**Key Responsibilities**
- Assist in establishing and maintaining the Die Bond process  
- Monitor daily production to ensure process stability, yield, and quality performance  
- Conduct root cause analysis (RCA) of process issues and implement corrective and preventive actions
- Support new product introduction (NPI), including process setup, validation, and documentation  
- Optimize process parameters to improve yield, efficiency, and reliability  
- Collaborate with cross-functional teams (e.g., Production, Equipment, Quality, Innovation)  
- Analyze data and prepare process reports  
- Participate in continuous improvement projects (e.g., cost reduction, capacity increase)  

**Education & Qualifications**
- Bachelor’s or Master’s degree in a related field, including:  
  - Materials Science  
  - Chemical Engineering  
  - Mechanical Engineering  
  - Electrical / Electronic Engineering  
- Basic knowledge of semiconductor packaging processes is preferred  
- Strong analytical and problem-solving skills  
- Good communication skills and a team-oriented mindset  
- English proficiency: TOEIC score of 650 or above, or equivalent certification
 

More information about NXP in Greater China...