About GlobalFoundries:

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com.

Summary of Role:

GlobalFoundries is a leading full-service semiconductor foundry with a global manufacturing footprint spanning three continents. GlobalFoundries' RF Technology Development Organization is looking for an integration engineer with industry experience in developing semiconductor technologies to join our RF team in Essex Junction, VT.

Essential Responsibilities      

●     Responsible for development, optimization, and qualification of FEOL and BEOL semiconductor devices and processes to meet performance, cost and yield requirements

●     Drive integration optimization using DOE methodologies, statistical analysis, and yield learning techniques.

●     Own and drive technical process problem solving.

●     Interact with internal & external customers and respond to technical queries.

●     Establish new technology design rules, test structures and test methodologies.

●     Establish integration checkpoints, performance metrics, and technical success criteria.

• Drive continuous innovation through the development of novel integration schemes, methodologies, and process improvements to enhance technology competitiveness.

●     Partner with unit process module engineers, failure analysis and characterization team to improve device performance and yield

• Mentor junior engineers and provide technical leadership across cross-functional development programs.

Other Responsibilities      

●     Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements

Required Qualifications:

●     Education: Master’s Degree or PhD in Electrical, Materials Science, or other relevant engineering or physical science discipline.

• B.S. + minimum of 8-10 years of relevant experience
• M.S. + minimum of 7 years of relevant experience
• Ph.D. + minimum of 5 years of relevant experience

●     Years of Experience: 5+ years in semiconductor processing

• Experience in Silicon or SiGe BiCMOS FEOL or BEOL processing and/or semiconductor process development
• Experience with Cadence or any other layout and simulation tool
• Strong data analysis skills
• Fluency in English Language – written & verbal
• Ability to relocate to Essex Junction, VT

Preferred Qualifications:

• 7+ Years of Experience in Silicon or SiGe BiCMOS or RFSOI FEOL or BEOL processing and/or semiconductor process development
• Experience of leading a device or process development project
• Understanding of semiconductor device physics, RF device behavior, and RF characterization techniques (e.g., S-parameters) is a plus.
• Experience in process optimization, yield enhancement, reliability qualification, and root-cause analysis methodologies.
• Self-motivated, resourceful, energetic, and adaptable, with a strong commitment to continuous learning and technical excellence.
• Excellent communication, leadership, and interpersonal skills, with the ability to influence and collaborate effectively across multidisciplinary teams.
• Experience interfacing with customers and presenting technical results to senior management and external stakeholders.
• Demonstrate ability to work well within a global matrixed team or environment with minimal supervision
• Outstanding communication skills - both written and verbal
• Strong organizational skills; demonstrated ability to manage multiple tasks simultaneously and able to react to shifting priorities to meet business needs
• Demonstrated ability to meet deadlines and commitments

Expected Salary Range

The exact Salary will be determined based on qualifications, experience and location.