The Role 

As part of the Embedded Software team, you will help build the critical software foundation that powers the Cerebras Wafer Scale Engine (WSE)—the world’s largest AI processor. Our team owns a diverse range of embedded and system level components that enable the WSE to operate reliably at scale, including microcontroller firmware, wafer level monitoring logic, system administration services, and the Linux platform and BSP layers that keep the entire system running smoothly. 

This role exists at the intersection of embedded systems, platform engineering, and distributed system enablement. As our technology and deployments continue to scale, we are expanding the team with versatile engineers eager to work across multiple layers of the software stack. You will help build administrative services that connect the WSE’s system software to cluster-level orchestration, collaborate closely with hardware and ASIC teams, and contribute to the robustness, visibility, and operability of our next-generation AI systems. 

Responsibilities    

• Develop administrative software that enables communication between system-level software and cluster-level control layers. 
• Provide and extend Linux BSP support, ensuring reliability and maintainability of system level platform components. 
• Collaborate across teams to gather requirements, define scope, plan milestones, and deliver high-quality implementations. 
• Work closely with datacenter operations and debug teams to diagnose system level issues, root cause failures, and implement fixes. 
• Partner with hardware and ASIC teams to design and implement software that monitors system hardware and wafer level behavior. 
• Contribute to improving system reliability, observability, and long-term maintainability across layers of the embedded stack. 
• Participate in code reviews, design discussions, and cross-team technical planning. 

Skills & Qualifications    

Minimum Qualifications 

• Bachelor’s degree in computer engineering, Electrical Engineering, Computer Science, or related field. 

• 5+ years of experience in building production-quality software in C++ or Golang. 

• Solid understanding of embedded systems fundamentals or system hardware interactions. 

• Experience working in cross-functional engineering environments. 

Preferred Qualifications 

• Master’s degree in computer engineering, Electrical Engineering, Computer Science, or related field. 

• Exposure to distributed systems, cluster-level orchestration, or datacenter environments. 

• Familiarity with Linux kernel concepts, device drivers, or BSP layers. 

• Experience debugging hardware/software interactions using tools such as logic analyzers, JTAG, or profiling/tracing frameworks. 

• Experience contributing to system monitoring, observability tooling, or hardware level telemetry pipelines. 

The base salary range for this position is $175,000 to $275,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Job Summary

We are seeking an experienced System Signal Integrity and Power Integrity Engineer to solve complex, high‑impact integrity challenges in next‑generation AI compute systems. This role is focused on deep technical analysis and hands‑on problem solving across high‑speed interfaces, power delivery networks, rigid and flex interconnects, and advanced packaging.

The ideal candidate is a technical expert engaged to resolve difficult SI/PI problems spanning silicon, package, PCB, flex, and connector domains.

Key Responsibilities

• Solve complex signal integrity and power integrity problems for high‑speed AI compute platforms, including chip‑to‑chip and chip‑to‑board interfaces.
• Perform advanced pre‑layout and post‑layout SI/PI analysis across PCBs, flex circuits, rigid‑flex assemblies, connectors, and advanced packages.
• Lead root‑cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation‑to‑hardware mismatches.
• Analyze and resolve SI/PI challenges associated with flex circuits, high‑speed flex connectors, interposers, and advanced packaging technologies.
• Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation to resolve performance and stability issues.
• Define and refine PCB, rigid‑flex, and flex circuit stack‑ups, material selections, and impedance structures as required to meet performance targets.
• Review schematics, PCB layouts, and flex designs to identify SI/PI risks and recommend targeted design changes.
• Work closely with silicon and package design teams to resolve SI/PI issues related to bump/ball assignments, package‑to‑PCB transitions, and interface interactions.
• Act as a technical escalation point for complex SI/PI issues across multiple programs.

Minimum Qualifications

• Master’s degree in Electrical Engineering.
• 10+ years of demonstrated depth of expertise in system-level signal integrity and power integrity engineering for high‑speed hardware systems.

Required Experience and Skills

• Deep expertise in high‑speed serial and parallel interface analysis and debug.
• Strong hands‑on experience with PCB, rigid‑flex, and flex circuit stack‑up design and analysis.
• Advanced SI/PI analysis of flex connectors, high‑density interconnects, and advanced packaging technologies.
• Proficiency with 2D and 3D electromagnetic simulation tools.
• Power delivery network analysis, simulation, and lab correlation at the system level.
• Strong grounding in transmission line theory, microwave engineering, and high‑speed design fundamentals.
• Proven ability to correlate simulation results with hardware behavior and drive concrete design fixes.

Additional Information

Experience with large‑scale AI or high‑performance compute systems is preferred.

The base salary range for this position is $225,000 to $275,000 annually. Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

The Role

Cerebras is seeking a Commissioning Lead to own the end-to-end commissioning and readiness of AI data center infrastructure across colocation environments. This role is responsible for ensuring all systems are tested, validated, and fully operational prior to handover, with zero tolerance for failures in mission-critical environments. You will operate with high ownership in a fast-paced startup environment, driving commissioning execution across multiple concurrent sites and ensuring rapid, reliable capacity bring-up.

Responsibilities

• Lead commissioning strategy and execution across all colo data center deployments.

• Own full lifecycle commissioning from Level 1–5 testing through integrated systems testing (IST).

• Develop and enforce commissioning plans, scripts, and procedures.

• Coordinate with construction, engineering, vendors, and colo providers to ensure readiness.

• Oversee testing of electrical systems (switchgear, UPS, generators), mechanical systems (cooling), and IT infrastructure.

• Ensure all systems meet design intent, performance requirements, and reliability standards.

• Drive issue identification, resolution, and closure prior to handover.

• Manage commissioning agents, vendors, and third-party testing teams.

• Establish standardized commissioning processes for repeatable deployments.

• Track and report commissioning progress, risks, and readiness to executive leadership.

• Ensure all documentation, test results, and turnover packages are complete and accurate.

• Validate base building readiness from colo providers prior to fit-out energization.

• Coordinate integration between landlord systems and tenant infrastructure.

• Ensure alignment on power availability, redundancy, and cooling capacity.

• Resolve interface issues between colo infrastructure and Cerebras systems.

• Hold providers accountable for performance during testing and energization.

Skills & Qualifications

• 10–15+ years of experience in commissioning of mission-critical facilities.

• Deep expertise in data center electrical and mechanical systems.

• Experience leading Level 1–5 commissioning for large-scale projects.

• Strong understanding of high-density compute environments.

• Experience working in colo environments and coordinating landlord/tenant interfaces.

• Proven ability to manage multiple sites and fast-track deployments.

• Strong troubleshooting and problem-solving skills.

• Ability to operate in a fast-paced, high-growth startup environment.

• Excellent communication and stakeholder management skills.

Location: Remote, USA

The base salary range for this position is $220,000 to $260,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

The Role

Cerebras is seeking a Network & Fiber Engineer to lead the design, deployment, and validation of high-performance network and fiber infrastructure across colocation data centers. This role is critical to enabling AI-scale compute clusters by ensuring low-latency, high-throughput connectivity between racks, data halls, and external networks. You will operate with high ownership in a fast-paced startup environment, working closely with construction, commissioning, and IT teams to bring network infrastructure online quickly and reliably.

Responsibilities

• Own end-to-end fiber and network infrastructure deployment across colo data center sites.

• Design fiber pathways, structured cabling systems, and high-density fiber distribution architectures.

• Oversee installation of fiber (SMF/MMF), patch panels, trays, and cable management systems.

• Coordinate with construction and commissioning teams to align network readiness with overall site delivery.

• Validate fiber installations including testing (OTDR, insertion loss, continuity).

• Support deployment of network hardware including switches, routers, and interconnects.

• Ensure low-latency, high-bandwidth connectivity across racks and clusters.

• Develop and maintain standards for fiber design, labeling, and documentation.

• Troubleshoot network and fiber issues during deployment and post-handover.

• Manage vendors, installers, and low-voltage contractors.

• Track progress, risks, and readiness across multiple sites.

• Coordinate with colo providers for meet-me room (MMR) connectivity and cross-connects.

• Ensure alignment on demarcation points and handoff standards.

• Manage external connectivity including ISP, dark fiber, and backbone integration.

• Validate provider fiber infrastructure and resolve interface issues.

Skills & Qualifications

• 7–12+ years of experience in network and/or fiber engineering in data centers or telecom environments.

• Strong experience with fiber design, installation, and testing (OTDR, power meter).

• Familiarity with high-density fiber systems (MPO/MTP).

• Experience deploying and troubleshooting network infrastructure.

• Understanding of data center architectures and high-performance computing environments.

• Experience working in colo environments is highly preferred.

• Ability to manage multiple concurrent deployments.

• Strong problem-solving and troubleshooting skills.

• Excellent communication and coordination abilities.

Location: Remote, USA

The base salary range for this position is $250,000 to $290,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

The Role

Cerebras is seeking a Director of Procurement to lead sourcing, contracting, and supply chain execution for data center infrastructure and critical equipment. This role is responsible for securing capacity, negotiating commercial terms, and ensuring timely delivery of long-lead equipment to support rapid AI infrastructure deployment.

You will operate with high ownership in a fast-paced startup environment, driving both strategic supplier partnerships and tactical execution across multiple concurrent builds.

Responsibilities  

• Own procurement strategy for all data center equipment including electrical, mechanical, and IT infrastructure.
  • Lead sourcing and contracting for major equipment packages (switchgear, transformers, UPS, generators, cooling systems, racks).
  • Negotiate commercial terms, pricing, lead times, and risk allocation with suppliers and contractors.
  • Develop and manage master service agreements (MSAs), purchase agreements, and vendor contracts.
  • Drive cost optimization while maintaining speed and quality of delivery.
  • Partner with construction and engineering teams to align procurement with deployment schedules.
  • Manage supplier performance, ensuring on-time delivery and quality compliance.
  • Identify and mitigate supply chain risks, including long-lead constraints and market volatility.
  • Build strategic relationships with key OEMs and vendors.
  • Establish scalable procurement processes, tools, and reporting mechanisms.
  • Track and forecast spend across multiple projects and regions.
• Lead contract negotiations for EPCs, GCs, and major vendors.
  • Define contract structures that align incentives with schedule and performance outcomes.
  • Manage change orders, claims, and commercial disputes.
  • Ensure clear scope definition and risk allocation across all agreements.
  • Standardize contract templates for rapid deployment across multiple sites.
  • Partner with legal and finance to ensure compliance and governance.

Skills & Qualifications  

• 12–15+ years of experience in procurement, sourcing, or supply chain for large-scale infrastructure projects.
  • Strong experience in data center, mission-critical, or industrial environments.
  • Deep knowledge of electrical and mechanical equipment supply chains.
  • Proven ability to negotiate complex, high-value contracts.
  • Experience managing global suppliers and multi-site programs.
  • Strong financial acumen and cost management expertise.
  • Ability to operate in a fast-moving, ambiguous startup environment.
  • Excellent stakeholder management and communication skills.

Location: Remote, USA

The base salary range for this position is $280,000 to $350,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Responsibilities 

• Lead printed circuit board design through all development stages: from definition to implementation, bring-up, qualification, and production release. 

• Full responsibility for electrical specification, schematic design, components selection, and layout considerations. 

• Extensive lab bring-up and debugging, including developing automated benchtop setups for board characterization. 

• Collaborate with various design and operations teams: manufacturing operations & test engineering, supply chain, ASIC, mechanical, signal integrity, power delivery, layout, embedded & diagnostic, etc. 

Skills & Qualifications 

• B.S.c, M.S.c, or Ph.D. degree in electrical engineering, or equivalent experience. 

• 5 to 10 years of experience as a board design engineer (exceptional candidates with other experience levels will also be considered). 

• Experience with digital circuits, power delivery, voltage regulators, and high-speed signal integrity. 

• System-level understanding and familiarity with production environment. 

• Proficiency with lab/test scripting SW (e.g., Python). 

• Personal skills: self-instruction, multi-disciplined, multi-tasking and good interpersonal relationship. 

The base salary range for this position is $150,000 to $260,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Location: Sunnyvale, California

About the Role 

As a Full Stack Engineer focusing on Cerebras’ manufacturing test platform, you will design, build, and maintain a comprehensive test software solution for all stages of manufacturing – from individual components to complete Cerebras systems. You will collaborate cross-functionally with hardware design, engineering, operations, and data analytics teams to develop user interfaces and data processing frameworks that directly impact manufacturing efficiency, quality, and scalability. 

Responsibilities 

• Collaborate with hardware engineers and test developers to create frameworks that facilitate the development, validation, and deployment of manufacturing tests. 

• Create an intuitive, functional, and flexible user interface for executing a wide variety of manufacturing tests. 

• Create a distributed data storage framework to sync test data across multiple manufacturing facilities. 

• Collaborate with data engineers and data scientists to create interactive reports for visualizing test results. 

• Support cross-functional initiatives across manufacturing, operations, and reliability teams to improve manufacturing efficiency, quality, and scalability throughout the entire product lifecycle. 

Skills and Qualifications 

Required 

• Bachelor’s degree in computer science, computer engineering, or related field. 

• 3+ years of professional experience in full-stack software development. 

• Strong proficiency in at least one advanced programming language (e.g. Python, C++). 

• Experience with SQL databases (e.g. PostgreSQL, MySQL) and/or NoSQL databases (e.g. MongoDB, Redis). 

• Experience with front-end technologies and frameworks (e.g. HTML, JavaScript). 

Preferred 

• Experience with hardware manufacturing and/or related disciplines such as manufacturing test automation, manufacturing software, or manufacturing quality control. 

• Experience with application development in Windows and/or Linux. 

• Experience with cloud platforms (e.g. AWS, GCP). 

• Experience with data engineering, data analytics, and/or business intelligence. 

• Experience with UI/UX. 

• Experience with networking and cybersecurity. 

The base salary range for this position is $175,000 to $220,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Role Summary

We are seeking a hands‑on DVT Technical Lead (Individual Contributor) to own and drive the Design Validation Test (DVT) process end‑to‑end across complex electrical engineering boards and full systems. You will define validation strategy, build test plans and infrastructure, lead deep debug and root‑cause analysis (RCA), and drive closure through design changes and re‑test. The domain includes difficult power delivery technology, fast high‑speed I/O, and electro‑mechanical systems with thermal, optics, and high‑power constraints. People management is not required (mentoring is a plus).

What You’ll Own

1) Board / Subassembly DVT (EE-heavy)

• Own DVT for complex PCBAs and subassemblies from first power‑on through design sign‑off.
• Power validation: power‑up/down sequencing, regulator/hotswap behavior, rail margining, DC IR drop, and AC noise/ripple characterization.
• Clock distribution validation and high‑speed I/O interface validation (e.g., Ethernet/PCIe-class links, board‑to‑board connectors and cabling).
• Low‑speed system management interface validation (e.g., I2C/SPI/USB) and debug of intermittent or systemic failures.
• Stress/environmental testing (extended runtime, temperature cycling) and characterization under margined conditions.

2) System-level DVT (integration + electro-mechanical)

• Own system integration validation planning and execution across representative configurations and operating envelopes.
• Drive readiness and execution across lab and chamber environments, including dependency management (test scripts, instrumentation, SW readiness, sample availability).
• Validate and debug system-level issues spanning electrical, mechanical, thermal, and optics interactions.
• Partner with reliability and manufacturing teams to ensure DVT coverage supports ramp readiness and reduces escapes.

Key Responsibilities

DVT Strategy, Plans, and Coverage

• Define a risk‑based DVT strategy spanning board/subassembly engineering validation through system integration validation.
• Author and maintain DVT plans, procedures, and reports with crisp pass/fail criteria and coverage rationale.
• Establish stage gates and readiness reviews for execution quality (fixtures, instrumentation, scripts, SW readiness).

Hands-on Validation, Debug, and Closure

• Build and own benchtop and rack-level validation setups that are repeatable and automation‑friendly.
• Lead RCA for validation failures; drive corrective actions with design teams; verify fixes through re‑test and data review.
• Execute and interpret power integrity/stability measurements (voltage/current stability, droop, ripple/noise, IR drop) and close gaps to requirements.
• Validate high‑speed interconnect performance and margin; isolate failures across channel, connector/cable, PHY, and firmware/diagnostics layers.

DVT Infrastructure, Automation, and Data

• Partner with diagnostics/software to improve DVT throughput via scripting, logging, and standardized test stages.
• Define required data capture and reporting standards to accelerate debug and support release gating.
• Drive continual improvements to test coverage, efficiency, and repeatability across builds.

Cross-functional Technical Leadership

• Align EE/ME/FW/Diagnostics/Reliability/Manufacturing on priorities, schedules, and closure criteria.
• Influence design-for-testability improvements (debug visibility, margining hooks, instrumentation points, serviceability).

Minimum Qualifications

• BS/MS in Electrical or Computer Engineering (or equivalent experience).
• 8–15+ years of hardware validation/DVT experience on complex board and system-level products.
• Demonstrated ownership of board bring‑up and DVT execution: test plan creation, instrumentation, debug, and closure.
• Strong background in power delivery validation and measurement (sequencing, margining, droop, ripple/noise, IR drop).
• Strong background in high‑speed I/O validation and debug (PCIe/Ethernet‑class links; channel and system-level troubleshooting).
• Proficiency with lab equipment: oscilloscopes, logic analyzers, power supplies/analyzers, DC electronic loads; VNAs/BERTs as applicable.
• Strong written and verbal communication; ability to present results and drive decisions with data.

Preferred / Nice-to-Have

• Experience with rack-scale and/or liquid-cooled systems; validation in environmental chambers.
• Experience supporting compliance/safety/EMC efforts as part of DVT readiness.
• Python (or similar) for test automation and data analysis; experience integrating results into dashboards/CI workflows.
• Experience mentoring engineers/technicians as an informal technical leader.

Success Measures

• DVT plans are complete, prioritized, and executable; coverage gaps are explicit and tracked to closure.
• Validation failures convert quickly into RCAs and verified fixes; DVT becomes repeatable and less “heroic.”
• Power delivery and high-speed I/O risks are discovered early and do not surprise late in system integration.
• Test automation/data capture improves cycle time and increases confidence in release gating.

Location :Sunnyvale, California

The base salary range for this position is $175,000 to $275,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

Role Overview 
As a Software Engineer specializing in automation, you will play a key role in designing and delivering software solutions that improve operational efficiency and streamline business processes. You will develop automation frameworks, tools, and applications that reduce manual effort, enhance system reliability, and support scalable growth across the organization. 

In this role, you will collaborate closely with cross functional teams—including engineers, analysts, and business stakeholders—to understand workflow challenges and identify opportunities for automation. Your work may involve building process automation systems, develop real-time monitoring and alerting capabilities, integrating disparate systems, and creating data driven solutions to optimize performance. 

Your contributions will help eliminate bottlenecks, reduce operational costs, and enable teams to focus on higher value activities. Ideal candidates have strong software engineering fundamentals, experience with automation tools and scripting languages, and a passion for building efficient, reliable, and elegant solutions in a dynamic environment. 
 
Key Responsibilities 

• Define, develop and support software test automation and infrastructure 

• Continuous improvement of test coverage, performance and speed 

• Break down complex systems into testable sub blocks 

• Play a vital role in raising the quality of software and identifying areas of risk 

• Create an easy-to-use interface for operations to run automation workflows 

• Cross-functional work across multiple teams to identify and root-cause improve processes 

 
 
Skills and Qualifications 

• B.S. degree or higher with 5+ years of professional software development experience. 

• At least 3+ years of collaborative development in Python. 

• Experience working with Git, Continuous Integration (Jenkins) and Agile development processes. 

• Proven ability to write maintainable, testable, production-quality code. 

• Comfortable working in Linux environments, including shell scripting and Make-based build systems. 

• Capable of working on remote systems, AWS instances and distributed systems 

 
 
Assets: 

• Experience working with remote systems, AWS instances, and distributed systems. 

• Familiarity with networking fundamentals and designing or testing scalable systems. 

• Working knowledge of C/C++, board bring-up, or firmware development. 

• Worked with Pytest or a similar test framework. 

• Experience interfacing with systems running Linux. 

• Ability to root cause failures across multilayer software/hardware stacks 

The base salary range for this position is $190,000 to $230,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.
 

Advanced Packaging Technologist & Lead 

We are seeking an accomplished Advanced Packaging Technologist & Lead to drive the development, integration, and deployment of next‑generation semiconductor packaging technologies. This role is critical in architecting and implementing advanced, high‑performance, and high‑density packaging solutions supporting cutting‑edge compute, AI, and heterogeneous integration platforms. 

Key Responsibilities 

Advanced Packaging Architecture & Development 

• Design and implement advanced semiconductor packaging technologies, including 2.5D/3D stacking, heterogeneous integration, high-bandwidth interconnects, and advanced power-delivery architectures. 

• Lead R&D in Chip-on-Wafer (CoW) and Wafer-to-Wafer (W2W) bonding approaches for high-density integration. 

• Develop and optimize solutions using silicon interposers, Through-Silicon Vias (TSVs), and multi‑layer RDL packaging to enable ultra‑high‑bandwidth and low‑latency connections. 

• Engineer advanced packaging structures using low‑CTE substrates, FLEX interconnects, and organic or ceramic substrate technologies. 

• Align internal architects and external partners to deliver manufacturable designs and steer our strategic technology direction. 

• Leverage simulation-driven design to reduce hardware iteration cycles and ensure first-pass success in complex architectures. 

Assembly, Materials, & Interconnect Technologies 

• Drive technology innovation in advanced buildup substrates, including designs with and without embedded dies. 

• Oversee flip-chip bonding processes using both solder balls and copper pillars. 

• Lead development of substrate embedding for silicon dies, capacitors, passives, and other active components. 

• Develop and refine advanced dicing methodologies (laser and mechanical saw) tailored for nanometer-class nodes. 

• Select materials; solder alloys, underfills, thermal interface materials (TIMs), and other key materials that enable high performance, manufacturability, and reliability 

Process Technology & Reliability 

• Manage package-level and board-level qualification, ensuring robust performance across thermal, mechanical, and electrical stress conditions 

• Lead analysis and improvements in solder reliability, including temperature cycling, electromigration (EM), and stress modeling. 

• Oversee ultra-thin die handling and processing for fragile, high-performance devices. 

• Drive backside metallization and RDL process development to support advanced packaging roadmaps. 

• Lead failure analysis when a new design fails a stress test and pivot the team toward a solution. 

Qualifications 

• BS EE, MS EE or equivalent engineering discipline 

• 10+ years of experience in advanced packaging 

• Highly preferred: working knowledge of simulation tools (i.e. Ansys, Cadence, Abaqus) 

 The base salary range for this position is $175,000 to $275,000 annually.  Actual compensation may include bonus and equity, and will be determined based on factors such as experience, skills, and qualifications.

About The Role

As a Senior Mechanical Engineer at Cerebras, you will lead the design of mechanical systems for our next-generation wafer-scale engine. Your responsibilities will include ensuring compliance with specifications, validating manufacturability, and delivering a high-quality product in a fast-paced environment—tackling some of the most challenging problems in the rapidly evolving AI space.

In this role, you will develop mechanical infrastructure for Cerebras’ custom hardware system.

• Rapidly iterate on designs and analysis to inform high level systems trades and steer overall product direction.
• Provide comprehensive support for environmental and performance testing on hardware, validating analyses, and ensuring compliance with design criteria.
• Ownership of technical deliverables within.
• Conduct first article inspections, functional analysis, identify and resolve issues.
• Collaborate across design-manufacturing-production, diagnostic and embedded software engineering teams, contractors and suppliers.
• Perform detailed structural analysis to engineer robust.

Responsibilities

• Work in a fast paced, high energy environment with short product development cycles on many challenging electro-mechanical projects.
• Drive and own all design aspects of electro-mechanical systems from concept to bring-up and production.
• Work with cross functional teams to gather all design requirements to lead the mechanical design, troubleshoot, and create & release all deliverables including drawings, BOMs, etc.
• Work closely with thermal engineers to solve mechanical challenges.
• Evaluate materials and components to meet performance, schedule and cost targets.
• Work closely with vendors to resolve any DFM/A issues quickly.

Requirements

• • 10+ years of experience as a Mechanical Design Engineer.
  • BS in Mechanical Engineering.
  • Strong analytical, diagnostic and problem-solving skills.
  • Very strong in 3D solids modeling CAD package, proficiency with Solidworks would be preferable.
  • Proficient with PLM system, such as Arena or Agile.
  • Proficient in CTF dimensioning and GD&T.
  • Must be able to do full Tolerance Analysis of complex systems and have working knowledge of FEA.
  • Great team player with strong interpersonal & communication skills.
  • Experience in electronic liquid cooling is a plus.
  • Must have in-depth knowledge of all latest fabrication processes; sheet metal, machining, die-casting, injection molding, and 3D printing.