About the Role

As a member of our Hardware team, you will lead the design and development of Verkada products. Verkada’s Hardware Engineers own all aspects of electrical engineering and validation, working directly with our JDM partners to ship cutting-edge products. This is a full-time, in-person role based in our Taipei, Taiwan office.

What You'll Do

• Lead electrical engineering for new products from initial proof of concept through to mass production.  
• Collaborate with an international team of hardware engineers, mechanical engineers, industrial designers, and product managers to develop new products.  
• Own component selection, schematic and layout development based on the architecture you have created.  
• Quickly prototype new product concepts for mock-up builds and proof of concept studies.  Get hands-on with board bring-up, debug, testing and validation.  
• Build and execute robust test plans by leveraging resources at our JDM/ODM partners.  Lead root cause analysis efforts related to EMC, surge, thermal, RF testing and more.  
• Lead JDM teams to efficiently and effectively complete programs.  Work closely with manufacturing partners to steer hardware designs through design and validation builds (EVT, DVT, PVT) and into mass production. 
• Work on-site with manufacturing partners to review designs, run experiments, and troubleshoot issues in our factories. 
• Lead compliance / regulatory efforts for relevant hardware products.

What You Bring

• BS in Electrical Engineering.  
• Strong technical knowledge of electrical design that meet compliance requirements, validation and manufacturing.  
• 8+ years of experience in developing and manufacturing new electronics products.  
• Exposure to EMC & safety related standards
• Experience with analog audio circuitry 
• Excellent communication skills.  Fluency in English and Mandarin.
• Flexible and adaptive in a fast-paced startup environment.
• Experience working with US teams & an international supply chain.
• Ability to travel internationally up to 20%.

Taiwan Employee Benefits

Verkada is committed to fostering a workplace environment that prioritizes the holistic health and wellbeing of our employees and their families by offering comprehensive wellness perks, benefits, and resources. Our benefits and perks programs include, but are not limited to:

• Private medical insurance by Nan Shan Life Insurance
• Permanent employees of Verkada Taiwan are eligible for full participation to the group insurance scheme, including accidental death and dismemberment, critical illness, accident medical reimbursement, hospital and surgical, and cancer indemnity cover
• Spouses and immediate dependents are eligible to participate in the scheme for accident medical reimbursement, hospital and surgical, and cancer indemnity cover
• Paid parental leave policy & fertility benefits
• Time off to relax and recharge through our paid holidays, firmwide extended holidays, flexible PTO and personal sick time
• Professional development stipend
• Wellness/fitness benefits
• Meal stipend
• Commuter benefits

Additional Information

• You must be independently authorized to work in Taiwan. We are unable to sponsor or take over sponsorship of an employment visa for this role, at this time.

What You'll Do

• Drive new products from initial proof of concept through to mass production
• Generate mechanical solutions for a wide variety of product requirements relevant to enterprise hardware (mounting, sealing, environmental resistance, thermals, tamper resistance, audio systems etc.)
• Collaborate with our Electrical Engineering team to integrate PCBAs, sensors, interconnects, and other electro-mechanical elements into your designs
• Collaborate with our Industrial Design team to explore, prototype, test new product concepts, and finalize product form and CMF
• Work with mechanical vendors to dial in DFM/DFA, then quote & kick-off parts at prototype and production quantities
• Own tooling release, bring up, and validation for a broad variety of parts & processes
• Develop, manage & execute mechanical reliability test plans and various DoEs
• Assist with failure analysis and root cause analysis; troubleshoot, iterate, and validate quickly  
• Work closely with our JDM and CM partners to steer your product concepts through validation builds (EVT, DVT, PVT) & into mass production
• Drive on-site factory troubleshooting, assembly line bring-up, and root cause analysis
• Outdoor product design experience (IP66/67, IK08/10)

What You'll Bring

• B.S. in Mechanical Engineering or related fields
• Excellent written and verbal English & Mandarin communication skills
• A clear track record of designing and manufacturing enterprise or consumer electronic products (8+ years of experience)
• Mastery of 3D CAD software
• Experience getting hands-on with building & testing hardware
• Ability to frequently visit vendors throughout Taiwan and Southeast Asia 
• Experience working with part vendors on DFM, tooling bring up and validation
• Passion for designing aesthetically pleasing but easy to use hardware

About Graphcore 

At Graphcore, we’re building the future of AI compute.We’re a team of semiconductor, software and AI experts, with deep experience in creating the complete AI compute stack - from silicon and software to infrastructure at datacenter scale.As part of the SoftBank Group, backed by significant long-term investment, we are delivering key technology into the fast-growing SoftBank AI ecosystem.To meet the vast and exciting AI opportunity, Graphcore is expanding its teams around the world.We are bringing together the brightest minds to solve the toughest problems, in a place where everyone has the opportunity to make an impact on the company, our products and the future of artificial intelligence.

Job Summary

We are seeking a Product Safety Engineer to support safety design, validation, and certification of high-performance server platforms, including systems operating with high-voltage DC power and advanced liquid-cooling architectures.

This role involves close collaboration with electrical, mechanical, thermal, and manufacturing teams to ensure products meet applicable safety standards and are prepared for global certification.

Required skills: 

• Contribute to safety architecture and compliance for server systems, including HVDC power shelves, PDUs, and liquid-cooling subsystems
• Apply IEC 62368-1 requirements in design reviews, including creepage and clearance, insulation coordination, grounding, and protective measures
• Review schematics, PCB layouts, and mechanical designs to identify potential electrical, thermal, and fire hazards
• Support hazard-based safety engineering (HBSE) assessments, including evaluation of single-fault conditions and abnormal operation scenarios
• Plan and execute safety validation testing, such as dielectric strength (HiPot), insulation resistance, fault condition testing, thermal evaluation, and fire enclosure assessment
• Work with EMC teams to ensure appropriate grounding, shielding, and filtering strategies are considered in safety design
• Support certification activities with external agencies (e.g. CB Scheme, NRTL bodies), including preparation of technical documentation and test reports
• Contribute to safety strategies for HVDC systems (typically 400–1000V DC), including insulation systems, interlocks, and service safety considerations
• Evaluate safety aspects of liquid-cooling systems, including leakage risk, dielectric properties of fluids, condensation, and system monitoring
• Maintain structured, audit-ready documentation to support compliance and manufacturing readiness

Desired:

• Degree in Electrical, Electronic, Mechanical Engineering, or a related discipline
• Experience in product safety, compliance, or a related engineering function
• Working knowledge of IEC 62368-1 or comparable product safety standards
• Understanding of electrical safety principles, including insulation, grounding, creepage/clearance, and fault protection
• Ability to review and interpret engineering designs (schematics, layouts, mechanical drawings) in the context of safety
• Experience supporting product certification or working with external test laboratories
• Familiarity with safety considerations in liquid-cooled or thermally intensive systems
• Awareness of EMC considerations in high-power designs

Benefits

In addition to a competitive salary, Graphcore offers flexible working, a generous annual leave policy, private medical insurance and health cash plan, a dental plan, pension (matched up to 5%), life assurance and income protection. We have a generous parental leave policy and an employee assistance programme (which includes health, mental wellbeing, and bereavement support). We offer a range of healthy food and snacks at our central Bristol office and have our own barista bar! We welcome people of different backgrounds and experiences; we’re committed to building an inclusive work environment that makes Graphcore a great home for everyone. We offer an equal opportunity process and understand that there are visible and invisible differences in all of us. We can provide a flexible approach to interview and encourage you to chat to us if you require any reasonable adjustments.

Sponsorship

Applicants for this position must hold the right to work in the UK. Unfortunately at this time, we are unable to provide visa sponsorship or support for visa applications.

Tenstorrent is seeking an Advanced Packaging Process Engineer with experience in 2.5D and 3D chiplet packaging to join Tenstorrent’s Packaging team. You will drive advanced package technology and reliability in close partnership with foundries and OSATs, helping push performance and manufacturability for next‑generation AI/ML products.

This role is hybrid, based out of Santa Clara, CA or Taipei City, TW.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are 

• Advanced packaging engineer with hands-on 2.5D/3D experience (CoWoS-R/L, FOCoS, EMIB, FCBGA, organic substrates, silicon interposers, embedded Si/eCB, micro-bumps, BGAs).
• Strong in reliability and failure analysis for advanced packaging, including qualification, root cause analysis, and corrective actions.
• Deep understanding of process flows and materials (polyimide, ABF, core, underfill, mold compound) and their interactions (warpage, stress, delamination, mechanical risk).
• Proven track record working with foundries/OSATs on NPI, design rules, excursions, yield/cost optimization, and production ramp, with clear communication and cross-functional collaboration.

What we need 

• Own advanced package technology implementation for 2.5D/3D chiplet products, including technology choices, process integration, and manufacturability.
• Act as primary technical interface to foundries/OSATs: align capabilities and design rules, manage excursions, drive yield, define/track test vehicles, and coordinate FA.
• Partner with design, reliability, and architecture teams to evaluate tradeoffs (bump pitch, stack-ups, embedded Si, etc.) and lead test vehicle planning to meet program needs.
• MS/PhD in a relevant field (Materials, Mechanical, Electrical, Physics, or related) and 5+ years in advanced packaging for high-performance semiconductors from NPI through production (2.5D/3D flows such as CoWoS, FOCoS, EMIB, FCBGA or equivalent).

What you will learn 

• Deeper exposure to leading-edge 2.5D/3D packaging for high-performance AI/ML and chiplet-based architectures.
• How to balance performance-driven architecture with mechanical and reliability constraints to make robust package technology decisions.
• Ways to use AI- and automation-driven methods to accelerate risk assessment, qualification planning, and technical documentation.
• Best practices for building strategic OSAT and foundry partnerships that enable new capabilities while scaling reliable high-volume production.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

ASM is recruiting for Field Process Engineer in our ALD/ CVD/ CMP business function located in North Taiwan. As part of a team, you'll provide process support / trouble shooting at client site. As a key driver of business success, you will play a vital role in strengthening and enabling business success through developing and improving processes run on our tool sets at customer sites. As a Field Process Engineer you will be responsible to understand our customers’ needs, and provide process support and subsequent implementation with alignment with BUs to ensure we deliver service and value to meet even exceed customers’ expectation.
 

Responsibilities:

• Evaluate, understand and identify current customer needs & new opportunities, while also anticipating future needs and building long-term sustainable relationship and solutions.
• Develop, maintain, and ensure relevance of technical information used by internal and external stakeholders.
• Drive and manage new product penetration & installation and subsequent process development.
• Define project scope and resource planning together with BU, escalate to Manager for resource gap.
• Drive continuous improvement of the customer experience through team, process and support tool development.
• Support CS EE /Sales/BU as one team to success new application penetration, site base operation and service.

Qualifications:

• PhD is preferred; Master/PhD in Physics, Chemistry, Materials Science, Electrical Engineering, Chemical Engineering, Mechanical engineering or a related discipline.
• 3+ years experience in thin-film/CVD/ALD/CMP
• Strong understanding of engineering principles related to process operations.
• Basic knowledge of process control systems and equipment.
• Strong analytical and problem-solving skills.
• Excellent communication and teamwork abilities.
• Ability to work in dynamic, fast-paced environments.
• Willingness to travel from 25% up to 50% to field sites as required.

We are expanding our team in our Taiwan location and are seeking an experienced and innovative Senior Mechanical Engineer to join our team. As a Senior Mechanical Engineer, you will play a crucial role in joining a team to design enclosures and accessories for our payment terminals. Your expertise in SolidWorks, tolerance analysis, thermal simulation, and plastic molding processes will be essential.

Examples of products designed by BBPOS for Stripe:

https://stripe.com/terminal/s700

https://stripe.com/terminal/m2

What you will do: 

• Design mechanical components or assemblies with SolidWorks modeling based on professional standards
• Engineering documents preparation, specifications, DFx and technical reports
• Verification of mechanical design ,mechanical drawing and solving technical problems
• Provide solutions for engineering problems and take initiatives to lead and plan problem solving activities
• Create and maintain engineering documents required for project planning and product development gate approval review
• Review mechanical design and access manufacturability of new design
• Analyze and verify mechanical design independently and solve technical problems using scientific approaches, such as mathematics, physics, prototyping, tolerance analysis, CAE, FEM, simulations, DOE, etc.
• Control product BOM cost and related design schedule, from mechanical engineering perspective
• Prepare mechanical engineering documents, such as BOM, component specifications and technical reports, and support FMEA activities 
• Design fixture and calibration process for high precision mechanical assemblies
• Verify and qualify designed components firstly produced from suppliers and participate in pilot production
• Support product compliance certification activities
• Independent, responsible, self-initiative

Who you are

We’re looking for someone who meets the minimum requirements to be considered for the role. If you meet these requirements, you are encouraged to apply. The preferred qualifications are a bonus, not a requirement.

Minimum requirements

• Degree Holder in Mechanical Engineering. A Master in ME or Product development related major are preferred
• At least 5 years of relevant working experience in product design of plastic and sheet metal with SolidWorks
• Ability to design plastic housings for products such as smartphones and tablets
• Understanding of manufacturing and mechanical production processes
• Proficiency in using Mechanical CAD software, such as SolidWorks, Creo
• Expertise in creating detailed 2D drawings and performing tolerance calculations
• Understanding mold design, FAI and CPK
• Experience managing vendors and factories
• Good command of written and spoken English and Mandarin
• Required to travel internationally including Hong Kong and China

Preferred qualifications

• Experience with designing products similar to cell phones and tablets
• Experience with hands-on skillsets on SolidWorks
• Experience with POS Hardware and peripherals
• Knowledge and expertise of PCI technology, material properties, manufacturing processes
• Understanding of material and plastic properties, including thermal calculations
• Proficiency in mechanical simulation and metal part design
• Skills in industrial design and rendering