Sobre esta vaga de FPGA DDR and IO Subsystem Architect na Altera
Job Details:
Job Description:
About Altera
Altera is a leading innovator in FPGA technology, delivering programmable solutions that power the world’s data-centric applications—from cloud and communications infrastructure to automotive, industrial, and edge AI. Our mission is to enable customers to accelerate innovation through high-performance, power-efficient, and easy-to-use FPGA platforms. At Altera, you’ll work alongside world-class engineers to architect next-generation silicon solutions that redefine performance, flexibility, and customer experience.
About the Role
As an FPGA DDR and IO Subsystem Architect, you will define and drive the architecture for next-generation high-speed external memory and general-purpose IO subsystems across Altera’s FPGA product portfolio. You will play a pivotal role in shaping differentiated memory and IO capabilities that enable industry-leading performance, power efficiency, and usability.
This is a highly visible technical leadership role requiring deep expertise in DDR and high-speed IO standards, silicon architecture, and cross-functional collaboration from early concept through production.
Responsibilities
Develop the architecture for Altera's High-Speed External Memory Interfacing and General IO Silicon Subsystem.
Apply deep knowledge of memory and non-memory IO applications such as DDR5, LPDDR5, MIPI, LVDS, and ONFI, as well as the competitive landscape, to architect Altera’s next-generation solutions.
Define subsystem-level specifications and detailed micro-architecture in collaboration with circuit design, PHY, controller, packaging, signal integrity, and system teams.
Own the solution lifecycle from early concept and feasibility analysis through silicon bring-up, validation, qualification, and production release.
Partner closely with the Altera Quartus software team to ensure best-in-class customer usability, performance tuning, configuration, and debug capabilities.
Drive architectural trade-off analysis across performance, power, area (PPA), cost, scalability, and reliability.
Lead technical reviews and provide guidance across RTL design, circuit design, verification, validation, packaging, and software teams to ensure architectural intent is realized in silicon.
Analyze competitive FPGA and ASIC IO/memory subsystem implementations to identify differentiation opportunities.
Engage with strategic customers and ecosystem partners to understand emerging requirements and influence future product roadmaps.
Salary Range
The pay range below is for Bay Area California only. Actual salary may vary based on a number of factors including job location, job-related knowledge, skills, experiences, trainings, etc. We also offer incentive opportunities that reward employees based on individual and company performance.
$200,400 - $286,000 USD
We use artificial intelligence to screen, assess, or select applicants for the position. Applicants must be eligible for any required U.S. export authorizations.
Qualifications:
Minimum Qualifications
Bachelor’s Degree (BE) or higher in Electrical Engineering.
10+ years of hands-on experience in RTL design and ASIC design flows, including synthesis and static timing analysis (STA).
Strong working knowledge of Verilog, SystemVerilog, C++, and Python.
Deep understanding of the latest SDRAM technologies with hands-on experience in DDR4/DDR5 and/or LPDDR4/LPDDR5 controller, PHY, and subsystem design.
Experience architecting and delivering high-speed external memory subsystems in advanced semiconductor process nodes.
Experience in silicon architecture definition, micro-architecture development, and system-level trade-off analysis.
Experience driving cross-functional collaboration across RTL design, circuit design, verification, validation, packaging, and software teams.
Experience in signal integrity, power integrity, timing closure, and high-speed interface validation methodologies.
Knowledge of general IO standards (such as MIPI, LVDS, ONFI, or similar) is desired.
Preferred Qualifications
Master’s or Ph.D. in Electrical Engineering or related discipline.
Experience with FPGA architectures and programmable IO subsystems.
Prior ownership of memory controller + PHY co-architecture and integration.
Experience collaborating with EDA/software teams to optimize tool flows, configuration, calibration, and debug.
Familiarity with advanced packaging technologies and multi-die integration.
Experience supporting silicon bring-up, lab characterization, and customer debug.
Strong communication and technical leadership skills with the ability to influence roadmap decisions.
