Hiring: External Package Innovation Engineer

We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.

🔹 Role Overview

As an EPI engineer, you will act as both a Role Owner and Key Supporter for OSAT-related development activities, ensuring robust execution from concept through production.

🔹 Key Responsibilities

✅ 1. Role Owner (Strategic & Governance)

• Own and lead OSAT-wide and cross-OSAT initiatives
• Define and deploy standard development templates and success criteria across OSATs
• Drive deployment of Best Known Methods (BKM) and lessons learned
• Develop and maintain technology roadmap and capability assessment for each OSAT site
• Provide Package Innovation (PI) input for:
  • External site sourcing strategy
  • Site selection process (jointly with interface manager)
• Lead project governance, including:
  • Overall project summaries
  • Stoplight reporting
  • Regular reviews per OSAT site

✅ 2. Supporter (Execution & Project Delivery)

• Support NPI & NTI projects executed at external OSAT factories
• Ensure OSAT compliance with:
  • Development processes
  • Required documentation/templates
• Drive alignment on SME (Subject Matter Expert) assignment at OSAT
• Support and resolve technical and project issues on-site and across time zones
• Ensure assembly readiness and safe production launch

🔹 Stakeholder Collaboration

You will work closely with cross-functional teams, including:

• Project Leaders & Development Managers
• Designers & Materials Engineers
• Tech Integration & Modelling teams (Electrical, Mechanical, Thermal)
• API and WLP/PLP/FC SMEs
• OSAT partners

🔹 What We’re Looking For

• Strong experience in semiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding).  Previous exposure to OSAT ecosystem is an added advantage.
• Proven ability to manage cross-site, cross-functional projects
• Solid understanding of NPI/NTI development flows
• Excellent stakeholder management and communication skills
• Ability to drive standardization, governance, and technical problem-solving

🌟 Why Join Us

• Opportunity to lead high-impact package innovation initiatives
• Work with global teams and OSAT partners for wide exposure and fast knowledge & skill growth
• Drive technology roadmap and next-generation packaging solutions

More information about NXP in Malaysia...