As Product Marketing Manager for Advanced Packaging, you will own the go-to-market strategy and product positioning for Wolfspeed's SiC substrate portfolio in 2.5D and 3D packaging for high-performance computing (HPC) and AI data center applications. Building on Wolfspeed's 35+ years of SiC materials leadership and an established set of proven use cases, you will define how we articulate SiC's value — across heat spreaders and carriers, passive and active interposers — to hyperscalers, foundries, OSATs, and EDA ecosystem partners. You will translate deep market and customer requirements into a compelling roadmap and messaging, and work closely with the same partners and customers to shape demand for next-generation architectures. The ideal candidate combines a strong technical grasp of advanced packaging with proven product-marketing, market-analysis, and storytelling skills.

The ideal candidate will be located in the US.

Key Responsibilities

• Own product positioning, messaging, and value propositions for the SiC advanced-packaging portfolio, tailored to hyperscalers, foundries, OSATs, and EDA partners.
• Define and maintain the go-to-market strategy and launch plans for new SiC packaging products, interposer specifications, and PDK enhancements, in partnership with product management and applications engineering.
• Conduct market sizing, competitive analysis, and use-case prioritization — benchmarking SiC against competitive materials — and proactively identify and champion new SiC applications.
• Engage closely with partners, customers, and foundries to validate requirements, shape demand, and co-develop the narrative for next-generation packaging architectures.
• Build sales-enablement assets, reference materials, and competitive collateral; support training for Wolfspeed sales teams, foundry partners, and EDA ecosystem players on SiC value and design guidelines.
• Develop and deliver thought-leadership content at packaging industry conferences and tradeshows and ecosystem partner workshops.
• Feed consolidated customer and market requirements back to product management and R&D to guide the SiC packaging roadmap.

Qualifications

• Bachelor's Degree in Electrical Engineering, Materials Science, Marketing, or equivalent; technical degree with marketing experience (or MBA) preferred.
• Deep industry know-how on the requirement side — an insider's understanding of how hyperscalers, foundries, and OSATs specify advanced packages
• Strong understanding of wide band-gap materials
• Ability to communicate SiC's technical value proposition (thermal conductivity, mechanical robustness, RF performance) to both engineering and executive audiences at foundries, OSATs, and chip designers.
• Exceptional negotiation, communication, and executive relationship-building skills.
• Willingness to travel globally.
• Passion for building breakthrough growth in an emerging, technically complex market.