Sobre esta vaga de College Intern - Packaging Engineering na HP
Description -
What a College Intern - Packaging Engineering does at HP:
Support the design and development of packaging solutions for Ink Supplies products under the guidance of experienced packaging engineers.
Assist in creating packaging concepts, specifications, drawings, and documentation.
Participate in packaging validation and qualification activities, including testing for form, fit, function, shock, vibration, compression, and environmental performance.
Collect, analyze, and summarize test data; prepare reports and recommendations for engineering review.
Support packaging cost reduction, sustainability, and efficiency improvement initiatives.
Assist with qualification builds, manufacturing trials, and packaging implementation activities.
Collaborate with cross-functional teams, including Quality, Manufacturing, Procurement, Marketing, and NPI teams, to support project objectives.
Conduct research on packaging materials, emerging technologies, industry trends, and sustainability opportunities.
Maintain engineering documentation, packaging specifications, and project records.
Present project updates, findings, and recommendations to engineering teams as appropriate.
Individuals who do well in this role at HP, usually possess:
Currently pursuing a Bachelor's or Master's degree in Packaging, Mechanical, Industrial, Manufacturing Engineering, Materials Science or related.
Able to commit for a 5-6 months full time internship, starting in January 2027.
Previous internship, academic project, or laboratory experience related to packaging, product development, manufacturing, or testing.
Basic understanding of packaging design principles, materials, and manufacturing processes.
Interest in sustainability, circular economy principles, and environmentally responsible packaging solutions.
Strong analytical and problem-solving skills.
Ability to organize data, perform analysis, and draw practical conclusions.
Proficiency in Microsoft Office applications (Excel, PowerPoint, Word).
Familiarity with CAD tools (SolidWorks, Creo, NX, AutoCAD, TOPS, or similar) is a plus.
Ability to work collaboratively in a team environment.
Eagerness to learn and apply engineering fundamentals in a real-world setting.
Demonstrated initiative, adaptability, and attention to detail.
Sustainable impact is HP’s commitment to create positive, lasting change for the planet, its people, and our communities. This serves as a guiding principle for delivering on our corporate vision – to create technology that makes life better for everyone, everywhere.
HP is a Human Capital Partner – we commit to human capital development and adopting progressive workplace practices in Singapore.
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Job -
AdministrationSchedule -
Full timeShift -
No shift premium (Singapore)Travel -
Relocation -
Equal Opportunity Employer (EEO) -
HP, Inc. provides equal employment opportunity to all employees and prospective employees, without regard to race, color, religion, sex, national origin, ancestry, citizenship, sexual orientation, age, disability, or status as a protected veteran, marital status, familial status, physical or mental disability, medical condition, pregnancy, genetic predisposition or carrier status, uniformed service status, political affiliation or any other characteristic protected by applicable national, federal, state, and local law(s).
Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.
For more information, review HP’s EEO Policy or read about your rights as an applicant under the law here: “Know Your Rights: Workplace Discrimination is Illegal"
