About this Semiconductor Test and Assembly Senior Engineering Manager 3 role at Northrop Grumman
Description
At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.The Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking an exceptionally talented, motivated, and creative Semiconductor Test and Assembly Senior Engineering Manager who will be accountable and responsible for technical, management, and customer activities associated with foundry semiconductor device assembly and test (wafer, die, package formats).
This position is located at our Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland - where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide) and providing leading edge technology development, such as Superconducting Electronics and Super-Lattice Castellated Field-Effect Transistors (SLCFET). Our devices enable Northrop Grumman’s ground-based radars, airborne radars, and space systems.
Join us for the chance to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term programs, and new programs targeting future military platforms. Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, and test and assembly of both ATL internal wafers and outsourced devices in multiple form factors.
Job Summary:
The Semiconductor Test and Assembly Senior Engineering Manager reports directly to the Director of ATL and serves as a manager of managers for all Test and Assembly engineering activities within the ATL Foundry. This leader works closely with numerous ATL groups (including Program Management, Product Engineering, Test and Assembly operations and planning, Wafer Process Integration), and customer/partner groups (including Design Engineering and Program groups). You will be responsible for:
- Defining technical direction and overseeing execution across semiconductor test and assembly engineering (wafer, die, and package levels).
- Managing staffing, employee tasking, performance, development, and succession planning.
- Leading project management, budget oversight, capital planning, and program/engineering interface activities.
- Ensuring on-time delivery, quality, and full compliance with customer and regulatory requirements.
- Driving continuous improvement of internal processes and procedures and defining and executing organizational growth strategies and goals.
- Strong collaboration with cross-functional partners to deliver product per requirements (schedule, cost, quality), including implementing efficient, effective approaches that reduce costs and increase productivity.
- Working with internal and external customers to shape the technology roadmap, identify and secure funding opportunities, and support sales efforts to achieve the Annual Operating Plan (AOP).
Basic Qualifications:
- Bachelor’s degree in Engineering or Science and a minimum of 10 years (Master’s degree with 6 years) related experience in semiconductor operations, manufacturing, engineering, and/or program management.
- Minimum of 10 years in relevant leadership or functional management roles.
- Strong technical background in microelectronics test (RFIC, digital & analog, mixed signal, high power RF amplifiers) and assembly (wafer dicing/sorting, die attach, wire bonding, lidding, reliability testing) engineering disciplines
- Collaborative leaders who set priorities effectively, communicate clearly, are resourceful, customer‑focused, and uphold ethics and integrity.
- Able to balance cost, schedule, and quality while fostering innovation and positive employee relations.
- Ability to clarify organizational priorities, manage external pressures, and execute complex project plans and initiatives.
- Skill in negotiating technical scope and schedules with technical and non‑technical collaborators.
- Strong business and financial acumen.
- Strong knowledge of MS Office (Word, Excel, PowerPoint, SharePoint) and Atlassian tools (JIRA, Confluence).
- U.S. Citizenship required
- Ability to obtain and maintain a Secret Clearance
Preferred Qualifications
- 12 years of relevant experience, Master or Ph.D. degree in Engineering or Science
- Advanced expertise in multiple areas of semiconductor device process and characterization technologies, especially those relevant to test and assembly.
- Advanced experience with manufacturing excellence, Lean/Six Sigma, and Agile methodologies.
- Experience capturing new business through cross‑functional collaboration.
- Effectiveness in managing customer relationships, prioritization, and delegation.
- Strong interpersonal, critical thinking, and presentation skills, with the ability to communicate across all organizational levels.
- Active Secret or Top-Secret Clearance.
