National Centre for Advanced Integrated Photonics (NCAIP) is a Mid-Sized Centre funded by the National Research Foundation. The key objective is to support efforts to develop new photonics technologies that can be translated to the semiconductor industry.

Key Responsibilities:

• Fabricate integrated photonic devices end-to-end in a shared cleanroom across the group's semiconductor-laser, RF-photonics and heterogeneous-integration projects, including wet cleaning, wafer cleaving/dicing and facet preparation.

• Run core process modules: e-beam/DUV/i-line lithography and ICP-RIE/RIE etch; PECVD/LPCVD, sputtering, ALD and e-beam deposition, lift-off, metallization and annealing — with CD control under the Center Director's direction.

• Perform heterogeneous integration and bonding (plasma-activated/adhesive/eutectic wafer-die bonding, substrate thinning/CMP, advanced packaging).

Requirements:

• Master's degree (MSc/MEng) in Electrical and Electronic Engineering (EEE), Materials Science, Applied Physics, Optical/Photonic Engineering, or a related field.

• At least 2 years of relevant hands-on cleanroom and micro-/nano-fabrication experience with semiconductor, photonic or optoelectronic devices (project experience may also be considered).

• Practical experience with lithography and dry etching (e-beam/DUV/i-line, ICP-RIE/RIE) including CD control, and with thin-film deposition and metallization (PECVD/LPCVD, sputtering, ALD, e-beam evaporation, lift-off, annealing).

• Experience with optical/electrical device characterization and metrology (SEM, AFM, ellipsometry/ reflectometry, profilometry) and yield/ failure analysis.

• Proficient in MATLAB and/or Python with strong collaboration and communication skills, with a commitment to adhering to cleanroom safety regulations and standard operating procedures.

We regret to inform that only shortlisted candidates will be notified.