About this Lead Physical Design Engineer role at NXP Semiconductors
We are seeking a highly skilled and experienced Physical Design Engineer with strong fundamentals in physical design implementation to join our growing VLSI team. In this role, you will contribute to the implementation and signoff of complex SoC/IP blocks in advanced technology nodes, ensuring high-quality delivery aligned with NXP’s stringent PPA (Power, Performance, Area) and reliability standards.
Key Responsibilities
Execute block & Chip level physical design from synthesized netlist to GDSII:
Floorplanning and power grid design
Placement and optimization
Clock Tree Synthesis (CTS)
Routing and post-route optimization
Drive timing convergence across MCMM scenarios in collaboration with STA teams
Ensure design closure including:
Setup/hold timing closure
DRC/LVS clean signoff
IR drop and electromigration (EM) compliance
Debug and resolve:
Congestion issues
SI/crosstalk problems
Functional and physical ECOs
Collaborate cross-functionally with:
RTL/design teams to improve QoR
DFT teams for test readiness
Packaging and full-chip integration teams
Contribute to methodology improvements and automation through scripting
Follow and enforce NXP design methodologies, quality and reliability standards
Required Qualifications
Bachelor’s/Master’s degree in Electronics / Electrical Engineering / Microelectronics
8 - 10 years of experience in ASIC Physical Design
