Job Details:

Job Description:

Job Description:

We are seeking a highly experienced Signal Integrity & Power Integrity (SI/PI) Engineer with 8+ years of industry experience to lead the design, verification, and optimization of high‑speed interconnects across silicon, IC package, and board‑level architectures.

In this role, you will deliver end‑to‑end SI/PI solutions for large and complex high‑speed platforms, including advanced IC packages, validation boards, and development kits. You will define and optimize the electrical design space for high‑speed SERDES, die‑to‑die interconnects, memory interfaces, and FPGA fabric, leveraging advanced 2D and 3D electrical modeling and extraction techniques. Responsibilities include defining robust simulation methodologies, conducting design‑of‑experiments (DOE) during early exploration phases, establishing SI/PI design rules to guide physical implementation, reviewing layouts, performing post‑layout simulations, and continuously improving electrical design margins.

You will apply deep expertise in high‑speed electrical modeling and simulation to influence package and platform design decisions, with a strong focus on debugging and resolving complex interconnect challenges.

This position requires close collaboration with SI/PI specialists, silicon architects, package engineers, and board design teams throughout product pathfinding and development cycles. By leveraging advanced simulation, modeling, and emerging AI‑driven methodologies, you will drive the optimization of FPGA electrical performance across IC packages and hardware platforms, ensuring industry‑leading signal quality, robust power delivery, and cost‑effective design trade‑offs.

Key Responsibilities

• Lead end‑to‑end signal and power integrity design for IC packages, validation platforms, and development kit hardware to achieve best‑in‑class electrical performance and reliability.

• Define and deploy best‑in‑class SI/PI simulation methodologies, leveraging advanced EDA tools and AI‑assisted techniques to improve accuracy, efficiency, and product quality.

• Perform detailed simulation, review, and trade‑off analysis of package and board designs to ensure scalable and robust electrical solutions.

• Diagnose and resolve complex system‑level SI/PI challenges spanning electrical, mechanical, thermal, and manufacturing constraints.

• Collaborate across silicon, package, and board design teams to define optimized electrical solutions that meet performance targets while minimizing product cost and maximizing customer competitiveness.

• Drive forward‑looking SI/PI technologies, including advanced and heterogeneous packaging solutions, to support and influence future product architectures.

Qualifications:

Qualifications:

• Master’s or PhD in Electrical Engineering, Computer Engineering, or a related field, with a strong foundation in electromagnetics, circuit analysis, and signal processing.

• 10+ years of hands‑on experience in Signal Integrity and Power Integrity engineering across silicon, package, and board‑level designs.

• Deep expertise in high‑speed digital interfaces, SI/PI fundamentals, and power delivery network behavior.

• Proficiency with industry‑standard simulation and modeling tools such as ANSYS HFSS, Synopsys HSPICE, Cadence Sigrity, Keysight ADS, or equivalent platforms.

• Strong analytical skills to interpret, correlate, and validate simulation, design, and measurement data.

• Proven ability to solve complex, multi‑domain SI/PI problems with a structured and methodical approach.

• Hands‑on experience with silicon/package/board layout and design tools (e.g., Mentor Graphics, Cadence Allegro).

• Scripting and automation experience using Python, MATLAB, or similar languages is highly desirable.

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