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Über diese Senior RF PCB Layout Engineer Stelle bei Intel

Intel · Vor Ort · Taiwan, Taipei

Job Details:

Job Description: 

The Role and Impact We are seeking a skilled RF Design Engineer to join our team and contribute to the design and optimization of RF hardware for wireless communication products, including WiFi and Bluetooth applications. In this role, you will take ownership of PCB layouts and collaborate on Si-Package-Board co-design activities, ensuring the highest performance, cost efficiency, and quality of our products. Your work will play a crucial role in advancing RF technology for next-generation wireless solutions. Business group The Silicon and Platform Engineering Group (SPE) drives innovation by developing cutting-edge hardware and platform solutions that power Intel's advanced technologies. This team focuses on delivering high-quality designs and optimizations for wireless communication systems, supporting Intel's broader mission to lead technological progress across industries. Key Responsibilities - Design, develop, and optimize RF hardware, including PCB and package layouts, for wireless applications such as WiFi and Bluetooth. - Define floorplans, layouts, and physical designs for RF circuit architecture while adhering to design rules and manufacturing constraints. - Collaborate with cross-disciplinary teams to integrate silicon, package, and board-level designs as part of a co-design optimization process. - Take ownership of PCB layout from component placement to final output, supporting manufacturing and assembly processes. - Implement design rules specific to substrate/PCB technologies and ensure compliance with DRC and DFM requirements.

Qualifications:

Job Qualifications Minimum Qualifications - Bachelor's or BS degree in Electrical Engineering, Mechanical Engineering, or a related field, or equivalent experience per business needs. - 6+ years of experience in RF hardware development, including PCB and package layout. - Proficiency in Cadence Allegro with expertise in board layout, package layout, and package technology. - Solid understanding of RF fundamentals, including electromagnetic theory, communication theory, and RF system analysis. - Experience with circuit simulation tools and debugging techniques. - Familiarity with physical design for debugging and signal/power integrity analysis. - Knowledge of design rules, design for manufacturability (DFM), and design rule checks (DRC). Preferred Qualifications - Experience with RF physical design for wireless products, including Si-Package-Board co-design optimization. - Knowledge of mentor CAD tools, AutoCAD, and/or SolidWorks. - Proven ability to solve complex problems and work collaboratively within cross-functional teams. - Strong communication skills to effectively engage with multiple stakeholders and project teams. - Experience designing and optimizing circuits for wireless communication products to achieve maximum performance, quality, and cost efficiency. Join us to shape the future of wireless technology and make a meaningful impact in RF design innovation.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Taiwan)

Primary Location: 

Taiwan, Taipei

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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