Job's mission

As a Global Product Support Engineer based in Singapore, the role will be part of our Advanced Packaging R&D where you’ll help bring advanced semiconductor equipment from development into successful operation at customer fabs around the world. You will work at the intersection of technology development and customer engagement, solving complex system-level challenges while supporting new product introductions, qualification, and scale-up. Your expertise and insights from the field will help improve the performance, reliability, and success of technologies enabling the next generation of semiconductor devices.

What you will be working on

• Act as a system-level technical expert, supporting complex semiconductor equipment in development labs and customer fabs.
• Diagnose and resolve advanced system, hardware, and process issues, including escalations beyond standard support.
• Drive root cause and corrective action activities and implement sustainable solutions across tools, customer sites, and product lines.
• Support new product introduction, including early builds, lab validation, and ramp-up to high-volume manufacturing.
• Lead or support first-in-fab Alpha and Beta deployments, including installation, start-up, and qualification.
• Translate field and customer feedback into improvements in equipment design, performance, and reliability.
• Drive improvements in yield, equipment performance, and uptime in demanding semiconductor manufacturing environments.
• Develop and share best practices, technical documentation, and training materials aligned with global standards.
• Collaborate with hardware, software, controls, quality, reliability, and process engineering teams across our global organization.
• Engage directly with customers to understand technical challenges and influence effective solutions.

What we are looking for

• Minimum Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Systems Engineering, or a related engineering discipline.
• Minimum 5 years of experience in field service, technical support, or global product support within the semiconductor industry.
• Experience supporting semiconductor manufacturing equipment and processes.
• Strong system-level troubleshooting and structured problem-solving skills.
• Hands-on engineering capability, with the ability to connect engineering principles to real-world equipment behavior.
• Experience using data analysis and structured problem-solving methods to investigate technical issues.
• Strong written and verbal communication skills, including experience in customer-facing technical discussions.
• Ability to collaborate effectively across global teams and time zones.
• Willingness to travel internationally ~ 25 to 50% of the time.

What sets you apart

• Experience with deposition, atomic layer deposition (ALD), surface preparation, thermal processing, wet processing, or related semiconductor technologies.
• Experience supporting new product introductions, early product builds, or first-in-fab deployments.
• Experience leading complex root cause investigations and implementing solutions across multiple tools or customer sites.
• Knowledge across multiple equipment disciplines, such as plasma, vacuum, gas delivery, wet chemistry, software, controls, and hardware integration.
• Experience supporting equipment qualification and ramp-up in high-volume manufacturing environments.
• Ability to turn customer and field insights into meaningful product, performance, or reliability improvements.