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Job Description:

About the Role

We are looking for a Senior SI/PI Engineer to join our hardware engineering team. In this role, you’ll own the signal and power integrity analysis for our high-speed boards, packages, and system architectures. You will work directly with hardware, ASIC, SERDES, packaging, and layout engineers from early architecture trade-offs all the way through lab bring-up and characterization.

If you enjoy building accurate 3D simulation models, developing optimized solutions,  and validating designs in lab, this role is for you.

What You’ll Do

• Modeling & Simulation: Build 2.5D/3D EM models for high-speed channels, package substrates, connectors, and PCB stackups. Perform time- and frequency-domain simulations for high-speed serial links (SerDes) and parallel interfaces (DDR/HBM).
• PDN Analysis:  Assist in AC/DC power delivery network simulations to evaluate impedance targets, transient noise, and IR drop across boards and packages.
• Design Optimization: Provide clear layout constraints, stackup recommendations, and routing rules to hardware and layout teams.  Optimize custom package designs, connector breakouts, and practical via designs.  Iterate as bottlenecks are discovered.
• Lab Characterization: Validate simulations in the lab using VNAs, TDRs, BERTs, and real-time oscilloscopes. Correlate measurement data back to your models to refine future design rules.
• Debug & Bring-up: Partner with hardware teams during board bring-up to debug SI/PI issues and root-cause signal degradation or power noise.
• Automation: Leverage scripts (Python, TCL) to automate simulation flows, data processing, and design checks.

What We’re Looking For

• Degree: BS, MS, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
• Experience: 12+ years of practical experience in high-speed digital design, signal integrity, and power integrity.
• Fundamentals: Solid understanding of transmission line theory, S-parameters, crosstalk, jitter, EMI/EMC, and PDN concepts.
• Simulation Tools: Hands-on proficiency with tools like Ansys HFSS/SiWave, Cadence Sigrity/Allegro, Keysight ADS, or HSPICE.
• Interfaces: Direct experience simulating and analyzing high-speed interfaces (e.g., PCIe, 56G/112G/224G SerDes, DDR4/5, or HBM).
• Lab Skills: Comfortable operating high-frequency test equipment (VNAs, TDRs, high-bandwidth scopes), probing techniques, and performing model-to-hardware correlation.

Nice to Have

• Familiarity with high-speed PCB laminates, stackups, via designs, and manufacturing trade-offs.
• Experience writing Python or TCL scripts to automate EDA tools.

Compensation and Benefits

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

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