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Job Description:

Senior Staff Reliability Engineer, RF Characterization and Reliability

Overview

We are seeking highly skilled and motivated Senior/staff Reliability Engineer 5 to join our team, focusing on the radio frequency (RF) characterization and reliability test development for our cutting-edge 'Tuner Switch' and front-end module products used in wireless handset chipsets. This critical function serves as a reliability expert and partner to our Research & Development (R&D), Design, and Quality teams. The ideal candidate will possess deep expertise in semiconductor device physics and reliability principles, particularly in RF and power electronics, and will be instrumental in ensuring the long-term performance and robustness of our products.

The person is also responsible for coordinating with the R&D, process development, systems hardware engineering and the user experience teams to ensure that the RF end product meets the appropriate reliability & quality specs within the wireless division of Broadcom Inc. The person is also responsible for leading troubleshooting, root cause and failure analysis activity when necessary to resolve the device and reliability failures of RF components. 

The person should be well versed in New Technology and New Product Introduction, setting up reliability assessment Operations with detailed data analysis with JMP software, especially for semiconductor-related RF products. 

Responsibilities

The Senior Reliability Engineer will be responsible for defining, executing, and analyzing a combination of electrical, thermal, and mechanical stress tests to ensure the long-term performance and reliability of Front-end module and related devices fabricated in RF CMOS, GaAs PA, SOI Filter and new package technologies.

As a salary-based Staff (full time), this person will

• Work closely with Design, Advanced Technology Research and Development, Fab and assembly Manufacturing to define semiconductor device reliability requirements, characterize the device reliability for state-of–the–art IC process and package technologies with detailed data analysis
• Evaluation and design of reliability test hardware/software for dynamic life testing of semiconductor RF devices
• Work closely with quality reliability engineers to define reliability assessment plans with detailed lab support and milestone 
• Execute process and intrinsic device reliability qualification with various environmental chambers. Support and organize Rel test schedule, load/unload/clean, troubleshoot and daily operations.  Perform wafer level RF testing and ESD, power handling, thermal IR characterization with QFI instrument   
• Carry out data analysis of design DOE with excel/JMP software and provide feedback to cross functional teams
• Supervise technicians to coordinate, carry out and monitor progress on assigned reliability tasks by Engineer’s instructions 
• Develop automation scrips to improve operational efficiency, data analysis, plot and reports; Dig deeper into the data: skilled in developing and maintaining SW modules for on-the-fly data analytics. Review/Present/Explain/Expand the system-generated plots and data visualizations

Key areas of focus include:

• RF Characterization:
  • Developing and executing test plans to assess the switch device's performance across various operating frequencies, power levels, and environmental conditions.
  • Evaluating performance stability over extended stress periods.
• Wafer Level RF Testing:
  • Establishing and implementing procedures for performing critical RF reliability and performance tests early in the manufacturing process at the wafer level.
• ESD (Electrostatic Discharge) Characterization:
  • Designing and conducting ESD robustness tests (e.g., HBM, MM, CDM) to characterize the device's immunity to electrical stress events, a critical failure mechanism.
• Power Handling Characterization:
  • Assessing and validating the device's ability to reliably manage and sustain the high-power levels encountered in typical mobile tuner applications.
• Thermal IR Characterization:
  • Utilizing advanced instruments like QFI (Quantum Focus Instruments) or similar IR thermal imaging equipment to monitor heat distribution and hot thermal spots, ensuring the device operates within safe thermal limits under various stress conditions.
• Intrinsic Device Reliability Characterization:
  • Developing and executing tests to assess the long-term reliability of the underlying semiconductor IC process and package technologies used to construct the tuner switch.
• Advanced Life Testing:
  • Familiarity and direct experience with advanced life testing methodologies such as RF High-Temperature Operating Life (RF HTOL) and DC HTOL.
• Failure Analysis & Root Cause:
  • Leading troubleshooting efforts, conducting root cause analysis, and coordinating failure analysis activities with internal and external labs to drive continuous improvement in design and manufacturing processes.

Qualifications

Minimum Qualifications

• Degree in Electrical Engineering, Materials Science, or a related field. Bachelors and 12+ years of related experience or Master’s degree and 8+ years of related experience or PhD and 5+ experience and valid visa to work in the US .
• Minimum of 5 years of experience in semiconductor device reliability engineering, with a focus on RF or power conversion components.
• Proven experience in designing and executing reliability stress tests, including ESD, HTOL, and thermal testing.
• Strong analytical skills with the ability to interpret complex electrical and physical failure data.

Preferred Qualifications

• Direct experience with RF test equipment and measurement techniques (e.g., VNAs, power meters, spectrum analyzers).
• Expertise in RF/microwave semiconductor devices, preferably those used in wireless handsets (e.g., switches, filters, front-end modules).
• Familiarity with industry-standard reliability specifications and qualifications (e.g., JEDEC).
• Proficiency in statistical analysis tools (e.g., JMP, Minitab) for reliability data.

Compensation and Benefits

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.