Jobs Companies D Fendsolutions Lead Hardware Systems Architect & Tech Lead

À propos de ce poste Lead Hardware Systems Architect & Tech Lead chez D Fendsolutions

D Fendsolutions · Sur site · Raanana, Center District
At D-Fend Solutions, our people are our greatest strength — and technology is our passion. Our team of innovators and subject matter experts, including veterans of elite military intelligence technology units, is transforming the way organizations protect themselves from drone threats.

As the global leader in cyber-takeover counter-drone technology, we design and deliver advanced, software-defined solutions that empower our customers to detect, take control, and safely land unauthorized drones — with precision and reliability.

Every day, we push the boundaries of innovation to meet real-world security challenges across industries and environments. We’re proud of our cutting-edge technology, our global reach, and the impact we make in securing the skies.

We’re seeking passionate professionals who thrive in a fast-paced, creative, and collaborative environment — those who want to be part of the next generation of airspace security innovation.

Join D-Fend Solutions and help make the world a safer place.
Become a D-Fender! Work with the world’s leading cyber-takeover counter-drone technology provider and shape the future of safe airspace.

We are seeking a high-caliber, multidisciplinary Hardware Systems Architect & Tech Lead to serve as the technical cornerstone of our hardware development and system integration.
 
In this role, you will bridge high-level system requirements with physical deployment reality, acting as the designated "Tech Lead" driving day-to-day engineering execution.
 
This role demands a "System of Systems" mindset. Beyond engineering our core SDR and RF hardware architectures, you will orchestrate the physical, logical, and electrical integration of complex tactical sensor suites - incorporating software-defined radios, active/passive radar arrays, electro-optical (EO/IR) cameras, and jamming payloads.
 
You will steer the hardware through its entire lifecycle (PLCM) while implementing flawless Design for Excellence (DFx) frameworks.

KEY RESPONSIBILITIES:

  • System of Systems Integration: Architect, model, and define hardware-level interfaces and high-speed data flow paths for multi-sensor integration (SDR, Active/Passive Radar, EO/IR Cameras, and RF Jamming payloads).
  • Requirements Definition: Translate high-level operational and product demands into detailed, actionable hardware and system-level requirements, Interface Control Documents (ICDs), and structural specifications.
  • System Modeling: Establish and manage rigorous physical power, thermal, high-speed data bandwidth, and RF link budgets for deeply integrated tactical configurations.
  • Technical Ownership: Direct day-to-day engineering activities, lead comprehensive design reviews, and serve as the final authority on architectural and hardware design trade-offs.
  • Product Lifecycle Management (PLCM): Guide hardware products smoothly through the entire lifecycle—from early concept and prototyping to mass production, validation, field deployment, and subsequent obsolescence management.
  • Cross-Functional Orchestration: Align and coordinate specialized teams across RF/Analog, high-speed digital, FPGA, embedded software, and mechanical engineering to achieve seamless hardware/software synergy.
  • Test Strategy Definition: Architect and define the end-to-end testing, verification, and validation (V&V) strategy for complex hardware-software systems.
  • Progressive Integration: Design and oversee methodical integration plans, successfully migrating subsystems from standalone bench testing to full "System of Systems" integration.
  • System Verification: Oversee high-reliability Hardware-in-the-Loop (HIL) testing, RF performance verification, and automated test regression setups.
  • Operational Validation: Partner with field testing and QA teams to design real-world tactical validation scenarios (including drone flight trials and complex RF interference environments) to ensure top performance in the field.
  • DFx Implementation: Drive critical design decisions optimizing for manufacturability (DFM), automated testing (DFT), reliability (DFR), and target cost (DFC) without sacrificing tactical performance.
  • Tactical Ruggedization: Ensure all physical architectures are designed to withstand harsh outdoor deployments, aligning with rigorous international and military standards (MIL-STD-810G, IP66/67, and MILSTD-461 EMI/EMC).

  • REQUIREMENTS & QUALIFICATIONS

  • Education: B.Sc. in Electrical Engineering, Electronic Engineering, Systems Engineering, or a related discipline.  M.Sc. is highly preferred.
  • Experience: 10+ years of hardware and systems engineering experience, including a minimum of 4+ years
    leading complex technical projects or driving system architecture.
  • Industry: Proven track record of shipping defense, aerospace, or advanced commercial telecom/tactical rugged systems to market.
  • SDR & Core Hardware Foundations: Strong hands-on background in high-performance digital and RF design.
    Proficient in selecting, configuring, and integrating SoCs, FPGAs (e.g., AMD/Xilinx Zynq UltraScale+, RFSoC), RF transceivers, and high-speed converters.
  • Multi-Sensor Systems: Deep practical experience integrating diverse hardware subsystems (e.g., SDR sensors, active radar systems, EO/IR cameras, tactical communication networks, and RF jamming architectures).
  • Systems Engineering Mastery: Expert capability in technical writing, formal requirements management, writing complex ICDs, and performing SWaP-C (Size, Weight, Power, and Cost) optimizations.
  • IV&V Methodologies: Thorough understanding of Hardware-in-the-Loop (HIL) testing, environmental stress screening (ESS), and field testing protocols for complex RF products.
  • PLCM & Design Tools: Practical experience working with modern Product Lifecycle Management (PLM) tools, CAD/EDA tools, and implementing structured hardware release flows.
  • Electrical Integrity: Solid comprehension of high-efficiency Power Distribution Networks (PDN), thermal dissipation strategies, and high-speed PCB stack-up design.
  • Assertive Project Driver: Natural capability to lead and inspire highly specialized R&D teams, resolve technical disputes objectively, and maintain high project execution velocity.
  • Strategic Communicator: Outstanding capacity to articulate deep, complex multi-system technical challenges into structured, actionable items for engineering teams and concise strategic summaries for executive leadership.
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