Job Summary:

Seeking a Process Engineer with 3-5 years of semiconductor industry experience in Wafer Saw (Dicing), Backgrind, or DBG processes.

Job Responsibility

• Define/optimize procedures to ensure smooth processing of production lots
• Develop and maintain process documentation and SOPs including operator training
• Lead root cause analysis for defects and yield losses
• Provide disposition on lots with quality issues
• Support new product introduction and process qualification
• Analyze production data to identify process improvements
• Collaborate with cross-functional teams on cost reduction and process improvement projects
• Perform change management including new material qualification

Qualification

• Bachelor's or master's degree in Engineering (Electronics, industrial, Chemical, Mechanical, or related field).
• 3–5 years of process engineering experience with standard backgrind and dicing before grinding (DBG) process.
• Strong data analysis and problem-solving skills.
• Experience with Statistical Process Control (SPC) and process validation (preferred).
• With good command of English language.
• Knowledge of Lean, Six Sigma, or continuous improvement tools (advantage).

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