Über diese Staff Engineer – Process Development, Dry Etch, NAND Stelle bei Micron Technology
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Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Job / Role Summary
The Staff Engineer drives unit process development and module execution for advanced NAND dry etch, owning defined process levels and delivering robust process solutions that meet program, yield, and manufacturability targets. Success requires deep process fundamentals, disciplined DOE/SPC execution, and strong cross-functional influence to solve complex structural challenges and enable process transfer.
Main Responsibilities
Develop/optimize dry etch processes to meet physical/structural and electrical requirements for advanced NAND products.
Improve process capability by reducing variability and driving cost/process margin improvements.
Lead root cause / failure mode analysis for process/hardware limitations and drive vendor/supplier engagement for solutions.
Collaborate with Process Integration and adjacent process areas (Wet Etch, CVD/Diffusion, Metals, Lithography, CMP) to integrate solutions and resolve cross-module interactions.
Support pilot-line sustainment and process transfer to manufacturing sites as required.
Other Responsibilities
Contribute to fundamental research / innovation efforts that improve next-generation NAND scaling.
Mentor junior engineers and contribute to knowledge sharing within the dry etch team.
Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.
Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.
Candidate Profile
Minimum Qualifications / Experience
PhD ≥3 yrs, or Master’s ≥5 yrs, or Bachelor’s ≥7 yrs of relevant experience in
Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,
Demonstrated experience in dry etch process development and experimental design/data analysis.
Must-have technical skills
Dry etch fundamentals; understanding of plasma physics/chemistry and reactor behavior.
DOE/SPC and statistical analysis skills.
Must-have soft skills
Strong analytical problem-solving; ability to manage multiple technical priorities and deliver on commitments.
Cross-functional stakeholder management and communication.
Highly desirable / preferred
Python / data science basics or GenAI-enabled analysis/automation experience.
Embody Micron’s core values:
People – Respect, develop and empower others
Innovation – Drive continuous improvement and breakthrough thinking
Tenacity – Show grit and determination
Collaboration – Build trust and foster teamwork
Customer Focus – Deliver excellence and value
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
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