Senior Engineer, Process Engineering | Global R&D Process Engineering Program

As a Senior Engineer, Process Engineering within ASM’s Global R&D Process Engineering Program, you will develop next‑generation semiconductor technologies. For the first 18 to 24 months, you will onboard into a comprehensive development program, combining structured learning with hands‑on work using ASM’s world‑leading semiconductor processing equipment. This phase is designed to accelerate technical depth, process mastery, and integration into ASM’s global R&D community.

Following the initial 18 to 24 months in the Global R&D Process Engineering Program, you will relocate to one of ASM’s state‑of‑the‑art R&D centers in Japan, Korea, or the United States (Arizona) for a permanent role. You will apply the technical depth and process expertise you have developed to advance new technologies at the core of one of ASM’s key business units, working closely with leading scientists, engineers, and product teams to translate innovation into industrial impact.

Take a closer look at the role:

• Work with semiconductor processing equipment to research, develop and optimize unit processes focused on the deposition of metal and dielectric films via ALD, PEALD, Epitaxy, and/or PECVD.
• Develop innovative ideas, staying abreast of state-of-the-art processing applications in the semiconductor industry to be effective.
• Process consulting, including writing technical papers on advanced process applications and Intellectual Property creation.
• Participate in and drive technical problem-solving sessions using the related scientific method and industry tools, such as Ishikawa diagrams.
• Design and conduct experiments, in addition to measuring and interpreting experimental output, aimed at fulfilling stated objectives using Design of Experiments (DOE) and Response Surface Methodology (RSM).
• Troubleshoot equipment problems and is personally and actively engaged in problem via “hands-on” modalities.
• Work directly customers and central marketing to understand and define requirements to successfully execute and document customer demonstrations.
• Develop methods and techniques for integrating metal and/or oxide films into existing and future device technologies.
• Ensure successful product transfer to customer base by performing demonstrations, traveling to support customer sites (up to 10% travel required), and drafting documentation regarding process development, tool operation and maintenance.
• Produce technical papers on process, equipment, and device integration improvement strategies and presents to professional audience.

Qualifications

• PhD degree in Chemical Engineering, Materials Science, Electrical Engineering, or Physics
• 0-7+ years of combined education, research, and work experience with:
• Cure, oxidation, ALD, CVD, Epitaxy, PECVD and/or other thin film deposition.
• Materials characterization techniques such as XPS, SIMS, RBS, AFM, XRR, XRD, TEM, SEM and ellipsometry.
• Knowledge of electrical characterization techniques for CMOS devices.
• Application of dielectric and/or metal films for logic and memory structures.
• Training in CFD (computational fluid dynamics), either theoretical or practical is preferred.
• Knowledge of electrical characterization techniques for CMOS devices is preferred

Skills

• Able to independently manage complex process development projects
• Creative problem solving with experience in developing new films for emerging applications and experience in chemistry/materials characterization.
• Understand interplay between hardware design (e.g., chemical reactor design) and operation and process outputs
• Understand of requirements for integration of metals as work function materials and barrier layers in FEOL and BEOL process flows
• Demonstrated ability to develop and completely characterize deposition processes using first principles and experimental design techniques (e.g., DOE, RSM).
• Experience with the theory, practice, and interpretation of materials characterization techniques such as XPS, SIMS, RBS, AFM, XRD, HRTEM, FESEM, Auger, Raman and ellipsometry.
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs

Work location & transfer requirements:

For your first 18-24 months, you’ll complete your training at one of our flagship process development hubs in Leuven (Belgium), in or Helsinki (Finland), Upon completion, you will transfer to one of our Key Product Unit (KPU) Process teams for a permanent role in ASM in either:

• Greater Tokyo, Japan,
• Phoenix, Arizona, US 
• Dongtan Semiconductor Valley, South Korea 

Why join ASM?

• Be part of ASM’s long‑term investment in R&D talent, with a program explicitly designed to accelerate your career through a program designed to develop future technical leaders within the organization.
• Be part of a globally respected, financially strong technology leader in ALD, with a strong, long‑term vision, a values‑driven culture, and a deep legacy of materials discovery and innovation backed by a defensible IP portfolio
• Process Engineering at ASM is rooted in scientific rigor and technical excellence, with original thinking, teamwork, and creation of high‑impact intellectual property driving technology roadmaps and real‑world innovation

Senior Process Engineer 3D Integration/Advanced Packaging 

ASM is a leading global supplier of products, services, and materials for semiconductor processing. For more than half a century, innovation has been at the core of everything we do. Our smart, ambitious people are dedicated to creating cutting-edge solutions for the world’s leading semiconductor providers. Every day we push the development of next-generation computer-chip technology, always staying a few steps ahead of what’s next.

he talented, enthusiastic people at ASM are just like you: dedicated to improving people’s lives and unlocking new potential. With our collaborative approach to R&D, we advance key semiconductor technologies and platforms like ALD, epitaxy, PEALD, PECVD, and vertical furnaces. And we have recently entered the promising high-growth market: silicon carbide epitaxy. Year after year, our innovations help to make chips smaller, faster, and more powerful. In fact, you will find our technology in every aspect of modern life: in AI, medical equipment, 5G, smartphones, autonomous driving, and more. 

We are looking for a talented individual to join our Corporate Research & Development Team in Helsinki, FINLAND. In the role of Senior Process Engineer we want you to learn, grow, and bring in your unique set of skills to develop groundbreaking innovations in the field of atomic layer deposition (ALD). You will work alongside your colleagues, putting your expertise in chemistry, material science and process engineering into action in order to innovate: From idea creation to integrated process flows, enabling us to make a difference and create value for our internal and external customers. Besides technical excellence, we are looking for people who share our values, help each other, and communicate clearly across teams and organizations. Your effort today will define the world of tomorrow.

Take a closer look at the responsibilities:

• Strategic Leadership: Spearhead the development and implementation of strategies for seamless device integration, ensuring unmatched performance and efficiency.
• Innovation Catalyst: Innovate and develop new thin film processes and applications in the areas of logic devices, interconnect, 3D integration and advanced packaging.
• Experimental Proficiency: Design and conduct experiments, measurements and drive conclusions out of complex experimental data sets.
• Process Optimization: Work hands-on with state-of-the-art semiconductor process equipment and optimize processes alongside the hardware for maximum efficiency.
• Collaborative Synergy: Communicate effectively with other ASM and customers R&D teams to understand and define requirements in order to successfully execute projects and demonstrations.
• Global Influence: Ensure successful product transfers to customers by performing demonstrations, knowledge transfer, and traveling when needed to support other ASM sites.

We could be a great match for each other if you have:

• A PhD degree in physics, chemistry, chemical engineering or materials science, preferably with a thesis related to the semiconductor (or adjacent industries)

• 3+ years of experience in semiconductor processing and/or device integration.
• Knowledge of 3D integration (W2W, D2W bonding) and/or advanced packaging applications (memory-on-memory, logic-on-memory, imager stacking, Low Temperature devices, ...) is preferred.
• Prior experience with thin film deposition techniques (e.g., ALD, CVD) and their characterization methods (e.g., CSAM, WCA, XPS, AFM, XRD, XRF, electrical characterization and ellipsometry)
• A pragmatic and hands-on approach combined with the ability to work independently. 
• Demonstrated understanding of semiconductor physics, processing equipment technology, device integration and/or advanced chemistries
• A curious mindset, able to synthesize the complex and drive pragmatic solutions forward.
• The Ability to plan, execute and communicate projects from beginning to end and across stakeholders.
• An empathic personality who adapts well with different cultures and working styles 
• Excellent verbal and written communication skills, with ability to clearly communicate advanced technical constructs.

Disclaimer: The internal job title for this role will be in line with our matrix structure and will depend on seniority.

We are looking for a talented individual to join our Corporate Research & Development Team in Helsinki, Finland. In the role of a Senior Engineer, Process Engineering we want you to learn, grow, and bring in your unique set of skills to help us in developing groundbreaking innovations in the field of atomic layer deposition (ALD). You will work alongside your colleagues, putting your expertise in chemistry, material science and process engineering into action in order to innovate: From idea creation to integrated process flows, enabling us to make a difference to and create value for our internal and external customers. Besides technical excellence, we are looking for people who share our values, help each other, and communicate clearly across teams and organizations. Your effort today will define the world of tomorrow.

Take a closer look at the responsibilities

• Innovate and develop new thin film processes and applications in the areas of logic, memory, analog and power
• Design and conduct experiments, measurements and drive conclusions out of complex experimental data sets
• Work hands-on with state-of-the-art semiconductor process equipment and optimize processes alongside the hardware for maximum efficiency
• Communicate effectively with other ASM and customers R&D teams to understand and define requirements in order to successfully execute projects and demonstrations
• Ensure successful product transfers to customers by performing demonstrations, knowledge transfer, and traveling when needed to support other ASM sites

We could be a great match for each other if you have:

• A PhD degree in physics, chemistry, chemical engineering or materials science, preferably with a thesis related to the semiconductor (or adjacent industries)
• Prior experience with thin film deposition techniques (e.g., ALD, CVD) and their characterization methods (e.g., XPS, AFM, XRD, XRF, electrical characterization and ellipsometry)
• Demonstrated understanding of semiconductor physics, processing equipment technology, and/or advanced chemistries
• A curious mindset, able to synthesize the complex and drive pragmatic solutions forward
• Ability to plan, execute and communicate projects from beginning to end and across stakeholders
• The passion and drive to take charge of your career, grabbing professional and personal development opportunities with both hands.

Why choose a career at ASM?

We offer you an interesting opportunity to be part of innovative and truly international team in Helsinki. Our office is located on the Kumpula campus of University of Helsinki, easily accessible by public transportation. We have flexible working hours and a hybrid working model. Our comprehensive range of benefits include for example meal vouchers, occupational healthcare and medical and life insurances. We also offer extensive relocation support for candidates located outside of Finland. 

Join ASM as a Senior Engineer I, Equipment Engineering and become a key contributor at the forefront of semiconductor innovation! In this hands‑on, technology‑rich role, you’ll work directly with our advanced thermal and plasma ALD systems, ensuring the tools that enable next‑generation chip manufacturing perform at their best every day. You’ll be part of an expert R&D and engineering environment - digging into complex mechanical, electrical, pneumatic, and vacuum systems; troubleshooting precision tools; and supporting engineers on high‑impact hardware and process challenges. Whether you’re investigating alarms, performing preventive maintenance, helping install new equipment, or driving root‑cause analysis, your work directly supports ASM’s reputation for world‑class reliability and performance.

If you love solving problems, working with sophisticated high‑tech equipment, and contributing to innovations that power phones, cars, data centers, and more, this role puts you at the heart of it. You’ll grow your skills, collaborate with highly skilled engineers, and make a measurable impact on technology used around the world - all while learning from the best in the industry.

Key Responsibilities

• Perform preventive and corrective maintenance of thermal and plasma ALD equipment
• Collaborate with Process Engineers to resolve hardware and process related issues
• Conduct root cause analysis and implement effective solutions for equipment failures
• Support the installation and qualification of new equipment and facility upgrades
• Assist in spare parts and chemical inventory management
• Document completed work with clear and concise technical reporting
• Ensure compliance with safety and clean room protocols

Skills

We are looking for someone who has the following knowledge and experience:

• Bachelor’s degree or higher in the field of engineering or science with +1 years of relevant experience
• Understanding of vacuum technology and mechanical systems (e.g., gas lines, heaters, pumps)
• Experience working with chemicals is a plus
• Familiarity with thin film deposition techniques such as ALD and PECVD is a plus
• Awareness of safety measures of working in semiconductor environment
• Ability to read and interpret technical drawings and process flow diagrams
• Strong analytical and troubleshooting skills
• Fluent written and verbal communication skills in English is required

Join ASM as a Technician II, Equipment Engineering and become a key contributor at the forefront of semiconductor innovation! In this hands‑on, technology‑rich role, you’ll work directly with our advanced thermal and plasma ALD systems, ensuring the tools that enable next‑generation chip manufacturing perform at their best every day. You’ll be part of an expert R&D and engineering environment - digging into complex mechanical, electrical, pneumatic, and vacuum systems; troubleshooting precision tools; and supporting engineers on high‑impact hardware and process challenges. Whether you’re investigating alarms, performing preventive maintenance, helping install new equipment, or driving root‑cause analysis, your work directly supports ASM’s reputation for world‑class reliability and performance.

If you love solving problems, working with sophisticated high‑tech equipment, and contributing to innovations that power phones, cars, data centers, and more, this role puts you at the heart of it. You’ll grow your skills, collaborate with highly skilled engineers, and make a measurable impact on technology used around the world - all while learning from the best in the industry.

Key Responsibilities

• Perform preventive and corrective maintenance on thermal and plasma ALD equipment.
• Troubleshoot mechanical, electrical, pneumatic, and vacuum‑related issues on R&D tools.
• Assist equipment and process engineers in resolving hardware and process-related problems.
• Conduct basic root cause analysis and implement corrective actions under engineer guidance.
• Support installation, modification, and qualification of new equipment and facility upgrades.
• Monitor tool status, alarms, and performance; escalate issues appropriately.
• Assist in spare parts, consumables, and chemical inventory management.
• Maintain accurate documentation of maintenance activities, tool status, and repair actions.
• Follow all required cleanroom, safety, and chemical handling protocols.

Skills & Qualifications

Ideally, we’re looking for someone with:

•  Associates' degree in electronics, mechatronics, mechanical engineering, automation, chemical engineering or a related field.
• 1+ years of hands‑on experience working with complex equipment, high‑precision tools, or automation systems.
• Basic understanding of vacuum systems, pumps, gas lines, heaters, valves, and related mechanical assemblies.
• Experience working with chemicals or in a semiconductor cleanroom is considered an advantage.
• Familiarity with thin‑film deposition techniques (ALD, PECVD) is a plus.
• Ability to read and interpret mechanical schematics, wiring diagrams, and P&IDs.
• Strong analytical, troubleshooting, and problem‑solving skills.
• Good communication skills and fluency in English (written and verbal).