Job's mission

As an R&D Process Development Engineer at ASM, you will develop and optimize advanced semiconductor deposition processes that enable next-generation devices. Working hands-on with state-of-the-art processing and analytical equipment, you will drive innovation in atomic layer deposition (ALD) and plasma-enhanced atomic layer deposition (PEALD). This role offers the opportunity to translate scientific concepts into impactful technologies through process development, customer collaboration, and intellectual property creation.

What you will be working on

• Research, develop, and optimize thin-film deposition processes, with a focus on metal oxide and nitride films using PEALD, thermal ALD, and related technologies.
• Design and execute complex experiments using Design of Experiments (DOE), and analyze results systematically to guide process decisions.
• Develop new materials and processes for emerging semiconductor applications by applying strong fundamentals in chemistry, materials science, and plasma science.
• Diagnose and resolve process and equipment issues through hands-on experimentation and data-driven analysis.
• Lead and contribute to structured technical problem-solving using scientific methods and industry-standard tools.
• Collaborate with customers and central marketing teams to define technical requirements and execute customer demonstrations.
• Support product transfer and customer adoption by conducting demonstrations, training field service teams, preparing and presenting technical documentation, and traveling to customer sites as needed (up to 10%).
• Author technical papers and contribute to the creation of intellectual property (IP) related to process and technology development.

What we are looking for

• A self-motivated, solutions-oriented mindset and the ability to work effectively in a complex, fast-paced environment.
• D. in Chemical Engineering, Materials Science, Electrical Engineering, Nuclear Engineering, Physics, or a related discipline; or a master’s degree with at least five years of relevant industry experience.
• Hands-on experience with PEALD, ALD, PECVD, CVD, or other thin-film deposition or etch technologies.
• Strong understanding of thin-film deposition principles, plasma–surface interactions, and surface reaction mechanisms.
• Demonstrated experience designing and characterizing deposition processes using first-principles reasoning and experimental design techniques.
• Ability to independently plan and manage complex process development activities while collaborating effectively across functions.
• A collaborative team player who builds trust, shares knowledge, and contributes to shared goals across multidisciplinary and global teams.
• Excellent written and verbal communication skills in English and Korean, with the ability to explain complex technical concepts clearly to diverse audiences.

What sets you apart

• Experience integrating metal oxide and/or nitride films into front-end-of-line (FEOL) or back-end-of-line (BEOL) process flows.
• Hands-on experience with materials characterization techniques such as XPS, SIMS, AFM, XRD, TEM, SEM, Raman spectroscopy, or ellipsometry.
• A record of authoring technical publications and/or patents in the semiconductor industry.
• Demonstrated ability to collaborate effectively with customers, field teams, and cross-functional stakeholders in a global organization.