The Role 

Entegris is seeking a highly motivated and results-driven Product Manager to lead advanced packaging product lines and strategic customer engagements in Asia, with a strong focus on Taiwan. This role combines ownership of existing product lines with leadership of new product development initiatives tied to key customers, including TSMC. The ideal candidate will bring strong technical expertise, semiconductor industry experience, and the ability to independently drive cross-functional programs in a fast-paced, global environment. Reporting to the Advanced packaging SBU lead located in the US 

Key Responsibilities 

Regional Advanced Packaging Leadership 

• Act as owner for advanced packaging projects across Asia with emphasis on Taiwan. 

• Serve as the primary interface with key customers in the region. 

• Identify market trends, customer needs, and growth opportunities. 

New Product Development (NPD) & Strategic Accounts 

• Lead NPD projects tied to TSMC, from concept through qualification and production ramp. 

• Drive cross-functional execution across engineering, operations, quality, and sales. 

• Translate customer requirements into product specifications and business cases. 

• Support stage-gate processes and new product introduction activities. 

Customer Engagement & Commercial Management 

• Build strong relationships with leading semiconductor customers, with emphasis on TSMC. 

• Drive pricing strategies, commercial negotiations, and account growth. 

• Provide customer insights to influence roadmap and investment decisions. 

Forecasting & Operations Alignment 

• Analyze customer forecasts and translate them into supply plans. 

• Work closely with operations to ensure on-time delivery and lead time commitments. 

• Support planning for ramps and demand variability. 

Product Line Ownership (HWS) 

• Take full ownership of the HWS product line, including transition of activities as production shifts to Kulim. 

• Manage all core product management activities including demand forecasting, pricing strategy, product lifecycle management, and quality issue resolution. 

• Ensure alignment between customer demand, operations capabilities, and business objectives. 

Qualifications 

• fluent / business-level English 

• Bachelor’s degree in Engineering (Mechanical, Materials, Plastics) or related discipline. 

• 5–10 years of experience in product management within the semiconductor industry. 

• Strong background in plastics or polymer-based products. 

• Experience managing full product lifecycle including NPI/NPD. 

• Strong business acumen including pricing and forecasting. 

• Ability to independently lead cross-functional teams. 

• Preference for candidates currently residing in Taiwan. 

Preferred Qualifications 

• Experience working with or strong connections to TSMC. 

• Experience with advanced packaging applications. 

• Familiarity with semiconductor manufacturing processes. 

• MBA or advanced degree is an advantage. 

Key Competencies 

• Strong leadership and ownership mindset 

• Ability to work independently and drive complex initiatives 

• Excellent communication and stakeholder management skills 

• Analytical thinking and data-driven decision making 

• Ability to work in global and multicultural environments