Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities will include, but are not limited to:

·   Develop, characterize, qualify, and integrate advanced materials supporting next-generation memory and packaging technologies.

·   Form hypotheses, design and execute rigorous experiments, analyze data, and translate learning into material and technology decisions.

·   Generate new ideas and practical materials solutions that address performance, reliability, manufacturability, scalability, and cost challenges.

·   Challenge existing assumptions, specifications, and development practices constructively when data supports a better approach.

·   Investigate materials behavior, interfaces, adhesion, mechanical response, thermal performance, chemical compatibility, reliability, and process interactions.

·   Work with process, integration, product, manufacturing, quality, equipment, and supplier teams to move materials from concept through qualification and manufacturing readiness.

·   Engage suppliers, universities, research organizations, and other external partners to evaluate and accelerate new materials technologies.

·   Contribute invention disclosures, patents, technical reports, presentations, and publications where appropriate.

·   Demonstrate strong ownership, urgency, resilience, collaboration, and a willingness to work hands-on through difficult technical problems.

·       Leverage advanced digital, modeling, simulation, data analytics, and artificial intelligence (AI) tools to accelerate materials development, technical problem solving, and innovation.

Areas of current interest include, but are not limited to:

·   Advanced polymer composites and encapsulation materials, including non-conductive films (NCF), molded underfill (MUF), mold compounds, underfills, and die-attach materials.

·   Temporary bonding and release materials, carrier systems, back-grind and dicing tapes, and other materials supporting thin-wafer handling.

·   Advanced polymers and dielectrics, films and coatings, adhesion and interface materials, surface preparation materials, electronic materials, thermal materials, and substrate or redistribution-layer materials.

·   New and emerging material platforms that can enable future HBM, 3D memory, heterogeneous integration, and advanced packaging technologies.

This list is illustrative, not restrictive. Direct semiconductor or advanced packaging experience is valuable but not required. Candidates from other materials-intensive industries, research institutions, or technology fields are encouraged to apply if they demonstrate strong materials science depth, innovation, technical accomplishment, learning agility, and the ability to translate their experience to new technology challenges.

Successful candidates for this position will have:

·   Strong materials science fundamentals and understanding of structure-property-process-performance relationships.

·   Demonstrated capability to solve complex technical problems through experimentation, analysis, and structured problem solving.

·   Creativity, curiosity, drive, learning agility, and the ability to work effectively in ambiguous and rapidly evolving environments.

·   Ability to communicate technical concepts clearly and collaborate across disciplines, organizations, suppliers, and geographies.

·   Evidence of innovation or technical contribution through new material development, improved technology capability, invention disclosures, patents, publications, or other measurable impact.

·   Ability to work independently while seeking input, building alignment, and delivering results as part of a global team.

·       Demonstrated curiosity and willingness to adopt emerging technologies, including AI-enabled tools, to improve productivity, technical learning, and decision quality.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at hrsupport_taiwan@micron.com.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.