Über diese Dry Etch - SMTS, PD, Advance NAND Stelle bei Micron Technology
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
As a SMTS (Senior Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development Dry Etch team driving Advanced NAND and dry etch technology forward. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND. A SMTS Dry Etch Engineer is a senior individual contributor responsible for defining, developing, and transferring advanced dry etch processes for Micron NAND technologies. You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on state of the art and best in class dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to:
Leading Dry Etch technology and critical module development
The SMTS Dry Etch Engineer owns key NAND dry etch process levels and modules, translating technology challenges into executable roadmaps for N, N+1, and N+2 nodes.
Serve as the primary Dry Etch representative in program and module meetings for owned process areas.
Drive multi-functional execution across Technology Development, Process Integration and Manufacturing.
Develop and innovate dry etch processes to meet structural and electrical specifications for advanced NAND devices.
Lead First-Of-a-Kind (FOAK) dry etch process development, including recipe architecture, EPD strategy, control plans, and integration alignment.
Establish tool redundancy, run-to-run controls, and E3 monitors to improve process robustness and manufacturability.
Independently meet Process maturity , CSPEC, SPC, and qual criteria and timelines for owned process levels.
Provide clear technical status and risk updates to program stakeholders.
Collaborate with equipment and supplier teams to define and implement process-level hardware roadmaps.
Apply model-based and data-driven problem solving to resolve complex yield, defectivity, and integration issues.
Contribute towards Technical Leadership Program
Technical Leadership and Development
Act as a recognized technical expert within Dry Etch for owned process areas.
Mentor MTS engineers, interns, and early-career staff on technical problem solving, data analysis, and plasma etch fundamentals.
Participate in Micron patent programs, technical seminars, and knowledge-sharing forums.
Continuously develop technical breadth and depth in dry etch technology and adjacent process areas.
Solid presentation skills in executive meetings. Present process and technology roadmaps for current and future technology nodes.
Comfortable in influencing other process areas technology roadmaps.
Successful candidates for this position will have:
Demonstrated aptitude for research and development environment
12-15 years’ experience in dry etch process development in R&D (NAND, DRAM or Logic) transferring to manufacturing. Of which 7-10 years in memory products such as NAND, and DRAM
In-depth knowledge of plasma physics, plasma chemistry, transport or surface phenomena gained through experience and/or coursework
Demonstrated leadership in problem solving. Experience in managing technical projects
Understanding various types of plasma dry etch reactors (e.g., RF sources, chemistries)
Expertise in statistical process control and analysis
Experience in solving scalability problems of deep high aspect ratio silicon/dielectric etches with a fundamental understanding of advanced conventional and unconventional (tailored) pulsing schemes
Proven ability to independently drive technical execution and influence multi-functional teams.
Strong computer skills, including MS Office, and SAS software like JmP and similar
Candidates having AI developing and coding capability could be preferred.
Education
PhD (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical physics, Chemistry, Semiconductor engineering or relevant majors) with at least 12 years of relevant dry etch process development experience
BS/MS (Chemical, Mechanical, Electrical, Material Science, Physics, Chemical Physics, Chemistry, Semiconductor engineering or relevant majors) at least 15 years of relevant dry etch process development experience
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact [email protected]
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
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