This role offers the opportunity to develop industry-leading semiconductor packaging solutions for automotive and industrial applications. As a member of the New Product Development and Operations team, the Senior Principal Packaging Engineer will define the package technology roadmap, lead advanced package design and selection, optimize solutions for performance, reliability, manufacturability, and cost, and manage OSAT partners for back-end assembly and packaging.

About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Essential Responsibilities:

• Design, develop, and implement packaging solutions that support business-unit product requirements and the package technology roadmap.
• Identify, evaluate, select package materials / BOM to meet internal quality and cost targets. 
• Evaluate and optimize assembly flows and materials to drive package cost reduction, while improving overall efficiency of the process. 
• Monitor packaging technology, materials, supplier capabilities, and industry best practices to benchmark competitiveness and identify opportunities for roadmap advancement.
• Develop and apply expertise across package families, including QFN, FCBGA, and WLCSP, as well as their associated assembly flows and manufacturing processes. 
• Identify, engage, and qualify primary and second-source suppliers to support business continuity.
• Procure competitive quotes from 3rd party OSAT assembly houses during product planning phase. 
• Conduct package co-simulation and feasibility studies—including electrical, thermal, and mechanical stress analyses—using industry-standard tools to verify that proposed packaging solutions meet product performance, reliability, and manufacturability requirements.
• Collaborate with cross-functional teams—including silicon design, reliability, package design, and assembly manufacturing—from initial concept and tape-out through qualification and high-volume production ramp. 
• Lead cross-functional debugging, root-cause analysis, corrective-action implementation, and verification for package and assembly yield issues during prototype development, qualification and reliability stress testing, and high-volume production.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

Required Qualifications:

• MS or BS EE, ME with minimum >15 yrs of experience in package design and different package technologies.
• Demonstrated expertise in package technologies and families, including flip-chip, WLCSP, and FCBGA, as well as advanced packaging architectures such as modules and chiplets.

• Hands-on experience using package- and board-level simulation tools such as Cadence, Synopsys, Ansys, and HFSS.

• Strong understanding of package assembly manufacturing flows and reliability standards. 
• Demonstrated experience leading technical engagements with foundry and OSAT partners for package development, qualification, and assembly production.
• Ability to lead effectively across global, cross-disciplinary teams and communicate directly with customers, suppliers, and internal partners.
• Ability to produce clear, comprehensive product requirements, package architecture specifications, and package design documentation for internal and external audiences.

Expected Salary Range

$171,000.00 - $296,000.00

The exact Salary will be determined based on qualifications, experience and location.