About the Internship   

Our Summer internship provides an experience in the fast-paced and exciting semiconductor industry. Our interns will work alongside industry projects and gain valuable insights into our core engineering roles. This program is designed to grow and shape the industry leaders of tomorrow, offering a chance to learn, develop and build the skills needed for a successful career in the semiconductor field.    

What to expect  

This position is a paid internship. The duration will be in Hsin-Chu (Hybrid Model). Our internship program is for students who are actively enrolled in a full-time academic program. Recent graduates seeking employment after graduation and not returning to school should apply for our Early Career opportunities.   

Job's mission

We are seeking a highly motivated Engineering Intern to support research and analysis of advanced CMOS transistor electrical behavior, with a focus on how channel materials, interfacial layers (IL), and High‑k Metal Gate (HKMG) stacks influence device performance and reliability. 

This internship centers on deep technical literature review and knowledge synthesis. The intern will analyze published research to understand the physical mechanisms and material–device interactions that govern electrical characteristics in advanced logic devices. The results will be consolidated into a structured knowledge base to support ongoing and future device and process development activities. 

This role is well suited for PhD students with strong backgrounds in semiconductor physics, device engineering, or materials science who are interested in advanced device architectures and gate stack engineering. 

What You Will Do 

• Conduct a structured review of academic journals and conference publications related to advanced CMOS devices 
• Analyze how channel material properties (e.g., band structure, strain, surface roughness, scattering mechanisms) impact:  
  • Carrier mobility 
  • Drive current and leakage 
  • Device reliability 
• Study the role of interfacial layers (IL) as thickness scales to sub‑nanometer regimes, including:  
  • Material quality and defect characteristics 
  • Trade‑offs between scaling, performance, and long‑term stability 
• Evaluate the impact of High‑k Metal Gate (HKMG) stacks, including:  
  • High‑k dielectric and metal gate material choices 
  • Gate leakage behavior and threshold voltage (Vt) tuning 
  • Dipole formation, oxygen vacancy effects, and process variability 
• Integrate findings across channel, IL, and HKMG to describe cross‑layer interaction effects on device performance 
• Organize and document findings in a clear, structured, and reusable format for technical discussion 

Deliverables 

• A comprehensive written report describing how channel materials, IL properties, and HKMG stacks influence electrical performance and reliability in advanced CMOS devices 
• A summary presentation suitable for technical reviews 
• A curated and organized database of analyzed literature 

What You Will Gain 

• Hands‑on experience analyzing state‑of‑the‑art and beyond‑CMOS device technologies 
• Deep exposure to device physics and gate stack engineering challenges at advanced technology nodes 
• Experience in translating academic research into insights relevant for industrial R&D 
• Close interaction with experienced engineers and researchers in advanced device and materials development 

What we are looking for

• Currently pursuing a PhD degree in:  
  • Electrical Engineering 
  • Materials Science 
  • Applied Physics 
  • Solid‑State or Semiconductor‑related disciplines 
• Strong foundation in semiconductor physics and device engineering 
• Ability to read, analyze, and synthesize complex technical literature 
• Strong written communication skills in English 

What sets you apart

• Background in CMOS device physics, gate stack engineering, or reliability 
• Familiarity with concepts such as mobility degradation, interface traps, high‑k dielectrics, or metal gate work function engineering 
• Prior research experience in device, materials, or process technology 

Benefits  

• As an intern, you will gain hands-on experience by working on industry-related projects, providing you with valuable exposure to real-world processes and the opportunity to apply your skills in a professional setting.  

• Learn from the Best: Get the chance to work alongside world-class engineers and industry leaders who are shaping the future of technology—your personal dream team of innovators!  

• Step into the Future: Dive into one of the fastest-growing industries on the planet. From AI to 5G, you'll be right at the heart of the tech revolution.  

• Hands-On with Cutting-Edge Tech: Experience the latest and greatest in semiconductor design, testing, and fabrication. You’ll be working with the coolest tools and gadgets out there.  

• Network Like a Pro: Meet and connect with brilliant minds from all over the world, and make friendships that could open doors to amazing future career opportunities.  

• Make a Real Impact: Work on groundbreaking projects that power everything from smartphones to self-driving cars. Your contributions will help shape tomorrow’s world.  

• Challenge Your Mind: Sharpen your problem-solving skills as you take on real-world challenges, pushing boundaries and thinking outside the box.  

About the Internship   

Our Summer internship provides an  experience in the fast-paced and exciting semiconductor industry. Our interns will work alongside industry projects and gain valuable insights into our core engineering roles. This program is designed to grow and shape the industry leaders of tomorrow, offering a chance to learn, develop and build the skills needed for a successful career in the semiconductor field.    

What to expect  

This position is a paid internship. The duration will be in Hsin-Chu (Hybrid Model). Our internship program is for students who are actively enrolled in a full-time academic program. Recent graduates seeking employment after graduation and not returning to school should apply for our Early Career opportunities.   

Job's mission

We are seeking a highly motivated Engineering Intern to support early‑stage research and evaluation of Complementary FET (cFET) technology, an emerging advanced logic device architecture. 

This internship focuses on technology surveying, literature analysis, and knowledge synthesis. The intern will conduct a structured review of academic and publicly available industry research to develop a clear, well‑organized overview of the current cFET development landscape. The results will support technical discussions and future exploratory R&D work. 

This role is ideal for PhD students with a strong background in semiconductor devices, process integration, or related research fields who are interested in advanced logic technology beyond the state of the art. 

What You Will Do 

• Conduct a systematic review of cFET‑related information from:  
• Academic journals and conference proceedings 
• Patents and publicly available industry sources 
• Organize and synthesize fragmented information into a structured technical knowledge base 
• Identify key technology trends, including:  
• Device concepts and material approaches 
• Integration strategies and reported demonstrations 
• Performance targets and scalability considerations 
• Analyze and summarize major technical challenges and development bottlenecks identified in the literature 
• Perform a high‑level scan of early industry and ecosystem signals, such as patents or collaborations 
• Prepare clear documentation and presentations that distinguish evidence‑based insights from areas of uncertainty 

Deliverables 

• A consolidated and well‑structured technology review report on cFETs 
• Structured summaries of technical trends and key challenges 
• Presentation materials suitable for technical discussions and evaluations 

What You Will Gain 

• Hands‑on experience evaluating an early‑stage, next‑generation semiconductor technology 
• Exposure to how advanced device concepts are assessed prior to major R&D investment 
• Opportunity to develop strong skills in technical analysis, literature review, and technology scouting 
• Experience working closely with senior engineers and researchers in advanced technology development 

What we are looking for

• Currently pursuing a PhD degree in Electrical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related field 
• Fundamental understanding of semiconductor devices and/or process integration 
• Strong ability to read, analyze, and synthesize technical literature 
• Solid written communication skills in English 

What sets you apart

• Familiarity with advanced logic device architectures (e.g., GAA, 3D integration, CFET/cFET concepts) 
• Prior experience with research projects, literature surveys, or patent reviews 
• Strong analytical mindset and ability to organize complex technical information 

About the Internship   

Our Summer internship provides an  experience in the fast-paced and exciting semiconductor industry. Our interns will work alongside industry projects and gain valuable insights into our core engineering roles. This program is designed to grow and shape the industry leaders of tomorrow, offering a chance to learn, develop and build the skills needed for a successful career in the semiconductor field.    

What to expect  

This position is a paid internship. The duration will be in Hsin-Chu (Hybrid Model). Our internship program is for students who are actively enrolled in a full-time academic program. Recent graduates seeking employment after graduation and not returning to school should apply for our Early Career opportunities.   

Job's mission

We are seeking a highly motivated Engineering Intern to support early‑stage research and evaluation of advanced package technology.

This internship focuses on technology surveying, literature analysis, and knowledge synthesis. The intern will conduct a structured review of academic and publicly available industry research to develop a clear, well‑organized overview of the current Package development landscape. The results will support technical discussions and future exploratory R&D work.

This role is ideal for PhD students with a strong background in semiconductor package process, like 3DIC or 2.5D integration, or related research fields who are interested in advanced package beyond the state of the art.

What you will be working on

• Conduct a systematic review of package‑related information from: 
• Academic journals and conference proceedings
• Patents and publicly available industry sources
• Organize and synthesize fragmented information into a structured technical knowledge base
• Identify key technological trends, including: 
• Process concepts and material approaches
• Integration strategies and reported demonstrations
• Performance targets and extendibility considerations
• Analyze and summarize major technical challenges and development bottlenecks identified in literature
• Perform a high‑level scan of early industry and ecosystem signals, such as patents or collaborations
• Prepare clear documentation and presentations that distinguish evidence‑based insights from areas of uncertainty

Deliverables

• A consolidated and well‑structured technology review report on 3DIC
• Structured summaries of technical trends and key challenges
• Presentation materials suitable for technical discussions and evaluations

What You Will Gain

• Hands‑on experience evaluating an early‑stage, next‑generation semiconductor package technology
• Exposure to how advanced technology concepts are assessed prior to major R&D investment
• Opportunity to develop strong skills in technical analysis, literature review, and technology scouting
• Experience working closely with senior engineers and researchers in advanced technology development

What we are looking for

• Currently pursuing a PhD degree in Electrical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related field
• Fundamental understanding of semiconductor package and/or process integration
• Strong ability to read, analyze, and synthesize technical literature
• Solid written communication skills in English 

As a Senior Field Service Engineer at ASM, you’ll have the opportunities to get involved in a wider scope of work compared to our larger competitors. While the workload is challenging, you are given the independence and autonomy to perform at your peak. This work requires thinking “outside of the box” in an innovative manner, so you must have the ability to collaborate with others to deliver creative solutions, work well under pressure and pay great attention to small details.

Shift work/On call working mode will be required.
Valid driver's license is required for this role.
Domestic and International travel of at least 25%~50% will be required for this role.
The actual job grade will be determined based on skill set and experience.

Responsibilities:

• Evaluate, understand and identify current customer needs, while also anticipating future needs and building long-term sustainable relationship and solutions.
• The ability to develop action plans for problem resolution and present to internal and external customers.
• Ensure communication channels, via phone, email, and presentation, etc. are able to facilitate efficient and consistent customer follow-up.
• Develop improvements for processes, hardware and software for continuous improvement of ASM equipment / business operations. Coach / mentor lower level FSE’s to higher level skill sets.
• Projects manage new evaluations and present to client, you will be responsible for ensuring the success of the project.
• Leading new site start-up and planning/risk assessment for readiness/execution successfully to get customer recognition and satisfaction.
• Define project scope and resource planning together with BU, escalate to Manager for resource gap.
• Capable of working completely independent of supervision on highly complex problems while meeting project/task timelines, objectives and goals.
• Support CS EE /Sales/BU as one team to success site base operation/service.

Qualifications:

• Ability to work in a team environment with tight deadlines and multiple priorities.
• Bachelor Degree or above in an Engineering discipline.
• 8+ years above of technical experience and deep business perspective preferably in the Semiconductor / Capital Equipment / CVD related industry. (EPI, CVD or PECVD or ALD relevant experience is a plus).
• Basic troubleshooting techniques in repairing complex microprocessor controlled electromechanical systems
• Strong positive attitude with excellent customer service skills
• Clear and concise both English/Mandarin verbal and written communications
• Knowledge of structured problem solving techniques
• Ability to work in a team environment, independently and/or with limited supervision
• Ability to handle multiple tasks

ASM is recruiting for Field Process Engineer in our ALD/EPI/PEALD/CVD business function located in Hsinchu, Taiwan. As part of a team, you'll provide process support / trouble shooting at client site. As a key driver of business success, you will play a vital role in strengthening and enabling business success through developing and improving processes run on our tool sets at customer sites. As a Field Process Engineer you will be responsible to understand our customers’ needs, and provide process support and subsequent implementation with alignment with BUs to ensure we deliver service and value to meet even exceed customers’ expectation.
 

Responsibilities:

• Evaluate, understand and identify current customer needs & new opportunities, while also anticipating future needs and building long-term sustainable relationship and solutions.
• Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders.
• Drive and manage new product penetration & installation and subsequent process development.
• Define project scope and resource planning together with BU, escalate to Manager for resource gap.
• Drive continuous improvement of the customer experience through team, process and support tool development.
• Support CS EE /Sales/BU as one team to success new application penetration, site base operation and service.

Qualifications:

• Ability to work in a team environment with tight deadlines and multiple priorities.
• Master Degree or above in an Engineering discipline.
• 0~3 years or above of technical experience and deep business perspective preferably in the Semiconductor / Capital Equipment /  related industry. (CVD, ALD, EPI, or PECVD any relevant experience is a plus).
• Proven success in building collaborative partnerships with customers and internal organizations
• Strong industry experience managing teams that support complex instrumentation, applications and informatics by phone and at customer locations
• Clear and concise both English/Mandarin verbal and written communications

ASM is recruiting for Snr Engineer, Field Process, NPI in our ALD/EPI/PEALD/CVD business function located in Hsinchu, Taiwan. As part of a team, you'll provide process support / trouble shooting at client site. As a key driver of business success, you will play a vital role in strengthening and enabling business success through developing and improving processes run on our tool sets at customer sites. As a Field Process Engineer you will be responsible to understand our customers’ needs, and provide process support and subsequent implementation with alignment with BUs to ensure we deliver service and value to meet even exceed customers’ expectation.
 

Responsibilities:

• Evaluate, understand and identify current customer needs & new opportunities, while also anticipating future needs and building long-term sustainable relationship and solutions.
• Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders.
• Drive and manage new product penetration & installation and subsequent process development.
• Define project scope and resource planning together with BU, escalate to Manager for resource gap.
• Drive continuous improvement of the customer experience through team, process and support tool development.
• Support CS EE /Sales/BU as one team to success new application penetration, site base operation and service.

Qualifications:

• Ability to work in a team environment with tight deadlines and multiple priorities.
• Master Degree or above in an Engineering discipline.
• At least 6+ years or above of technical experience and deep business perspective preferably in the Semiconductor / Capital Equipment /  related industry. (CVD, ALD, EPI, or PECVD any relevant experience is a plus).
• Proven success in building collaborative partnerships with customers and internal organizations
• Strong industry experience managing teams that support complex instrumentation, applications and informatics by phone and at customer locations
• Clear and concise both English/Mandarin verbal and written communications