Company

ASM

We need talented employees across many fields of interest – from R&D to IT and from Sales & Services to Manufacturing. So whether you're just beginning your career or already an experienced professional, take a look at where you could shine within our open roles.

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Offices (37)

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3 positions

Senior Engineer, Mechanical Engineering (Advanced Packaging)

ASM

Singapore SU5.New Products- Project Slate 1w ago

Principal Engineer, Hardware - Advanced Packaging

ASM

US > Arizona > Phoenix SU5.New Products- Project Slate 1mo ago

(Senior) Principal Engineer (Process and Hardware), Advanced Packaging

ASM

US > Arizona > Phoenix SU5.New Products- Project Slate 2mos ago

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Senior Engineer, Mechanical Engineering (Advanced Packaging)

ASM · Singapore

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SU5.New Products- Project Slate Singapore (ASM Front-End Mfg (S) Ltd) Posted Apr 27, 2026

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Job's mission

Join ASM’s Advanced Packaging team and lead the design and development of next-generation semiconductor process equipment. In this role, you will shape system architecture, drive automation strategies, and collaborate across functions to deliver innovative solutions. Your expertise will ensure projects meet the highest standards of safety, quality, and performance.

What you will be working on

Lead design and development of semiconductor vacuum systems, including equipment selection, process controls, and automation integration.
Develop and implement automation strategies using PLCs, SCADA, and related tools to optimize efficiency.
Manage project timelines, budgets, and resources while ensuring compliance with safety and quality standards.
Collaborate with cross-functional teams in manufacturing, operations, and quality to align on goals and deliverables.
Provide technical support and troubleshooting for equipment and automation systems, driving root cause analysis and resolution.
Own BOM release and maintenance, ensuring accurate documentation and reporting for stakeholders.
Drive continuous improvement initiatives and stay current with industry trends and emerging technologies.
Apply engineering principles and research data to create designs for semiconductor systems and products.
Perform engineering calculations for structural, thermal, and fluid dynamics challenges.
Create and revise CAD models and detailed drawings using Creo Parametric for components and assemblies.
Prepare comprehensive design documentation for manufacturing and testing of prototypes and production products.

What we are looking for

Bachelor's, Master’s or PhD in Mechanical Engineering or related field.
Minimum 8 years of experience in semiconductor equipment design, development, and automation.
Expertise in complex mechanical systems such as reactors, vacuum chambers, gas delivery systems, pneumatics, and cooling circuits.
Strong analytical and problem-solving skills with ability to lead innovative design concepts.
Experience with PLC programming and revision control tools such as Git.
Ability to work independently and collaboratively in a team environment.

What sets you apart

Experience with semiconductor capital equipment and metal deposition products.
Knowledge of CE, NFPA, Semi S2-95, and other relevant standards for semiconductor manufacturing equipment.
Familiarity with materials including metals, plastics, coatings, and finishes.
Proficiency in Microsoft applications, CREO, and AutoCAD.
Knowledge of ASME Y14.5 and/or ISO 1101:2017 geometric dimensioning and tolerancing.
Strong communication skills to present design concepts effectively to peers and management.
Ability to manage multiple priorities and meet aggressive deadlines while maintaining quality standards.

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

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Principal Engineer, Hardware - Advanced Packaging

ASM · US > Arizona > Phoenix

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SU5.New Products- Project Slate AZ Phoenix (ASM America Inc.) Posted Mar 26, 2026

Step into a career with ASM, where cutting edge technology meets collaborative culture.

As a Principal Engineer (Hardware), Advanced Packaging, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications. We are currently recruiting for multiple openings.

What you will be working on

Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions and surface preparation.
Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
Provide expert technical support for complex electro/mechanical equipment and computer systems.
Respond to and resolve issues escalated by first-line product support teams.
Report design, reliability, and maintenance problems to engineering teams for resolution.
Assist in customer installations and provide technical training as needed.
Deliver support for highly technical or sophisticated products to customers and users.
Travel globally up to 50% of the time to support field operations.

What we are looking for

Master’s or PhD in Mechanical or Electrical Engineering preferred
10+ years of combined education, research, and work experience in thin-film deposition and advanced packaging processes.
At least 5 years of experience in semiconductor process engineering or semiconductor equipment technology.
2-5 years of experience in customer support, product management, or product marketing roles.
Demonstrated knowledge of hardware to process dependencies and comfort with fingerprinting chamber / tool critical components
Proven experience in diagnosing and troubleshooting complex technical issues
Strong understanding of electro/mechanical equipment and software systems
Excellent problem-solving and analytical skills
Ability to communicate effectively with both technical and non-technical stakeholders
Strong presentation experience and skills
Willingness and ability to travel globally up to 50% of the time; local and international
Customer-focused mindset with the ability to manage challenging situations

Apply today to be part of what’s next.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

Ready to apply?

Apply to ASM

ASM

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(Senior) Principal Engineer (Process and Hardware), Advanced Packaging

ASM · US > Arizona > Phoenix

Apply now

SU5.New Products- Project Slate AZ Phoenix (ASM America Inc.) Posted Mar 6, 2026

Step into a career with ASM, where cutting edge technology meets collaborative culture.

As a (Senior) Principal Engineer (Process and Hardware), Advanced Packaging, you will play a key role in advancing ASM’s semiconductor process technologies. You’ll leverage your expertise in thin-film deposition and materials characterization to develop innovative solutions for next-generation devices. Your work will directly influence product performance and enable breakthroughs in logic, memory, and power applications. We are currently recruiting for multiple openings.

What you will be working on

Research, develop, and optimize semiconductor processes focused on Advanced Packaging including depositions and surface preparation.
Design and conduct complex experiments using DOE and RSM methodologies; interpret and analyze experimental data.
Collaborate with customers and marketing teams to define requirements and execute demonstrations.
Troubleshoot equipment issues through hands-on engagement and ensure successful product transfer to customers.
May supervise process engineering technicians and provide input on performance evaluations.
Provide expert technical support for complex electro/mechanical equipment and computer systems.
Respond to and resolve issues escalated by first-line product support teams.
Report design, reliability, and maintenance problems to engineering teams for resolution.
Assist in customer installations and provide technical training as needed.
Deliver support for highly technical or sophisticated products to customers and users.
Travel globally up to 50% of the time to support field operations.

What we are looking for

Master’s or PhD in Chemical Engineering, Materials Science, Mechanical or Electrical Engineering preferred
10+ years of combined education, research, and work experience in thin-film deposition and advanced packaging processes.
At least 5 years of experience in semiconductor process engineering or semiconductor equipment technology.
2-5 years of experience in customer support, product management, or product marketing roles.
Demonstrated knowledge of hardware to process dependencies and comfort with fingerprinting chamber / tool critical components
Ability to manage complex process development projects, including schedules, budgets, and personnel.
Proven experience in diagnosing and troubleshooting complex technical issues
Strong understanding of electro/mechanical equipment and software systems
Excellent problem-solving and analytical skills
Ability to communicate effectively with both technical and non-technical stakeholders
Strong presentation experience and skills
Willingness and ability to travel globally up to 50% of the time; local and international
Customer-focused mindset with the ability to manage challenging situations

Apply today to be part of what’s next.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

Ready to apply?

Apply to ASM

ASM

View all jobs →