As a Die / Clip Attach Technical Expert, you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes, including Pre-Assembly, Die Bond, Wire Bond, Mold, and related areas.
 

You will play a key role in driving equipment strategy, introducing advanced technologies, resolving complex technical challenges, and enhancing manufacturing performance in terms of cost, quality, and capability.

This role requires strong technical expertise, project leadership, and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.


What You Will Do

Equipment & Technology Strategy

• Define and drive equipment strategies aligned with factory and package R&D roadmaps

• Evaluate and select new equipment technologies for manufacturing processes

• Lead equipment introduction and qualification projects
   

Process Improvement & Technical Leadership

• Solve complex and chronic technical issues in manufacturing

• Drive improvement projects to enhance productivity, process capability, quality, and cost efficiency

• Develop and maintain process standards and design rules
   

Benchmarking & Best Practices

• Conduct cross-site benchmarking activities

• Implement best practices across manufacturing sites

• Scout and evaluate state-of-the-art technologies and industry solutions
   

Project Management & Collaboration

• Lead technical projects involving cross-functional and international teams

• Prepare technical reports, capability studies, and roadmaps

• Work closely with R&D, production, quality, and engineering teams
   

Industry & Market Awareness

• Stay updated on the latest semiconductor equipment and process technologies

• Build and maintain strong industry networks with suppliers and technology partners

What You Will Need

• Bachelor’s or master’s degree in engineering or a related discipline

• Minimum 10 years of experience in semiconductor manufacturing and process engineering

• Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations

• Proven experience in equipment selection, qualification, optimization, and technology introduction

• Strong analytical thinking with excellent troubleshooting and problem-solving capabilities

• Ability to work independently and drive improvement initiatives proactively

• Strong communication and presentation skills with the ability to engage stakeholders effectively

• Experience leading technical and cross-functional projects in a manufacturing environment

• Strong leadership, influencing, and stakeholder management skills

• Detail-oriented with a structured and systematic working approach

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.