Tenstorrent is seeking a Layout Engineer with expertise in board layout for high-performance computing and  AI hardware. This role requires direct experience with multi-layer boards, HDI vias, blind vias, back drilling, DFM, DFA and routing / layout of interfaces like GDDR, LPDDR, DDR, PCIe Gen 5 & 6, Ethernet IEEE 802.3bj, cd, cf, USB, etc. The ideal candidate will work closely with cross-functional teams consisting of engineers from systems, power, signal integrity and mechanical to ensure that our products meet the layout margins and cutting-edge specifications for mass production boards for data centers, workstations, and consumer computing applications.

This role is hybrid, based out of Toronto, ON or Santa Clara, CA.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who you are

• Experienced board layout engineer with ~8+ years in PCB design (Cadence Allegro; Altium a plus).
• Hold a B.S. in EE, CS, or equivalent experience.
• Strong background in high-speed, complex PCBs (high layer count, HDI, multi-lamination, VIPPO, back drilling).
• Comfortable defining and applying layout rules (physical, spacing, length-matching) for high-speed designs.
• Confident working with fabricators on stackups, capabilities, and resolving DFM/DFA/DFT feedback.
• Detail-oriented owner of designs with strong communication skills and the ability to work with an international, cross-functional team.

What we need

• A Layout Engineer to own multi-layer PCB layouts for high-performance computing and AI hardware.
• Expertise routing GDDR, LPDDR, DDR, PCIe Gen 5/6, Ethernet (IEEE 802.3bj/cd/cf), USB and other high-speed interfaces.
• Proficiency with Cadence schematic/layout tools (v25.1) in the Cadence Pulse environment.
• Ability to choose appropriate advanced fabrication technologies (HDI, blind/buried vias, VIPPO, back drilling) balancing performance and cost.
• Skill in floorplanning, component placement, board connectivity, and creation of power/ground planes.
• Collaboration with power, signal integrity, and mechanical engineers to meet PDN, SI, mechanical, thermal, and regulatory (IPC, UL, CE, RoHS, FCC) requirements.

What you will learn

• How to design boards for cutting-edge AI and high-performance computing systems in data center, workstation, and consumer products.
• Techniques to optimize signal integrity, power delivery, and manufacturability for mass-production hardware.
• Best practices for working in a deeply cross-functional environment across systems, power, SI, and mechanical teams.
• Practical experience building around a from-scratch, high-performance RISC-V CPU and AI-first compute platform.
• How to navigate and integrate global industry and regulatory standards while pushing performance limits.
• The direct impact of your layout work on the roadmap and success of a fast-growing AI silicon and systems company.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Tenstorrent is seeking a Signal Integrity Engineer to join our growing team. The ideal candidate will have a wealth of exposure designing high speed interconnects, breakout design, material trade-offs and verification. A background in electrical engineering, electronics or relevant fields is required. Must love all things high speed!

This role is hybrid, based out of Santa Clara, CA or Austin, TX or Toronto, ON.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

• You have a Bachelor’s degree in Electrical Engineering (or equivalent) and 5+ years working in high-speed digital design with a focus in high-speed PCB or package design at 10Gbps and above (e.g. 100GbE, GDDR6, PCIe Gen5+).
• You’re comfortable working with high-speed performance metrics such as ICR, ERL, COM, NEXT, and FEXT as well as knowledge of high-speed connector technologies, including NPO, CPO, and emerging standards.
• You are proficient with PCB ECAD tools (ideally Cadence Allegro).
• You communicate clearly (written and verbal), think critically, and love solving complex signal integrity problems.
• You’re enthusiastic about all things high speed and enjoy collaborating across teams

What We Need

• Design, extract, and simulate complex breakout structures, including end-to-end simulations and validation against physical hardware. Perform simulation and extraction of board models for both SI and PI.
• Contribute to design and sign-off with internal and external ASIC packaging teams, ODMs, and internal layout teams. Create design specifications, work with external vendors, and drive adoption of new interconnect and packaging technologies.
• Actively participate in design reviews, providing insight from your SI/PI expertise and a broader system perspective.
• Support post-silicon bring-up and help troubleshoot production and field failures related to signal and power integrity. Document design processes and provide training/knowledge sharing to other team members.

What You Will Learn

• How to work at the cutting edge of high-speed interconnects, influencing the next generation of ASIC packaging and PCB architectures.
• Deep exposure to advanced ASIC packaging flows and collaboration models with internal and external packaging teams.
• Hands-on experience with emerging high-speed connector technologies and materials, including evaluating material trade-offs for performance and manufacturability.
• Best practices for end-to-end SI/PI validation, from simulation through to lab correlation, post-silicon bring-up, and field failure analysis.

Compensation for all engineers at Tenstorrent ranges from $100k - $500k including base and variable compensation targets. Experience, skills, education, background and location all impact the actual offer made.

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Job Description:

As an Analog/Mixed-Signal IC Design Engineer, you will be part of a key team designing sophisticated advanced node CMOS products. Your responsibilities will include developing and verifying circuits such as PLL, DLL, ADC, regulators, amplifiers, TX, RX, and CDRs to meet performance targets. You will also work on analog and clocking blocks for connectivity applications, using industry-standard tools like Spectre and MATLAB. The company seeks a highly motivated designer for this role

Basic Qualifications:

• Strong academic and technical background in electrical engineering. A Master’s or PhD degree in EE is required, preferably from a top-tier university.
• 2+ years of experience supporting or developing complex analog IC designs.

Required Experience:

• Hands-on experience in designing high-speed mixed-signal circuits including ADC/DAC data converters, RX front-end, TX driver/serializer, low-jitter PLLs, TX/RX calibration, low-jitter CLK distribution are other high-speed analog circuits is a must
• Have a deep understanding of biasing, band-gaps, reference circuits, opamps, comparators and other analog circuits
• Solid track-record for implementation of analog circuits high-speed data transmission.
• Design and tapeout experience in advanced CMOS nodes (ex. 20nm or newer) is a must
• Solid fundamentals in detailed transistor-level design, feedback/stability analysis, and noise/jitter analysis.
• Knowledge of TIA design and drivers for optical applications is highly desirable
• Experience in RFIC design for wireless or wireline communication systems is highly desirable.
• Strong technical independent contributor with a proven ability to drive results.
• Excellent teamwork, presentation, and documentation skills.
• Ability to collaborate with global teams across multiple time zones and deliver under pressure with strict deadlines.
• Strong experience in lab chip bring-up and debugging efforts.

Preferred Experience:

• Relevant research publications and/or patents in analog or RF IC design.
• Familiarity in programming/scripting languages such as Python, Matlab, or C.
• Experience with PCB design.
• Familiarity with Verilog RTL or DSP design concepts.
• Knowledge of optical transceivers.
• Expertise in ESD protection techniques and IC packaging methodologies.

The base salary range is $150,000.00 USD – $200,000.00 USD.

The base salary range for this role in Canada is $110,000 CAD - $130,000 CAD

Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.  

Job Description:

As an Analog/Mixed-Signal IC Design Engineer, you will be part of a key team designing sophisticated advanced node CMOS products. Your responsibilities will include developing and verifying circuits such as PLL, DLL, ADC, regulators, amplifiers, TX, RX, and CDRs to meet performance targets. You will also work on analog and clocking blocks for connectivity applications, using industry-standard tools like Spectre and MATLAB. The company seeks a highly motivated designer for this role

Basic Qualifications:

• Strong academic and technical background in electrical engineering. A Master’s or PhD degree in EE is required, preferably from a top-tier university.
• 8+ years of experience supporting or developing complex analog IC designs.

Required Experience:

• Hands-on experience in designing high-speed mixed-signal circuits including ADC/DAC data converters, RX front-end, TX driver/serializer, low-jitter PLLs, TX/RX calibration, low-jitter CLK distribution are other high-speed analog circuits is a must
• Have a deep understanding of biasing, band-gaps, reference circuits, opamps, comparators and other analog circuits
• Solid track-record for implementation of analog circuits high-speed data transmission.
• Design and tape out experience in advanced CMOS nodes (ex. 7nm, 5nm 3nmFinFET) is a must.
• Solid fundamentals in detailed transistor-level design, feedback/stability analysis, and noise/jitter analysis.
• Knowledge of TIA design and drivers for optical applications is highly desirable
• Experience in RFIC design for wireless or wireline communication systems is highly desirable.
• Strong technical independent contributor with a proven ability to drive results.
• Excellent teamwork, presentation, and documentation skills.
• Ability to collaborate with global teams across multiple time zones and deliver under pressure with strict deadlines.
• Strong experience in lab chip bring-up and debugging efforts.

Preferred Experience:

• Relevant research publications and/or patents in analog or RF IC design.
• Familiarity in programming/scripting languages such as Python, Matlab, or C.
• Experience with PCB design.
• Familiarity with Verilog RTL or DSP design concepts.
• Knowledge of optical transceivers.
• Expertise in ESD protection techniques and IC packaging methodologies.

 Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.

Role Summary

Finite State is seeking an experienced IoT / ICS / OT and Penetration Tester to join our growing Services team. In this role you will conduct hands-on security assessments of connected devices, embedded systems, industrial control systems, and automotive platforms on behalf of our customers. You will combine deep hardware and firmware expertise with a consultative mindset to deliver clear, actionable findings that help manufacturers and operators understand and reduce risk. 

Responsibilities

• Plan and execute penetration tests and security assessments against IoT, ICS/OT, and automotive targets, including connected consumer devices, industrial controllers, and automotive ECUs and telematics units.
• Perform hardware interaction and firmware extraction using techniques such as JTAG, SWD, UART, SPI, I2C, eMMC, and NAND flash dumping; solder and rework PCBs as needed to gain access to debug interfaces.
• Conduct firmware reverse engineering using tools such as Ghidra and Binary Ninja to identify vulnerabilities including memory corruption, authentication bypasses, hard-coded credentials, and insecure update mechanisms.
• Assess wireless protocols common in IoT and automotive environments, including Bluetooth / BLE, Zigbee, Z-Wave, Wi-Fi, Cellular (LTE/5G), CAN bus, LIN, and automotive Ethernet.
• Perform source code review, primarily in C, C++, and related embedded languages, to identify security weaknesses in firmware and embedded software.
• Conduct supply chain and software composition analysis, including SBOM review and analysis of third-party open-source components, to identify known vulnerabilities and license risks.
• Evaluate customer products and programs for compliance with relevant regulations and standards, including EN 303 645, the EU Cyber Resilience Act (CRA), EU Radio Equipment Directive (CE RED), UNECE WP.29 / ISO 21434 for automotive, and the US IoT Cyber Trust Mark.
• Produce high-quality written reports that clearly communicate technical findings, risk ratings, and remediation guidance to both technical and executive audiences.
• Leverage AI-powered security tooling and LLM-assisted workflows to accelerate analysis, triage, and reporting; maintain awareness of evolving AI capabilities relevant to embedded security research.
• Collaborate with the product, engineering, and research teams to feed pentesting findings back into the Finite State platform and improve detection capabilities.
• Support customer-facing engagements including scoping calls, technical debriefs, and remediation follow-up.
• Contribute to internal knowledge sharing, tooling development, and methodology improvement.
• Participate in industry conferences, publish research, and represent Finite State externally as opportunities arise.

Required Qualifications

• Bachelor's degree in Computer Science, Electrical Engineering, Computer Engineering, or a related field
•  5+ years of hands-on experience in IoT, embedded, ICS/OT, or automotive security.
• Demonstrated experience performing hardware-level security assessments: JTAG/SWD debugging, SPI/I2C/UART communication, flash memory extraction, and PCB soldering and rework.
• Proficiency with firmware reverse engineering tools, specifically Ghidra and/or Binary Ninja; ability to analyze ARM, MIPS, PPC, x86, and x64 architectures.
• Experience testing IoT and automotive wireless protocols, including BLE, Zigbee, Z-Wave, Wi-Fi, CAN bus, and cellular interfaces.
• Ability to read and review source code in C and C++ to identify memory safety issues, authentication flaws, and other security weaknesses in embedded software.
• Familiarity with SBOM concepts, formats (CycloneDX, SPDX), and the use of SBOMs in vulnerability management.
• Working knowledge of relevant regulations and standards, including at least a subset of: EU CRA, CE RED / EN 303 645, UNECE WP.29, ISO 21434, or the US IoT Cyber Trust Mark.
• Excellent written and verbal communication skills; proven ability to write clear, well-structured technical reports and present findings to diverse audiences.
• Experience with scripting and automation using Python and Bash to support tooling and workflow efficiency.
• Familiarity with AI-assisted security tooling and an interest in applying LLM-based workflows to accelerate security analysis and reporting.

Preferred Qualifications

• Hands-on automotive security experience: OBD-II assessment, ECU flashing and analysis, V2X protocols, or automotive HSM evaluation.
• Experience with industrial control system (ICS/SCADA) security assessments and familiarity with protocols such as Modbus, DNP3, EtherNet/IP, or OPC-UA.
• CVE or responsible disclosure history demonstrating original vulnerability research in embedded or IoT targets.
• Relevant certifications such as OSCP, GPEN, GICSP, or vendor-specific automotive security credentials.
• Familiarity with static and dynamic analysis platforms and SAST/DAST tooling in the context of firmware and embedded software.
• Experience with ML-based vulnerability detection models or AI-augmented reverse engineering pipelines.
• Experience working on small, fast-moving consulting or product security teams.
• Comfort operating in AWS or similar cloud environments used to support analysis pipelines or customer deliverables.

Why Finite State?

• Be part of building the leading platform for connected device cybersecurity
• Join a fast-moving team that values transparency, innovation and impact
• Work fully remotely with a high degree of autonomy and ownership
• Comprehensive benefits
• Investment: learning stipends to support your professional development
• Equity: share in our growth and success
• Help solve some of the most pressing cybersecurity challenges facing connected device manufacturers and the millions of people who depend on them

About the role

We are an engineering and manufacturing company based in Toronto, specializing in [briefly add your products/industry: e.g., “high‑reliability electronic assemblies for industrial and OEM customers”]. We are looking for a Senior Manager, SMT & Assembly Operations to lead our Surface Mount Technology (SMT) lines and Assembly team.

In this role, you will own day‑to‑day operations for SMT and Assembly, lead a cross-functional team of supervisors/technicians/operators, and drive continuous improvement in throughput, quality, and cost. You will be a key member of the operations leadership team and a partner to Engineering, Quality, Supply Chain, and Sales..

Key Responsibilities:

Operational Leadership

• Lead end‑to‑end operations for two SMT lines and downstream Assembly (mechanical and electro‑mechanical) and being hands-on in daily activities.

• Ensure production plans and customer delivery commitments are met (OTD, lead time, throughput).

• Develop and manage daily/weekly production schedules in collaboration with Operations.

• Monitor key production metrics (yield, scrap, rework, uptime, changeover time) and take corrective action where needed.

• Ensure effective handoff and coordination between SMT, AOI/inspection, test, and final assembly.

People Leadership

• Lead, mentor, and develop the team of approximately 15 people.

• Set clear goals and expectations; provide regular feedback, coaching, and annual performance reviews.

• Build a culture of safety, accountability, and continuous improvement on the shop floor.

• Drive cross‑training and skills development to increase flexibility and reduce single‑point dependencies.

• Organize workforce planning, recruitment, onboarding, and succession planning.

Quality & Compliance

• Partner closely with Operations and Engineering to maintain and improve first-pass yield and reduce defects, escapes, and rework.

• Experience with relevant standards (e.g., IPC‑A‑610, ISO 9001, customer-specific requirements) and internal procedures.

• Support and lead root cause analysis and corrective/preventive actions (RCA, 8D, 5 Whys, fishbone, etc.).

• Experience in good manufacturing practices (GMP), ESD control, and proper handling of components and assemblies.

• Support internal and external audits and customer visits as the operations lead.

Continuous Improvement & Engineering Support

• Drive continuous improvement, incl. using initiatives like Lean, Kaizen, and others.

• Optimize line setup, changeover, and balancing to maximize throughput and minimize downtime.

• Evaluate and implement new equipment, tools, and technologies for SMT and Assembly.

• Help standardizing work instructions, process parameters, and best practices across lines and shifts.

Safety & Facilities

• Ensure a safe working environment and reinforce adherence to all health & safety policies and regulations.

• Conduct regular safety walks, risk assessments, and incident investigations as needed.

• Partner with Facilities/Maintenance to ensure equipment uptime, preventive maintenance, and quick response to breakdowns.

Budget & Reporting

• Contribute to annual budgeting for labor, equipment, and operational expenses for SMT and Assembly.

• Manage labor utilization and overtime to meet production goals within budget.

• Prepare and present regular reports on KPIs (OTD, yield, scrap, productivity, etc.) to senior leadership.

• Identify cost‑reduction opportunities while maintaining or improving quality and delivery.

Qualifications:

Education

• Bachelor’s degree in Engineering, Manufacturing, Operations Management, or a related field;

  • A diploma combined with strong relevant experience will also be considered.

Experience

• 8+ years of experience in electronics manufacturing, with 3–5+ years in a leadership/management role.

• Good understanding in of the SMT production line process (e.g., screen printers, pick‑and‑place machines, reflow ovens, AOI) and Assembly operations.

• Proven track record leading teams in a high‑mix/low‑to‑mid‑volume environment.

• Demonstrated experience improving OTD, quality, and cost through Lean/CI initiatives.

Technical Skills

• Strong knowledge of SMT processes, PCB assembly, and related quality standards.

• Understanding of mechanical assembly, box‑build, and system integration processes.

• Familiarity with production planning and scheduling, ERP/MRP systems, and shop‑floor data collection.

• Experience interpreting engineering drawings, BOMs, and work instructions.

• Experience with manufacturing dashboards/KPIs.

Leadership & Soft Skills

• Strong people leadership skills with the ability to motivate and coach diverse teams.

• Excellent problem‑solving and decision‑making skills; comfortable working with data and KPIs.

• Strong communication skills, both written and verbal.

• Highly organized, with the ability to manage multiple priorities in a fast‑paced environment.

• Collaborative mindset, able to work cross‑functionally with Engineering, Quality, Supply Chain, and Sales.

What We Offer

• Competitive salary and performance‑based bonus.

• Comprehensive benefits package (health, dental, vision, etc.).

• RRSP/retirement contributions (adjust as applicable).

• Opportunities for career growth and professional development.

• A collaborative environment where operations, engineering, and manufacturing work closely together to deliver high‑quality products.