Job Details:

Job Description: 

About the Group
Manufacturing Development Customer Engineering (MDCE) is a new organization within Intel Foundry Technology Manufacturing focused on improving process capability for Intel's technology nodes from initial product qualification to high volume manufacturing with the vision of making technology ramp a competitive advantage for Intel foundry. This team is responsible for transferring new technologies into high-volume manufacturing, driving process optimization and continuous improvement, resolving complex yield and manufacturing issues, partnering closely with technology development and factory teams to ensure robust, predictable silicon delivery.

About the Role

MDCE Metals Deposition Engineer is responsible for enabling best-in-class process performance and manufacturability for advanced metals deposition modules across Intel 18A, Intel 3, and Intel 12nm technology nodes. This role sits at the intersection of Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, driving module readiness from early development through full HVM ramp and sustaining.

 

The Ideal Candidate Will Possess

• Leadership and Trust: Strong leadership, resourcefulness, and the ability to manage extremely sensitive information.
• Competency, Performance: A high performer with a track record of significant accomplishments.
• Experience Expertise: Cross-functional team leadership is a plus, significant expertise spanning multiple technology nodes and modules driving improvement to yield, performance, variation.
• Technical and Business Acumen: A combination of technical capability, business acumen, and executive expertise to drive results across multiple groups and disciplines.
• Communication Skills: Excellent written and verbal communication skills, with the ability to interpret and present technical information clearly to various audiences.
• Initiative and Perseverance: Strong self-initiative, persistence, and the ability to navigate ambiguity and drive clarity in key areas.
• Detail Orientation: Ability to gather, analyze, and interpret data to drive results.
• Pressure Handling: Willingness to handle high degrees of task and deadline pressure in a dynamic environment while remaining focused.
• Industry Knowledge: Deep knowledge of technology development and manufacturing strategies, products, processes, fab structure, and transfer methodology. Demonstrated ability to understand and interpret industry trends, create and drive strategies, work independently, simultaneously manage diverse and extensive assignments while remaining organized and productive.
• Cultural Change: Demonstrated results in driving organizational culture change through workplace of choice efforts.
  

Job Responsibilities Include but Are Not Limited To:

• Strategic Alignment and Customer-first Execution: Align organizational goals with technical vision, formulate technical strategies to deliver cutting-edge solutions, and demonstrate relentless execution to meet customer needs on time.
• Synthesis of Diverse Information: Ability to gather diverse inputs, uplevel to the right strategic response.
• Problem Solving: Own the resolution of technical challenges and integrate solutions across multiple groups (including technology development and high volume manufacturing) Demonstrated ability to perform data driven root cause analysis using structured problem-solving methods and common data/analytics tools.
• Collaboration: Work closely with direct and extended technology development (TD) and manufacturing (TFSM) members and Business Groups to achieve common goals.
• Stakeholder Engagement: Engage and interface with internal and external stakeholders, including Integration, Device, Yield, Defect Metrology, Quality and Reliability, and suppliers. Establish strong working relationships.
• Industry Trends: Stay updated on relevant industry direction setting technologies.
• Rapid Execution: Conceptualize strategies and put them into motion swiftly to meet challenging schedules.
• Team Management: Define goals for the team, remove roadblocks, and facilitate timely delivery of process solutions. Own the outcome, surface and resolve issues quickly.
• Work Together, in Person: Work together with team members in person to enable faster decision making and problem resolution

Qualifications:

The Minimum qualifications are required to be initially considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

 

Minimum Qualifications

• Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
• 6+ years of relevant experience in semiconductor manufacturing, process development, or technology development.
• 4+ years direct experience in metals deposition modules.
• Hands-on experience with thin film deposition technologies in at least one of the following areas: Frontend or middle-of-line, Backend metals / interconnect or other critical conductive or barrier/liner films supporting logic technologies.
• 3+ years of experience with one or more deposition technologies: PVD, CVD, and/or ALD for metals, conductive films, or barrier/liner stacks.
• Experience with integration and module interactions (e.g., Deposition with CMP, lithography, etch, clean) and impact of deposition on device performance and yield.

Preferred Qualifications:

• Ph.D. in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related engineering/science field.
• Experience in advanced technology nodes (e.g., 10nm class and below), ideally with exposure to Intel 18A, Intel 3, Intel 4/7, or comparable leading-edge foundry nodes.
• 5+ years of direct experience in a metals deposition module such as Contact/MOL metals (e.g., W, Co, Ru, liners/barriers), BEOL / Cu interconnect (e.g., Cu/Co/Ru/W, caps, barriers, seed), advanced liners/barriers/adhesion layers or conductive films in logic nodes.
• Experience with interconnect and MOL physics (RC performance, via/contact resistance, electromigration, reliability mechanisms) and their linkage to metals deposition and integration.
• Proven experience driving process development, optimization, and transfer to HVM.
• Experience supporting technology ramp or technology transfer from TD to HVM, including POR definition, process window characterization, and tool matching.
• Hands-on ownership of metals deposition equipment (e.g., multi-chamber PVD/CVD/ALD platforms) including qualification, matching, and release to production.
• Experience collaborating with equipment and materials suppliers on hardware changes, chamber design, or chemistry changes to improve yield, cost, or reliability.
• Cross-functional leadership experience including experience leading or contributing to cross-site and cross-functional task forces for yield excursions, defect reduction, or technology ramp and demonstrated ability to work closely with factory teams, module and technical program stakeholders to implement metals deposition solutions in HVM.

Join us at Intel to redefine possibilities in semiconductor technology and make a lasting impact. Apply now and bring your expertise to advance Intel's mission of creating world-changing technology.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location: 

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

 

 

Annual Salary Range for jobs which could be performed in the US: $133,800.00-255,200.00 USD

 

 

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

 

 

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.