Step into a career with ASM, where cutting edge technology meets collaborative culture. ​

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world.  Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.  

We're seeking a Senior Director, Account Technologist to join our team in Boise, Idaho. 

Job Responsibilities

• Lead DRAM, NAND, and advanced packaging technology engagement for key customer new products/applications penetration
• Drive and maintain roadmaps to ensure ASM is aligned to support customer requirements
• Engage customer proactively to build and manage relationships with key technology executives/decision makers
• Maintain application position with customer R&D and HVM teams (Ensure HVM feedback is accounted for in future defense of process wins and defend existing HVM applications won)
• Drive module process and equipment fundamental improvements to ensure we meet customer needs and win applications
• Define overall NPI program schedules, align on, and drive required execution plans and program deliverables to completion while meeting critical milestones (customer’s roadmap)
• Proactively identify talent and continuously develop team members with a deliberate roadmap
• Develop metrics to measure NPI program performance and to drive improvement through successive product introduction.
• Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience

Education & Experience:

• Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field.
• 15+ years (bachelor) or 12+years (M.S./Dr.) of experience in the semiconductor field, especially in Thin Film/PECVD/LPCVD/PEALD/tALD module process development. Tool vendor experience is plus.
• Strong project management and analytical skills
• Proven success in building collaborative partnerships with customers and internal organizations.
• Effective English oral and written communication skills
• Strong leadership qualities to exercise influence both throughout the organization and with BU/Service Team.
• Goal and customer oriented
• Positive and energetic attitude with strong work ethic and initiative

Job Responsibilities 

• Lead advanced packaging technology engagement for key customer new products/applications penetration. 
• To maintain sustain application position with customer R&D and HVM teams (Ensure HVM feedback is accounted for in future defense of process wins). 
• Drive module process and equipment fundamental improvements to ensure we meet customer needs and win applications. 
• Define overall NPI program schedules, align on, and drive required execution plans and program deliverables to completion while meeting critical milestones (customer’s roadmap) 
• Proactively identify talent and continuously develop team members with a deliberate roadmap. 
• Develop metrics to measure NPI program performance and to drive improvement through successive product introduction. 
• Build strong cross-functional and matrixed relationships and collaborate with Product Marketing, Product Development, Service Engineering, and others to ensure a positive customer experience. 

Education & Experience: 

• Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related field. 
• 15+ years(bachelor) or 12+years(M.S./Dr.) of experience in the semiconductor field, especially in Thin Film/PECVD/LPCVD/ALD module process development. Tool vendor experience is plus. 
• Strong project management and analytical skills. 
• Proven success in building collaborative partnerships with customers and internal organizations. 
• Effective English oral and written communication skills.
• Strong leadership qualities to exercise influence both throughout the organization and with BU/Service Team. 
• Goal and customer oriented.
• Positive and energetic attitude with strong work ethic and initiative. 

** This position is not eligible for visa sponsorship for external candidates. Candidates cannot require sponsorship now or in the future**

As a Field Service Engineer – Early Career, you’ll take on a hands-on role supporting ASM’s advanced semiconductor equipment and helping our customers keep their fabs running at peak performance. You’ll build real-world expertise through structured training, mentorship, and on-the-job learning while working directly with technologies that power AI, 5G, cloud computing, and next‑generation devices. This is your chance to apply your engineering background, strengthen your technical capabilities, and join a team that’s shaping the future of semiconductor innovation.

In this role, based in Boise, ID at our customer site, you’ll launch your engineering career at the center of cutting‑edge semiconductor manufacturing. It’s an ideal opportunity for early‑career engineers who want to put their education into practice in a high‑tech environment where every day brings something new to learn.

From your first day, you’ll receive training through hands‑on guidance from seasoned engineers onsite. You’ll work with vacuum systems, plasma, chemical delivery, robotics, sensors, advanced metrology, and complex hardware‑software interactions. Your contributions will have a direct impact on tool performance, system uptime, and customer success—playing a meaningful role in enabling leading‑edge logic technology nodes. This experience lays a strong foundation for rapid growth, technical mastery, and a variety of long‑term career paths within ASM.

Shift:

What You Will Be Working On 

• Support installation, maintenance, and repair of ASM semiconductor equipment at customer sites 
• Troubleshoot equipment and process issues with guidance from senior engineers 
• Deliver clear, timely, customer‑focused support with a strong safety mindset 
• Working in cleanroom environments while following strict safety and quality standards.
• Assist in identifying and contributing to continuous improvement efforts  
• Participate in customer escalations alongside experienced team members 

What We Are Looking For 

• Bachelor’s or master’s degree in Electromechanical Engineering, Electrical Engineering, Mechanical Engineering, or related field 
• Candidates who are hands-on and mechanically curious, energized by complex systems and real-world problem solving, Comfortable working in fast paced, hightech environments & motivated to build a long-term engineering career. 
• Internship, co‑op, senior design project, lab research, or hands‑on technical experience 
• Ability to read and interpret basic electronic and electromechanical schematics 
• Understanding of safety protocols and willingness to work in cleanroom environments 
• Strong problem‑solving mindset and eagerness to learn 
• Clear communication skills and a strong customer-service mindset 
• Ability to work independently and collaboratively 
• Willingness to travel domestically and internationally 
• Proficiency with Microsoft Office 

What Sets You Apart 

• Demonstrated commitment to safety, quality, and disciplined execution 
• Exposure to semiconductor processes, wafer fabs, robotics, vacuum systems, plasma, or gas handling 
• Experience writing technical documentation in school or project settings 
• Familiarity with customer‑facing or support roles (internships, tutoring, help desk, teamwork) 
• Interest in structured problem‑solving methods, statistical methods, data analysis. 
• Curiosity and learning orientation when working with advanced semiconductor technologies 
• Participation in engineering clubs, competitions, or technical student groups 

Why join ASM? 

2026 is the year to join ASM as a Field Service Engineer. Apply now! 

** This position is not eligible for visa sponsorship for external candidates. Candidates cannot require sponsorship now or in the future**

• Bachelor’s degree in Electromechanical Engineering or related field  
• 1–3 years of technical experience in field service, or manufacturing of OEM capital equipment
• Ability to read and interpret electronic and electromechanical schematics
• Basic knowledge of safety protocols and cleanroom guidelines
• Ability to apply rules and procedures in own activities
• Ability to fully understand tool architecture and control algorithms and explain operating principals to peers
• Clear written and verbal communication skills
• Ability to work independently and in a team
• Willing to travel as required for the role domestically and internationally
• Knowledge of safety procedures and cleanroom guidelines
• Proficiency with MS Office

Engineer II, Field Service

• Bachelor’s degree in Electrical, Mechanical, Electromechanical Engineering or related field with 4+ years of experience, or a Master’s degree with 0 years of experience
• Experience in field service or semiconductor capital equipment
• Ability to interpret electronic and electromechanical schematics
• Experience with structured troubleshooting methodologies
• Knowledge of cleanroom and semiconductor safety protocols
• Strong communication skills, both written and verbal
• Ability to work independently and within a team
• Willingness to travel domestically and internationally
• Proficiency with MS Office

What sets you apart

Engineer I, Field Service

• Semiconductor field service or capital equipment experience
• Knowledge of wafer fab operations, robotics, vacuum systems, plasma, or gas handling
• Experience writing procedures or process documentation
• Strong customer‑service mindset and organizational skills
• Familiarity with structured problem‑solving methods
• Experience supporting escalations or beta‑site activities

Engineer II, Field Service

• Hands‑on semiconductor field service experience
• Working knowledge of wafer fab operations, robotics, vacuum systems, plasma, RF, or gas handling
• Experience leading structured root‑cause analysis
• Experience providing field data to engineering or design teams
• Background supporting beta‑stage or early‑option tools
• Familiarity with structured problem‑solving techniques
• Strong customer‑service mindset and organizational skills