senior Failure Analysis Engineer, you will play a key role in identifying and determining the root causes of semiconductor device failures. You will perform comprehensive failure analysis at the wafer, package, and die levels, working closely with cross-functional engineering teams to support product quality, reliability, and continuous improvement. This position requires strong technical expertise in failure analysis techniques, electrical fault isolation, and semiconductor manufacturing processes.
 

What You'll Do

• Perform failure analysis (FA) on wafer, package, and die-level semiconductor devices, including electrical verification, fault isolation, and physical root cause analysis.

• Prepare detailed FA reports with clear findings and recommendations to support corrective and preventive actions.

• Collaborate with design, test, product, process integration, and process engineering teams to understand failure mechanisms and resolve technical issues.

• Drive continuous improvement by identifying opportunities to develop new electrical fault isolation (EFA) techniques and enhance FA methodologies for better quality, turnaround time, and cost efficiency.

• Operate and maintain electrical fault isolation tools such as PEM/OBIRCH, Light-Induced Techniques (LIT), bench verification equipment, and sample preparation tools including backside polishers, FIB, ion milling, and RIE.

• Oversee fault isolation and physical failure analysis equipment to ensure high uptime and reliable operation.

• Support investigations related to product reliability, manufacturing yield, and customer quality issues.
   

What You'll Need

• Bachelor's Degree in Electrical or Electronic Engineering or a related field.

• Experience in semiconductor failure analysis involving discrete devices, power products, MOSFETs, logic, analog, and/or mixed-signal ICs.

• Hands-on experience with failure analysis and electrical fault isolation techniques using tools such as ATE, curve tracer, micro-probing, Light Emission Microscopy (LEM), PEM/OBIRCH, Liquid Crystal, CSAM, X-ray, FIB, SEM, and de-processing techniques.

• Strong understanding of digital and analog circuit operation, semiconductor device physics, IC fabrication processes, and failure analysis methodologies.

• Ability to interpret system-level schematics, IC schematics, and CMOS or bipolar IC layouts.

• Knowledge of discrete devices, MOSFET technologies, and semiconductor fabrication processes is an added advantage.

• Strong analytical and problem-solving skills with excellent communication and teamwork abilities.

• Ability to work effectively in a cross-functional engineering environment and manage multiple technical investigations simultaneously.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.