Location: ​San Jose, CA​ - Hybrid

Our Team: 

​​Semtech’s Force Haptics Sensing Solutions Team is a team of talented and versatile engineers that enable our customers and partners to realize innovative Human Machine Interactions with industry leading MEMS Force Sensors and Haptics Systems. ​ 

Job Summary:    

In this role, you’ll be the team’s manufacturing and DFM lead, taking our force sensing and haptic actuator modules from working prototypes to reliable mass production. You’ll partner with our mechanical, electrical, and applications engineers, contract manufacturers, and OEM customers building next-generation laptops, mobile phones, automotive steering wheels and smart surfaces, wearables, and industrial displays. Our modules combine semiconductor packaging with mechanical assembly, so you’ll work across both: defining process flows, running DOEs, and solving the details that make a design build well at volume.

Responsibilities:

• Drive the transition of force sensing and haptic actuator modules from lab prototypes to mass production, including process flow development, DOEs, and production line bring-up.

• Execute DFM reviews and partner with design engineers to make concepts manufacturable at volume.

• Create 3D CAD models, mechanical drawings, and tolerance stack-ups for modules, fixtures, and tooling.

• Perform DFMEA/PFMEA and root-cause analysis, and support reliability and performance testing.

• Work with contract manufacturers and assembly partners on processes such as die attach, wire bonding, transfer molding, and coil-to-substrate assembly.

• Collaborate with business and engineering teams throughout the product development cycle to translate customer input into successful, cutting-edge products.

• Travel to manufacturing partners and customer sites (domestic and international) to support production line bring-up and provide technical support. 

Minimum Qualifications (Must Haves):

• 5+ years of experience designing electro-mechanical products and bringing them into production.
• Hands-on experience with fabrication and manufacturing methods such as CNC machining, injection or transfer molding, sheet metal stamping, 3D printing, and assembly techniques for consumer and industrial products.
• Strong 3D CAD modeling and mechanical drawing skills (e.g., SolidWorks, Creo, CATIA), including tolerance analysis.
• Demonstrated experience with DFM (design for manufacturing), plus working knowledge of DFMEA/PFMEA, DOE, and reliability testing.
• Self-starter who learns quickly and collaborates well across teams.
• Bachelor's degree in Mechanical Engineering or a related field (e.g., Manufacturing Engineering, Materials Science).

Preferred Qualifications (Strong Pluses):

• Semiconductor back-end or packaging experience (wire bonding, die attach, transfer molding, substrate-level assembly).
• High-volume manufacturing background in automotive, consumer electronics, or semiconductor, including APQP and SPC/Cpk.
• Experience with sensors and actuators, especially electromagnetic actuators.
• Working knowledge of electronics and circuits.
• FEA or electromagnetic simulation experience (e.g., COMSOL, ANSYS).
• Master's degree in Mechanical Engineering.

The intent of this job description is to describe the major duties and responsibilities performed by incumbents of this job. Incumbents may be required to perform job-related tasks other than those specifically included in this description. 

All duties and responsibilities are essential job functions and requirements and are subject to possible modification to reasonably accommodate individuals with disabilities. 

We are proud to be an EEO employer M/F/D/V. We maintain a drug-free workplace. 

A reasonable estimate of the pay range for this position is $94K - $140K.  There are several factors taken into consideration in determining base salary, including but not limited to: job-related qualifications, skills, education and experience, as well as job location and the value of other elements of an employee’s total compensation package. 

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