Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

• Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
• Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

• Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
• Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
• Experience with advanced metrology/Inspection characterization techniques
• Strong communication skills to convey technical concepts clearly.

Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

• Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
• Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

• Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
• Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
• Experience with advanced metrology/Inspection characterization techniques
• Strong communication skills to convey technical concepts clearly.

Job's mission

As a Principal / Senior Process Engineer, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications.

What you will be working on

• Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions (ALD, PECVD, PVD, ECP) and surface preparation.
• Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
• Develop new films or processes for emerging packaging applications like W2W/D2W Hybrid bonding and perform advanced materials characterization.
• Provide mentorship to Process Engineers and lead technical problem-solving sessions using scientific methods and tools such as Ishikawa diagrams.
• Collaborate with customers and marketing teams to define requirements and execute demonstrations.
• Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
• Draft technical papers, generate Intellectual Property, and present findings to professional audiences.
• Travel up to 10% to support remote sites and customer engagements.
• May supervise process engineering technicians and provide input on performance evaluations.

What we are looking for

• Bachelor's, Master’s or PhD in Chemical Engineering, Materials Science, Electrical Engineering, or Physics.
• Direct experience working on D2W/W2W Hybrid bonding including surface preparation steps
• Minimum 10 years of combined education, research, and work experience in thin-film deposition (ALD, CVD, PECVD) and advanced packaging processes.
• Proficiency in materials characterization techniques (XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM, ellipsometry).
• Knowledge of electrical characterization techniques for CMOS devices.
• Ability to manage complex process development projects, including schedules, budgets, and personnel.

What sets you apart

• Expertise in integration advanced packaging process flows like CoWoS, SoIC, InFO.
• Experience in contributing Process and equipment qualification data towards a full Semiconductor equipment PLC process
• Experience with advanced metrology/Inspection characterization techniques
• Strong communication skills to convey technical concepts clearly.

About the Role:

As a Senior Mechanical Engineer, you will play a pivotal role in leading the mechanical design of complex biotech consumables from concept through production. You will be a key technical contributor, problem solver, and mentor, working across disciplines to drive innovation and ensure system success. Your expertise in mechanical design, prototyping, testing, and regulatory compliance will be instrumental in delivering high-performance, scalable solutions that meet the stringent demands of biotech environments.

What you will be doing:

• Lead the mechanical design of complex biotech consumables from concept through production
• Focus on injection-molded (IM) plastics, over-molding, LSR, and advanced assembly techniques like ultrasonic welding and laser bonding
• Design for Manufacturing (DFM) and Design for Assembly (DFA), working closely with toolmakers and CMOs to ensure tool designs and strategies are optimized
• Vendor Management - Act as the primary technical point of contact for external molding partners and material suppliers, ensuring quality and performance standards are met
• Contribute to the design and development of high-complexity mechanical systems for biotech applications, ensuring seamless integration with biological and chemical workflows
• Apply advanced engineering principles in mechanics, thermodynamics, fluid dynamics, and materials science to solve intricate design challenges

• Drive prototype development and oversee rigorous validation testing to ensure optimal system performance
• Ensure designs meet relevant regulatory standards (e.g., FDA, ISO, GMP) in partnership with compliance teams
• Drive projects from concept to commercialization, managing scope, schedules, risks, and trade-offs. Identify risks early, and implement mitigation strategies to maintain timelines and budget
• Act as a technical liaison between mechanical engineering and cross-functional teams (e.g., R&D, software, manufacturing, quality assurance) to ensure system integration

• Participate in failure mode analysis and implement corrective design improvements to enhance reliability and manufacturability

• Present project updates and design proposals to project leadership, ensuring alignment with project objectives
• Foster a collaborative team environment, mentoring junior engineers and driving knowledge-sharing initiatives.

Minimum Requirements:

• Bachelor’s or Master’s degree (or equivalent) in Mechanical Engineering or a related field
• Multi-year experience in mechanical design and product development, preferably in biotech, medical devices, or related industries
• Proficiency in CAD tools (e.g., SolidWorks, Creo, or equivalent) and engineering analysis tools
• Strong understanding of mechanical system integration, prototyping, and validation testing
• Experience with regulatory requirements (e.g., FDA, ISO 13485, GMP) for biotech or medical device applications
• Demonstrated ability to lead projects, mentor engineers, and drive cross-functional collaboration

Preferred Qualifications:

• Deep knowledge of thermoplastic resins (COC, COP, PC, PP), elastomers (TPE/TPU), and the nuances of high-volume injection molding
• Experience in fluidic systems, thermal management, or precision mechanics for biotech applications
• Knowledge of manufacturing processes, including injection molding, machining, and 3D printing
• Familiarity with risk assessment methodologies (FMEA, DFMEA, etc.)

#DM1

About the role

We are seeking a highly motivated and experienced Senior Compliance Engineer to lead and support hardware and reagent compliance initiatives across global regulatory frameworks. In this role, you will be responsible for interpreting and implementing regulatory requirements, managing product certifications, and ensuring compliance with standards such as UL, CE, FCC, RoHS, REACH, and other international directives. You will collaborate closely with cross-functional teams—including engineering, manufacturing, supply chain, and regulatory affairs—to ensure that all hardware and reagent products meet applicable compliance standards throughout their lifecycle. This position is critical to enabling successful product launches and sustaining market access across key global regions.

What you will be doing:

Hardware Product Compliance:

• Collaborating with a cross-functional team to ensure compliance to regulatory requirements including UL, CSA, FCC, CE, KCC, SRRC, PSE, CB.
• Submitting official certification through relevant compliance bodies such as FCC, CE, UL, TUV, KCC, MIC, SRRC, etc. and acting as a liaison between 10x Genomics and state, local, federal and international agencies to submit required forms and paperwork while maintaining date and files for future reference, particularly in the event of an audit by a regulatory agency.
• Understanding RoHS, REACH, TSCA, Waste Electrical and Electronic Equipment Regulation and ensuring that new and existing products are designed to comply with those guidelines and tested accordingly.
• Determining and interpreting the relevant regulatory standards such as IEC 61010-1, IEC 61010-2-010, IEC 61010-2-081, IEC 60601 and how they apply to 10x Genomics products to establish and maintain guidelines and best design practices to mitigate compliance issues early in the design phase.
• Ensuring compliance with global EMC and EMI regulatory requirements, and working closely with electrical and systems engineering teams to define and implement design guidelines for shielding, grounding, and layout strategies to reduce emissions and improve immunity.
• Staying up to date with any changes to global agency approvals and testing procedures, as well as reviewing marketing, legal and technical documentation (for example: labeling user guides and declaration of conformity) to assess compliance with regularly reporting on compliance status and measures to both internal and external parties.
• Maintaining a deep understanding of new and existing regulation that may impact 10x Genomics products and processes and using that understanding to standardize all business operations and establish clearly documented protocols while explaining regulations, procedures and policies to all employees and stakeholders as necessary.
• Preparing Manufacturing site ready for the Regulatory Body audit for Product Safety Certification. Establishing a routine manufacturing test equipment Program for Hipot & Ground Bond testing, and managing bi-annual audits with external regulatory agencies for Product Safety Certification.

Minimum Requirements:

• Minimum of Bachelor’s degree in Electrical Engineering or related engineering field
• Given the complexity and narrow scope of business requirements, we also require Senior Regulatory Compliance Engineer, to have several years of experience and expertise in electrical engineering processes and procedures
• 10+ years of experience in regulatory compliance for hardware products, reagents, or both—preferably within the life sciences, diagnostics, or medical device industries
• Additional Experience with chemical and reagent compliance, including SDS authoring, GHS/CLP labeling, and familiarity with REACH, TSCA, and international chemical inventory regulations is strongly preferred
• Familiarity with environmental regulations (RoHS, REACH, WEEE, TSCA, etc.) and how they apply to product design, component selection, and global distribution
• Strong project management skills, with the ability to manage multiple regulatory timelines and interact with cross-functional teams (e.g., R&D, manufacturing, supply chain)
• Excellent technical writing and documentation skills, including experience with compliance reports, regulatory submissions, and audit-ready file maintenance
• Ability to interpret regulatory language and apply it practically to product development and compliance strategies
• Experience with software coding is an added advantage. 

#LI-MH1 #LI-ONSITE