We are seeking a Project Manager to lead the development and implementation of Wolfspeed's advanced packaging initiatives across high-performance computing (HPC), AI data center, and AR/VR applications. In this role, you will manage the full project lifecycle — from initiation through delivery — for SiC-based advanced packaging and related processing solutions, coordinating cross-functional and external partner teams to bring new products and process capabilities to market on schedule and within budget. You will serve as the central point of coordination across design, processing, and external partnerships, ensuring that technical development and integration milestones are met while balancing scope, cost, and timeline. The ideal candidate will be located in the US.

Key Responsibilities

• Project Leadership: Manage the development and implementation of advanced packaging products and process solutions across 2.5D/3D architectures — including interposers, heat spreaders/carriers, and related integration steps — coordinating activities from initiation through delivery.
• Cross-Functional Coordination: Organize and lead departmental and cross-functional teams — spanning design, process/technology development, applications engineering, and product management — to deliver new packaging products and upgrade existing capabilities.
• Schedule & Milestone Management: Plan, direct, and monitor project schedules, defining milestones, dependencies, and deliverables to ensure on-time completion. Proactively identify and mitigate risks to timeline and scope.
• Budget & Resource Oversight: Monitor budget and spending against plan, track resource allocation, and drive projects to completion within defined budget constraints.
• Design & Processing Integration: Coordinate design and processing workstreams for advanced packaging, ensuring technical requirements are translated into executable project plans across development and qualification phases.
• External Partnerships: Manage project interfaces with external partners — including foundries, OSATs, research institutes, and ecosystem players — coordinating joint development activities, aligning deliverables and timelines, and ensuring smooth collaboration across organizational boundaries.
• Stakeholder Communication: Provide clear, regular status reporting to internal leadership and external partners, escalating issues and decisions as needed to keep projects on track.

Qualifications

• Bachelor's degree in Electrical Engineering, Materials Science, or a related technical field; project management certification is a plus.
• Experience managing complex technical development projects, ideally in semiconductor packaging, advanced packaging, or a related hardware domain.
• Familiarity with advanced packaging architectures (2.5D/3D integration, interposers, chiplet integration) and/or AR/VR-relevant processing such as waveguide fabrication and optical integration.
• Proven ability to plan and manage project schedules, budgets, and resources across cross-functional teams.
• Experience coordinating with external partners such as foundries, OSATs, or research institutes on joint development or product delivery.
• Strong organizational, risk-management, and problem-solving skills, with the ability to keep multiple workstreams aligned and on schedule.
• Excellent communication and stakeholder-management skills across both technical and business audiences.
• Ability to balance competing priorities and drive projects to completion within scope, schedule, and budget.