About the Role

You will own the factory execution layer that translates quality problems into implemented fixes at our supplier partners across Taiwan and Southeast Asia. You will build the supplier quality function — yield governance, CAPA discipline, field failure closure — and you will personally drive cross-product factory issues to closure on a defined timeline. The role carries authority to hold shipments and halt production for quality.

What You'll Do

• Cross-Product Factory Execution: Take full ownership of factory-side issues regardless of product line or supplier. Upon receiving a defined problem and proposed fix, drive the implementation through the supplier to verified closure. Translate engineering intent into floor-level action, replacing ambiguity with strict accountability and clear timelines.
• Quality Systems and Data Ingestion: Build yield and failure data infrastructure featuring automated threshold alerts and cross-product failure mode tracking. Lead the Production Data program and define required fields (yields, cycle times, retest rates, test coverage, defect Pareto). Partner with internal team to ingest data into our warehouse, replacing ad-hoc supplier reports with quality dashboards.
• Supplier Production Quality: Establish yield review cadence at each supplier. Drive PCBA yield, functional test yield, burn-in yield, and time-to-failure analysis. Chair weekly quality reviews with supplier leadership and hold production when quality evidence warrants.
• NPI Quality: Partner with HW Engineering on DFM and DFT reviews.
• CAPA and Corrective Action: Own the supplier CAPA program end-to-end. Drive root cause to evidence-backed closure with a focus on preventative action. Maintain a CAPA record that withstands ISO audit and IPO diligence.
• Field Failure Analysis: Close the loop from field returns to supplier corrective action. Partner with HW Engineering and third-party labs on failure analysis. Feed findings into design, process, and incoming inspection changes.
• Supplier Audits: Conduct on-site process audits at suppliers and critical sub-tier suppliers. Validate test equipment calibration, operator training, process adherence, and document control. Report findings in audit-grade format.
• Test Coverage and Test Log Governance: Define testing requirements, coverage levels, and data retention standards for each supplier. Identify and close gaps across stations and product lines.
• Strategic Foundation: Establish the data foundation for supplier scorecards, SBRs, and board-level quality reporting. Establish yield review cadence at all primary suppliers and close the open supplier CAPA backlog to audit-grade standard.

What You Bring 

• Five or more years in factory quality, supplier quality, manufacturing engineering, or factory operations roles at a hardware or electronics company.  
• Demonstrated track record of driving cross-functional manufacturing problems to implemented closure. Direct experience managing supplier or contract manufacturing quality in Taiwan and Southeast Asia.
• BS or MS in Electrical or Mechanical Engineering. Six Sigma Black Belt or equivalent formal training. Working knowledge of ISO 90001:2015, APQP, PPAP, 8D, and SPC.
• Native or fully fluent Mandarin, including reading and writing capability sufficient to review Chinese-language QC reports, work instructions, and supplier responses.  Professional English for US team communication, technical documentation, and executive presentation. 
• Electronics manufacturing depth: PCBA assembly, functional test, burn-in, box build.  Working knowledge of mechanical assembly processes and materials. Experience in imaging, IoT, wireless, access control, or adjacent connected hardware is preferred.
• Advanced data analysis skillset.
• Prioritize verified effectiveness over status updates; You hold suppliers and internal team to firm deadlines and deliverables. Serve as the primary point of contact for Engineering, Sourcing, and Supply Chain Management to resolve factory issues.
• Ability to travel 30% to supplier factory sites (primarily Taiwan, Vietnam, Thailand, with occasional travel to China). Occasional travel to US headquarters.

Bonus

• Master’s degree or MBA.
• Prior experience building a quality function in region.
• ASQ CQE, CQA, or CRE certification.
• Experience with security, surveillance, or access control hardware.
• Prior experience integrating supplier or factory data into a centralized data warehouse or analytics platform.

Taiwan Employee Benefits

Verkada is committed to fostering a workplace environment that prioritizes the holistic health and wellbeing of our employees and their families by offering comprehensive wellness perks, benefits, and resources. Our benefits and perks programs include, but are not limited to:

• Private medical insurance by Nan Shan Life Insurance
• Permanent employees of Verkada Taiwan are eligible for full participation to the group insurance scheme, including accidental death and dismemberment, critical illness, accident medical reimbursement, hospital and surgical, and cancer indemnity cover
• Spouses and immediate dependents are eligible to participate in the scheme for accident medical reimbursement, hospital and surgical, and cancer indemnity cover
• Paid parental leave policy & fertility benefits
• Time off to relax and recharge through our paid holidays, firmwide extended holidays, generous time off, and personal sick time
• Professional development stipend
• Wellness/fitness benefits
• Meal stipend
• Commuter benefits 

Additional Information 

• You must be independently authorized to work in Taiwan. We are unable to sponsor or take over sponsorship of an employment visa for this role, at this time.

Fractile is building silicon, systems and software which will redefine the frontier of AI: running the world’s most advanced models at radically higher speed and lower cost. We have an exceptional team across hardware and software capable of bringing about this change, and we are growing fast to meet demand and deliver our product at scale.

At this level of compute density and bandwidth, manufacturing precision is a competitive weapon. Yield, ramp velocity, and supplier performance are not operational details — they determine whether we win.

We are hiring a Senior Silicon Substrate & Packaging Manufacturing Engineer to own packaging manufacturing execution in Taiwan and drive our products from first silicon through high-volume production.

This is a high-accountability role with direct impact on the company's trajectory.

The Role

You will be Fractile’s senior manufacturing authority in Taiwan for substrate and package assembly.

You will:

• Own packaging yield and ramp performance.
• Lead manufacturing strategy with OSATs and substrate suppliers.
• Drive structured problem-solving under schedule pressure.
• Build scalable manufacturing discipline in a startup environment.

You are not coordinating — you are deciding, driving, and delivering.

What You’ll Own

Manufacturing Strategy & NPI Leadership

• Define packaging manufacturing readiness criteria from EVT through HVM.
• Lead NPI builds (EVT/DVT/PVT) with clear yield and quality targets.
• Identify scaling risks early (process capability, warpage, cycle time, substrate constraints).
• Influence package decisions based on manufacturability and ramp risk.

Yield & Excursion Leadership

• Own assembly yield targets and improvement roadmaps.
• Lead deep root-cause analysis across OSAT and substrate partners.
• Drive implementation and validation of permanent corrective actions.
• Establish data-driven monitoring (SPC, Cpk, excursion response frameworks).

Supplier Performance Management

• Act as the senior technical escalation point for OSAT and substrate vendors.
• Set performance expectations and hold partners accountable.
• Drive continuous improvement in:
• Yield
• Cycle time
• Process capability
• Cost structure
• Build strong working relationships while maintaining high standards.

Reliability & Production Robustness

• Own qualification execution and reliability closure.
• Ensure packaging robustness under high current density and AI workloads.
• Drive failure analysis across material, assembly, and process domains.
• Prevent repeat escapes by strengthening process controls.

Ramp to High Volume

• Define ramp plans and yield maturation curves.
• Track ramp health and escalate risk to leadership early.
• Partner with supply chain to mitigate substrate and capacity risks.
• Lead post-ramp cost-down and yield stabilization initiatives.

What We’re Looking For

• 8+ years in semiconductor packaging manufacturing or product engineering.
• Proven experience ramping complex FC-BGA or advanced packages to volume.
• Deep understanding of:
• Flip-chip assembly flows
• Large body substrate warpage control
• Underfill and reliability interactions
• Assembly defect pareto analysis
• SPC and process capability metrics
• Strong track record working directly with Taiwan OSATs and substrate vendors.
• Demonstrated ownership of yield improvement programs.

Strong Plus

• Experience with large AI / HPC ASICs.
• Exposure to 2.5D or high-bandwidth memory packaging.
• Experience ramping first-generation silicon in a startup or fast-scaling environment.
• Fluent Mandarin and English.

What Senior Means at Fractile

At Fractile, “Senior” means:

• You operate independently.
• You escalate before problems become crises.
• You make principled tradeoffs between performance, yield, cost, and schedule.
• You can walk into a supplier factory, diagnose issues, and drive alignment.
• You think beyond the build in front of you and design systems that scale.

Why This Role Is Critical

Packaging yield and ramp speed directly impact revenue, customer commitments, and strategic momentum.

This role ensures:

• First silicon does not stall.
• Ramp is predictable.
• Suppliers perform at our standard.
• Manufacturing becomes a competitive advantage.

If you perform well in this role, you will shape how Fractile scales its hardware globally.

About us

• Founded in 2022, team of 70+, which is expanding rapidly
• Modern, open offices in London and Bristol
• Collaborative, problem-solving culture built on deep curiosity, entrepreneurial initiative and technical fluency

Export control and security clearance

Certain roles may involve working on technologies subject to export restrictions. Applicants may be required to undergo additional eligibility checks to ensure compliance with applicable law.

Fractile is building silicon, systems, and software which will redefine the frontier of AI: running the world’s most advanced models at radically higher speed and lower cost. We have an exceptional team across hardware and software capable of bringing about this change, and we are growing fast to meet demand and deliver our product at scale.

About Fractile

Fractile is building next-generation AI compute infrastructure designed to dramatically improve performance-per-watt and unlock new efficiency frontiers for large-scale inference. Our hardware pushes the boundaries of high-speed design, power density, and system integration.

We are looking for a PCBA Product Engineer to help industrialise our advanced AI accelerator boards and scale production with world-class manufacturing partners in Taiwan.

This is a critical, high-ownership role at the core of our hardware execution strategy.

The Role

You will take complex, high-performance PCBAs from prototype through mass production — working at the intersection of hardware design, manufacturing engineering, and supplier execution.

This role requires deep experience with:

• High-layer-count, high-speed boards
• Advanced PCB stackups
• Fine-pitch BGA assembly
• High-current power delivery
• Taiwan-based PCB fabs and SMT partners

You will not only execute builds — you will shape how Fractile scales hardware manufacturing.

What You’ll Do

1. Drive AI Board Industrialisation

• Own PCBA readiness from EVT → DVT → PVT → MP.
• Lead DFM / DFA / DFT reviews for high-speed AI accelerator boards.
• Partner with design engineering to proactively eliminate manufacturability risk.
• Support board bring-up and rapid iteration cycles.

1. Work Closely with Taiwan Manufacturing Partners

• Validate SMT process windows for fine-pitch, high-thermal-mass components.
• Be physically present during builds to drive real-time issue resolution.
• Ensure strong process control and ramp readiness.

1. Own Yield and Quality Metrics

• Drive first-pass yield (FPY) and DPPM improvements.
• Lead structured root cause analysis (8D, RCCA).
• Support reliability validation (thermal cycling, power cycling, environmental stress).

1. Build Scalable Manufacturing Systems

• Establish documentation, control plans, and ECO processes appropriate for a scaling startup.
• Improve traceability and production data visibility.
• Partner with supply chain on cost-down and second-source strategy.

What We’re Looking For

Required Experience

• 5+ years in PCBA Product Engineering, NPI, or Manufacturing Engineering.
• Experience industrialising complex, high-density PCBAs.
• Strong knowledge of:
• 12+ layer stackups
• Controlled impedance
• HDI (blind/buried vias)
• Fine-pitch BGA assembly
• High-power board considerations
• Hands-on factory experience with Taiwan PCB fabs and SMT partners.
• Fluent Mandarin and English.

Strongly Preferred

• Experience with AI accelerators, GPUs, server boards, or high-performance compute.
• Exposure to high-speed interfaces (PCIe, DDR, high-current rails).
• Experience scaling from prototype to volume production.
• Startup or fast-growth hardware environment experience.

Who You Are

• You take full ownership of outcomes, not just tasks.
• You are comfortable on the factory floor solving problems in real time.
• You think systematically but move quickly.
• You identify risks before they become production issues.
• You thrive in high-performance, technically rigorous environments.

What Success Looks Like at Fractile

• Smooth NPI transitions with minimal yield loss.
• Strong first-pass yield at ramp.
• Reduced DFM escapes before production freeze.
• Tight collaboration between design and manufacturing.
• Manufacturing processes that scale as Fractile scales.

About us

• Founded in 2022, team of 70+, which is expanding rapidly
• Modern, open offices in London and Bristol
• Collaborative, problem-solving culture built on deep curiosity, entrepreneurial initiative and technical fluency

Export control and security clearance

Certain roles may involve working on technologies subject to export restrictions. Applicants may be required to undergo additional eligibility checks to ensure compliance with applicable law.

Astera Labs is a global leader in purpose-built connectivity solutions that unlock the full potential of AI and cloud infrastructure. Our Intelligent Connectivity Platform integrates PCIe®, CXL®, and Ethernet semiconductor-based solutions and the COSMOS software suite of system management and optimization tools to deliver a software-defined architecture that is both scalable and customizable. Inspired by trusted relationships with hyperscalers and the data center ecosystem, we are an innovation leader delivering products that are flexible and interoperable. Discover how we are transforming modern data-driven applications at www.asteralabs.com.

Job Summary

We are seeking a student intern to drive product quality improvements across both Astera Lab’s semiconductor and board-level products. In this role, the candidate will perform failure analysis for customer returns. The candidate will also compile 8D reports to communicate the analysis findings to the customers.

Key Responsibilities

· Perform system-level test for the customer returns on a bench in the lab.

· Review ATE test log files.

· Work with third-party labs to perform electrical FA (EFA) for more in-depth analysis.

· Log analysis results to the portal system daily.

· Work with internal teams and suppliers to drive product quality improvements.

· Write up analysis reports to provide updates to the customers. Participate in the meetings with customers to present the technical findings.

· Bring up and validate new test equipment in the lab. Update the lab inventory list.

· Perform additional tasks assigned by the Director of Field Quality Engineering.

Education & Experience

· Final year students from Bachelor’s degree are welcome to apply.

· Students from Master’s degree are preferred.

Technical Skills

· Good knowledge of IC fabrication, packaging, board assembly (SMT), and test processes

· Strong communication skills in English and Mandarin.

Working Conditions:

· May require occasional travel to customer sites within Taiwan.

· Must be flexible to work on-site and available during business hours for at least 3 days per week.

We know that creativity and innovation happen more often when teams include diverse ideas, backgrounds, and experiences, and we actively encourage everyone with relevant experience to apply, including people of color, LGBTQ+ and non-binary people, veterans, parents, and individuals with disabilities.

What You'll Do

• Drive new products from initial proof of concept through to mass production
• Generate mechanical solutions for a wide variety of product requirements relevant to enterprise hardware (mounting, sealing, environmental resistance, thermals, tamper resistance, audio systems etc.)
• Collaborate with our Electrical Engineering team to integrate PCBAs, sensors, interconnects, and other electro-mechanical elements into your designs
• Collaborate with our Industrial Design team to explore, prototype, test new product concepts, and finalize product form and CMF
• Work with mechanical vendors to dial in DFM/DFA, then quote & kick-off parts at prototype and production quantities
• Own tooling release, bring up, and validation for a broad variety of parts & processes
• Develop, manage & execute mechanical reliability test plans and various DoEs
• Assist with failure analysis and root cause analysis; troubleshoot, iterate, and validate quickly  
• Work closely with our JDM and CM partners to steer your product concepts through validation builds (EVT, DVT, PVT) & into mass production
• Drive on-site factory troubleshooting, assembly line bring-up, and root cause analysis
• Outdoor product design experience (IP66/67, IK08/10)

What You'll Bring

• B.S. in Mechanical Engineering or related fields
• Excellent written and verbal English & Mandarin communication skills
• A clear track record of designing and manufacturing enterprise or consumer electronic products (8+ years of experience)
• Mastery of 3D CAD software
• Experience getting hands-on with building & testing hardware
• Ability to frequently visit vendors throughout Taiwan and Southeast Asia 
• Experience working with part vendors on DFM, tooling bring up and validation
• Passion for designing aesthetically pleasing but easy to use hardware

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com.

Job Description:

We are seeking an experienced leader to drive Supplier / Manufacturing Quality Engineering to anchor our global supplier quality efforts across both Astera Lab’s semiconductor and board-level products. In this role, candidates will drive leading supplier quality across key manufacturing partners including IC fabs, OSAT’s, and PCB/PCBA vendors. A strong foundation in supplier quality engineering, uniquely paired with experience in advanced data analytics (including AI and machine learning) for predictive quality, risk assessments, and product quality analytics will be highly valuable to this role.

Responsibilities:

Supplier Quality Management

· Nurture winning partnerships across all our strategic manufacturing suppliers: semiconductor wafer fabs, advanced packaging & test (OSAT), boards & assemblies (PCB / PCBA / SMT), substrates / interposers, probe cards, and passive components.

· Develop robust supplier selection and onboarding processes in collaboration with Design, Procurement, Business & Engineering Operations teams.

· Define, build, and manage the systems to collect the data (KPI’s) needed to track supplier performance and drive continuous improvement.

· Audit to assess the effectiveness of supplier process controls, manufacturing capabilities, and overall quality management system.

· Coach suppliers by sharing your deep manufacturing experience and knowledge.

· International travel as needed, potentially on short notice. There is no minimum amount but prepare to accommodate up to 20%.

Advanced Data Analytics & AI/ML

· Create data collection methods to enable product and supplier advanced data analytics needed for monolithic, chiplet, and board products. Data sources will include manufacturing inline controls, production test (including data collection from advanced embedded agents), and failure analysis activities.

· Leverage data into quality models & methods to predict product quality issues and supply chain risks.

· Integrate AI/ML tools into quality systems and dashboards (e.g., outlier screening, automated defect detection, trend analysis, real-time alerts).

· Experience with AI/ML tools is a plus but not required; ability to work with technical partners on model development is key.

Cross-functional Collaboration

· Interface with R&D, NPI, product engineering, ops and other engineering teams to provide supplier input into product design and DFX.

· Support early supplier involvement and ensure quality requirements needed for manufacturability & testability are achieved, and learnings are propagated appropriately to other products in production & development.

· Represent supplier quality as needed in line failure reviews, excursion management, material reviews (MRB), and CAPA processes.

· Partner with engineering and manufacturing teams to conduct quarterly engineering reviews, evaluate supplier changes (PCN), and assess supplier risks.

· With engineering engagement, lead quality audits, and corrective action activities using tools such as 8D, 5-why, and FMEA.

Education & Experience

· Bachelor’s or Master’s degree in Engineering or equivalent experience.

· 8+ years of career progression in supplier quality engineering in the semiconductor and/or board-level electronics industry.

· 3+ years direct experience working embedded within a high-volume advanced manufacturing operation in an engineering role.

· Experience with supplier development in Asia with global manufacturing supply chains.

· Six Sigma or ASQ certification a plus

Technical Skills

· Strong knowledge of IC fabrication, packaging (including chiplet), board assembly (SMT), and test processes.

· Familiarity with reliability qualification methodologies in the application of IPC, Telcordia, JEDEC requirements.

· Proficiency with quality engineering tools (FMEA, APQP, PPAP, SPC, OE, etc.).

· Experience using analytics tools (e.g., JMP, SQL, Excel) to support quality insights. Exposure to AI/ML frameworks is a plus, but not required.

· Fluent in English and Mandarin

Overview

Join our team as a Hardware Technical Program Manager (TPM), where you will be at the forefront of managing hardware and system integration within cutting-edge consumer wearabloe products. With your expertise in technology innovation, you will guide hardware subsystems through the complete product lifecycle—from sourcing and integration to testing and optimization—ensuring groundbreaking product development and delivery.

Responsibilities

• Oversee the integration and testing of hardware and system products, ensuring compliance with project timelines and technical specifications.
• Drive innovation and development efforts in subsystems such as camera, audio, and electrical engineering (EE)/product design (PD), staying ahead of industry trends.
• Conduct and manage project meetings, leading initiatives from initial concept to final completion.
• Coordinate sourcing of system components, collaborating with vendors to secure essential hardware.
• Lead efforts in performance optimization to improve product quality and user experience across domains like EE, mechanical engineering (ME)/PD, camera, audio, and testing.
• Oversee workflows and manage deliverables with contract manufacturers, developing risk mitigation strategies.
• Develop and maintain detailed project documentation, including schedules, issue tracking, and status updates.

Minimum Qualifications

• 3+ years of experience as a Technical Program Manager in the hardware/electrical engineering (EE)/product design (PD) field, managing hardware programs from concept to mass production, including Final Assembly Testing and Packaging (FATP).
• Bachelor's degree in a technical discipline such as computer science, computer engineering, or a related field.
• Proven experience with FATP and managing projects involving EE, PD/ME, and testing.
• Demonstrated competency in fast-paced environments with the ability to perform under pressure.
• Experience collaborating with contract manufacturers and Joint Design Manufacturer (JDM)/Original Design Manufacturer (ODM) suppliers for components like camera, wireless, and audio.
• Communication skills in both English and Mandarin.
• Proficiency in data analytics, utilizing tools to construct dashboards.

Preferred Qualifications

• 5+ years of experience in hardware EE/PD system integration as a Technical Program Manager.
• Deep understanding of the requirements and development process for creating consumer electronics.
• Experience in developing 0-to-1 products working with both JDM and CM vendor engagement models.
• Familiarity with critical consumer device technologies such as wireless, camera, and audio.
• Project Management Professional (PMP) or Project Management Institute (PMI) certification is preferred.

In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead assembly process integrator. Your responsibilities will include developing assembly & test process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with silicon and system architects to define package architectures by incorporating manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly, test and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.

Responsibilities: 

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry, OSATs and Test vendors.
• Develop package architectures that prioritize Design for Test (DFT), Design for Manufacturing (DFM), and Design for Reliability (DFR). This is critical for achieving product landing zones while simultaneously meeting performance and cost targets.
• Define test chip requirements and manage test chip design required for 3D package assembly and test process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Required Qualifications:

• MS or PhD in Mechanical Engineering, Material Science, or related engineering field.
• Minimum of 10 years' hands-on experience in package assembly and test process development, specifically working with Outsourced Semiconductor Assembly and Test (OSAT) providers.
• Knowledge of Chip-on-wafer process flow, materials, and equipment requirements.
• Experience in test chip and assembly test vehicle design.
• Understanding of photonics packaging requirements including various fiber attach methods.
• Knowledge of 2D/3D packaging technologies and exposure to thermo-mechanical challenges associated with these technologies.
• Must be based in Taiwan.
• Fluent in both English and Mandarin Chinese, with the ability to confidently lead high-stakes meetings in either language.

Preferred Qualifications:

• Excellent communication skills, with the ability to convey complex technical concepts to both technical and non-technical stakeholders.
• Strong project ownership, with a history of driving results independently and with minimal supervision.
• Proven track record of developing creative solutions for complex technical challenges.

Scope  

As the Staff Applications Software Engineer, Zephyr at Ambiq, you will drive the development and testing of Ambiq’s Zephyr software offering. This includes porting new Ambiq SoCs to the Zephyr environment and enabling hardware evaluation platforms, staying up-to-date with the latest Zephyr developments and maintaining Ambiq SoC compliance, building new samples and drivers, and driving power optimizations to best showcase our ultra-low power technology. 

This role will work within our Applications Engineering Team and will work closely with the global MCU software team.  

 The successful candidate should be a fast-learning, result-driven, and self-motivated team player with an “always learning” mindset. They should have an inquiring spirit and be comfortable in a lab environment and in executing hands-on debugging for embedded systems.  

 The person in this role will be responsible for leading Ambiq’s Zephyr software development and testing, coordinating with the global team to make improvements and fix customer issues, and representing Ambiq to the Zephyr technical steering committee and community with the help of Ambiq engineers and subject matter experts. 

Responsibilities 

• Lead the development, testing, and maintenance of Ambiq’s Zephyr offering, including sample, driver, and software testcase development, as well as hardware enablement.  

• Take a key role in Ambiq Zephyr repository processes and maintenance, including CI/CD. 

• Manage Ambiq Zephyr issue status tracking, debug, and resolution.  

• Collaborate with internal engineering teams to analyze and debug complex system level issues and develop software solutions. 

• Focus on demonstrating Ambiq’s low-power advantages to the greatest extent possible within the Zephyr ecosystem. 

• Create application notes and software guidelines.  

• Support applications and field engineers, and key customers as needed. 

Qualifications 

• MS in ECE or Computer Science and 6+ years of experience or BS ECE/CS with 8+ years of experience, with at least 3 years focusing on the Zephyr ecosystem; 

• Experience with ARM Cortex-M processors.  

• Deep understanding of Zephyr RTOS required. 

• Experience with developing embedded MCU code in C and assembly language on Arm Cortex-M Processors;   

• Experience working with MCU peripherals including SPI, I2C, UART, and USB. 

• Experience with at least one MCU IDE from ARM, Keil, IAR, Eclipse, Ozone or other; 

• Experience with security, Bluetooth, Matter/Thread, and/or machine learning models within the Zephyr ecosystem is a real plus. 

• Good hands-on experience on lab equipment such as oscilloscopes, logic analyzers etc. for debugging issues;  

• Experience with Jira, Confluence and collaboration tools;  

• Experience with source code control systems (git) required;   

• Understanding of software testing and test automation principles;  

• Excellent problem-solving skills dealing with complex system level issues related to HW/SW debug;  

• Experience with scripting languages required and python experience is specifically desirable;  

• Strong communication and documentation skills. 

POSITION SUMMARY:

Alarm.com (ADC) seeks an entry-level Assistant Engineer for Hardware System Testing. The Assistant Engineer will perform hands-on testing of hardware systems and components under the guidance of senior engineers. The role focuses on executing established test procedures, setting up and operating test equipment, recording accurate measurements, and reporting findings. This position ensures compliance with technical specifications, quality standards, and safety requirements on an on-going basis.

RESPONSIBILITIES: 

• Execute hardware product and system tests according to written procedures and instructions.
• Prepare, configure, and operate test equipment, fixtures, and instruments (e.g., multimeters, oscilloscopes, torque tools).
• Collect, record, and organize test data in specified formats.
• Report visual, mechanical, or electrical defects observed during testing to the supervising engineers.
• Assist in troubleshooting assembly and hardware issues during test execution.
• Maintain the cleanliness, safety, and organization of laboratory or workshop test areas.
• Follow calibration requirements and safe handling procedures for all equipment.
• Comply with Environment, Health, and Safety (EHS).

QUALIFICATIONS: 

• Bachelor's degree in Electrical Engineering, Electronics, or Mechanical Engineering.
• 0–2 years in hardware product/system testing, electronics testing, or laboratory work.
• Familiarity with basic electrical and mechanical measurement tools.
• Ability to follow technical instructions with precision.
• Basic understanding of hardware systems and components.
• Strong attention to detail and accuracy in data recording.
• Good observation and problem-solving skills.
• Proficiency in various application software such as Excel and PowerPoint for effective communication on subject matters with various stakeholders.
• Professional written, verbal, and presentation skills in English and in Chinese with the ability to effectively communicate with the stakeholders.

WHY WORK FOR ALARM.COM?

• Collaborate with outstanding people: We hire only the best. Our standards are high and our employees enjoy working alongside other high achievers.
• Make an immediate impact: New employees can expect to be given real responsibility for bringing new technologies to the marketplace. You are empowered to perform as soon as you join the Alarm.com team!
• Gain well rounded experience: Alarm.com offers a diverse and dynamic environment where you will get the chance to work directly with executives and develop expertise across multiple areas of the business.
• Focus on fun: Alarm.com places high value on our team culture. We even have a committee dedicated to hosting a stand-out holiday party, happy hours, and other fun corporate events.

COMPANY INFO

Alarm.com is the leading cloud-based platform for smart security and the Internet of Things. More than 7.6 million home and business owners depend on our solutions every day to make their properties safer, smarter, and more efficient. And every day, we’re innovating new technologies in rapidly evolving spaces including AI, video analytics, facial recognition, machine learning, energy analytics, and more.  We’re seeking those who are passionate about creating change through technology and who want to make a lasting impact on the world around them. 

For more information, please visit www.alarm.com.

Alarm.com is an Equal Opportunity Employer

In connection with your application, we collect information that identifies, reasonably relates to or describes you (“Personal Information”). The categories of Personal Information that we may collect include your name, government-issued identification number(s), email address, mailing address, other contact information, emergency contact information, employment history, educational history, criminal record, and demographic information.  We collect and use those categories of Personal Information about you for human resources and other business management purposes, including identifying and evaluating you as a candidate for potential or future employment or future positions, recordkeeping in relation to recruiting and hiring, conducting criminal background checks as permitted by law, conducting analytics, and ensuring compliance with applicable legal requirements and Company policies.  By submitting your application, you acknowledge that we may retain some of the personal data that you provide in your application for our internal operations such as managing our recruitment system and ensuring that we comply with labor laws and regulations even after we have made our employment decision.

JR105539

#LI-Hybrid

#LI-RC1

Job description

We are seeking a skilled professional with experience in or collaborating with electronics manufacturing environments. The ideal candidate will ensure efficient production processes and seamless coordination between teams.

Responsibilities

Develop and validate automated test programs and fixtures

Collaborate with contract manufacturers to optimize manufacturing processes and improve production efficiency

Provide training and guidance to contract manufacturers on the proper use of test equipment and fixtures

Assist in equipment maintenance and troubleshooting when needed

Troubleshoot and resolve manufacturing and testing issues related to production

Qualifications

Bachelor's degree in Computer Science, Electrical Engineering or related field

More than 3 years experience working in or with an electronics manufacturing facility

Strong understanding of SMT/DIP processes, system assembly, functional and burn-in test

Skills

Basic knowledge in network protocols

Experience in developing and debugging applications in embedded Linux is a plus

Programming languages: Python, C/C++, Java, Shell Scripting, SQL

#LI-Taiwan

#LI-NR5

We are seeking skilled professional to reside in ODM/EMS, closely monitor manufacturing operations to ensure products are of highest quality and reliability.

Responsibilities

• Identify manufacturing quality issues including IQC, SMT, DIP, Assembly, OQC, RMA and work closely with supplier in analysis and corrective actions.
• Analyze key quality performance indicators, identify areas of improvement (product design, manufacturing process, equipment and/or the QMS), lead continuous improvement by applying relevant methods.
• Manage RMA issues, perform failure analyses in depth; coordinate with design team and suppliers to implement resolutions.
• Maintain/augment on-going quality mechanisms such as OOBA (Out of Box Audit), AQL, KPI.
• Conduct supplier audits and score board process.
• Establish/drive quality initiatives to achieve continuous reduction in defect rate and RMA cost.

Requirements:

• BS/MS in Engineering
• 8 years of related experience in industry grade product system manufacturing process such as PCB, PCBA, SMT, DIP, Design for Manufacturing.
• 5 years of failure analysis experience with sound knowledge of failure investigation process
• Knowledge of quality process such as DVT (Design Verification Testing), ORT (On-Going Reliability Testing), demonstrated MTBF.
• Working knowledge of x86, embedded CPU architecture, or networking systems
• ECR/ECN process, BOM structure in Agile or equivalent document control system.
• Quality Engineering: IQC, OQC, Lean Six Sigma, Kaizen, statistical methods
• Certificate or working knowledge of Quality Systems

 #LI-Taiwan

#LI-Onsite

#LI-NR5

Scope  

As the Staff Engineer, System Test at Ambiq, you will drive the development and execution of system-level tests to improve design coverage and measure system performance for ARM Cortex-M4, Cortex-M55, DSP and NPU-based platforms. You will also engage in deep-dive debugging across multiple layers, from high-level system behavior to low-level firmware and driver code and hardware blocks, to ensure optimal integration, reliability, and performance.    

 This role will work closely with global MCU software, validation, and architecture teams, collaborating closely with SoC design engineers, firmware developers, and hardware teams to define and execute comprehensive test and validation plans for MCU-based platforms.    

 The successful candidate will be a proactive, detail-oriented engineer with strong problem-solving skills, comfortable working across hardware and software boundaries. They will thrive in an environment that values technical excellence, effective cross-team collaboration, and continuous learning. 

 The person in this role will define, design and implement test cases for the SDK primarily using C, architected for automation using Ambiq’s automation framework – primarily using Python, validate system functionality and performance, perform in-depth debugging of MCU subsystems including Fabrication, DMA, and peripherals, and provide technical leadership in system test methodology and automation. 

Responsibilities 

• Plan, develop, and execute system-level test strategies for ARM Cortex-M4, Cortex-M55, DSP, and NPU-based platforms. 

• Design and implement firmware test frameworks to validate system functionality, performance, and reliability across multiple integration layers. 

• Develop, maintain, and execute embedded test cases for the SDK using primarily using C and assembly. 

• Develop, maintain, and execute automation using Python or other scripting languages 

• Measure, analyze, and report on system performance metrics, identifying bottlenecks and recommending optimizations. 

• Debug and resolve complex issues spanning from application-level interactions to low-level firmware, drivers, and hardware interfaces. 

• Collaborate with architecture, hardware, and software teams to define test requirements and acceptance criteria. 

• Support pre-silicon validation on FPGA/emulation platforms as well as post-silicon bring-up, validation, and debugging. 

• Contribute to continuous improvement of test methodologies, tools, and workflows. 

• Mentor and guide junior engineers in system testing, embedded development, and automation best practices.  

Qualifications 

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field.  

• 8+ years of experience in embedded system-level testing, validation, or embedded system development, preferably on ARM Cortex-M architectures. 

• Proficiency in C/C++ and Assembly programming for embedded targets. 

• Strong understanding of MCU architecture, including DMA, memory hierarchy, peripheral interfaces, and interrupt handling. 

• Knowledge of embedded RTOS concepts (FreeRTOS, Zephyr, etc.) preferred. 

• Strong Python programming skills for test automation and data analysis. 

• Experience working at system OEMs and performing system-level debugging is preferred. 

• Familiarity with hardware bring-up, schematic/block diagram reading, and interface validation is highly desirable. 

• Strong debugging skills using oscilloscopes, logic analyzers, and other lab equipment. 

• Familiarity with MCU peripherals such as display, audio, and wireless interfaces is a strong plus.

• Excellent problem-solving skills, able to work independently and manage multiple priorities. 

• Strong communication skills and ability to work effectively in cross-functional teams.