• Utilize a wide variety of sample preparation techniques and imaging tools, including but not limited to chemical processing, die extraction, die physical polishing, RIE, MIP, X-Prep, cross-sectioning, wire bonding, repackaging, ion polishing, SEM/EDX, and backside IR.
• Operate precision milling/polishing systems and Reactive Ion Etching (RIE) systems for high-precision, site-specific sample preparation for package-level electrical FA (EFA) and die-level physical FA (PFA).
• Perform die extraction for various package types and execute layer-by-layer polishing at the die level.
• Conduct sample preparation through grinding/polishing, chemical processing, and repackaging techniques.
• Document analysis results thoroughly, including detailed observations, conclusions, and recommended corrective actions.
• Contribute to the development of new FA techniques, methodologies, and recipes, as well as tool evaluation projects to support emerging technologies.
• Demonstrate a strong understanding of semiconductor manufacturing processes.

Job Qualifications

• Bachelor’s or Master’s degree in Materials Science, Physics, Analytical Chemistry, or a related field.
• Proven experience (3+ years) in a semiconductor manufacturing or R&D environment; Wafer Fab experience is a plus.
• Hands-on experience with a broad range of FA sample preparation tools and techniques.
• Strong theoretical and practical knowledge of semiconductor device processing and packaging technologies.

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